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quality Lead Free RoHS Compliant Glass Passivated Bridge Rectifiers FUXINSEMI GBU410 with Solderable Terminals factory
quality Lead Free RoHS Compliant Glass Passivated Bridge Rectifiers FUXINSEMI GBU410 with Solderable Terminals factory

Lead Free RoHS Compliant Glass Passivated Bridge Rectifiers FUXINSEMI GBU410 with Solderable Terminals

Key Attributes
Model Number: GBU410
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
150A
Operating Junction Temperature Range:
-55℃~+150℃
Voltage - Forward(Vf@If):
1.1V@4A
Current - Rectified:
4A
Voltage - DC Reverse(Vr):
1kV
Mfr. Part #:
GBU410
Package:
GBU
Product Description

Product Overview

The GBU4005 THRU GBU410 series are Glass Passivated Single Phase Bridge Rectifiers designed for applications ranging from 50V to 1000V. These rectifiers are recommended for non-automatic applications and are ideal for saving space on printed circuit boards. They are also applicable for automatic insertion. The product features a reliable, low-cost construction utilizing molded plastic technology and glass-passivated chip junctions. Lead-free parts meet RoHS requirements, with a suffix "-H" indicating Halogen-free options. The epoxy is UL94-V0 rated flame retardant.

Product Attributes

  • Brand: Fuxinsemi
  • Product Type: Glass Passivated Single Phase Bridge Rectifiers
  • Case Material: Molded plastic, GBU
  • Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
  • Polarity: Marked on body
  • Mounting Position: Any
  • Certifications: Lead-free parts meet RoHS requirements; Suffix "-H" indicates Halogen free parts.
  • Flame Retardant: Epoxy UL94-V0 rated

Technical Specifications

Type Number Symbol Rating Units Typical Values
GBU4005 THRU GBU410 VRRM 50, 100, 200, 400, 600, 800, 1000 V
VVRWM 50, 100, 200, 400, 600, 800, 1000 VDC
VVRMS 35, 70, 140, 280, 420, 560, 700 V
IF(AV) 4.0 A @ TC = 90C (Note 1)
IFSM 150 A 8.3ms Single half sine-wave (JEDEC Method)
VFM 1.1 V @ IF = 2.0A per element
IR 5.0, 200 uA @ TJ = 25C (Rated DC Blocking Voltage); @ TJ = 125C
GBU4005 THRU GBU410 TJ, TSTG -55 to +150 C
RJA 35 C/W Mounted on glass epoxy PC board with 1.3mm solder pad (Note 2)
RJC 5.0 C/W
GBU4005 I2t 93.37 A2s Rating for fusing (t < 8.3ms)
GBU4005 THRU GBU410 Vids 2500 V Dielectric Strength
GBU4005 THRU GBU410 Tor 5.0 Kgf.cm Max torque
GBU4005 THRU GBU410 JC 4.2 pF Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C. (Note 2)

Soldering Conditions

Reflow soldering:

  • Average ramp-up rate (TL to TP): <3 C/sec
  • Preheat - Temperature Min (Tsmin): 150 C
  • Preheat - Temperature Max (Tsmax): 200 C
  • Preheat - Time (ts) (min to max): 60~120 sec
  • Ramp-up Rate (Tsmax to TP): <3 C/sec
  • Time maintained above: TL = 217 C
  • Time (tL): 60~260 sec
  • Peak Temperature (TP): 255 +0/-5 C
  • Time within 5 C of actual Peak Temperature (tP): 10~30 sec
  • Ramp-down Rate: <6 C/sec
  • Time 25 C to Peak Temperature: <6 minutes

Storage environment: Temperature = 5~40 C, Humidity = 55%25%


2010151636_FUXINSEMI-GBU410_C880913.pdf

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