Surface mount device assembly component FUXINSEMI MBRB41H100CTT4G-FS featuring detailed reflow soldering thermal profiles

Key Attributes
Model Number: MBRB41H100CTT4G-FS
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
350A
Reverse Leakage Current (Ir):
100uA@40V
Operating Junction Temperature Range:
-55℃~+150℃
Voltage - DC Reverse (Vr) (Max):
100V
Diode Configuration:
1 Pair Common Cathode
Voltage - Forward(Vf@If):
830mV@20A
Current - Rectified:
40A
Mfr. Part #:
MBRB41H100CTT4G-FS
Package:
TO-263(D2PAK)
Product Description

Product Overview

The MBRB41H100CTT4G-FS is a component designed for electronic applications. It is presented with detailed soldering conditions and suggested thermal profiles for reflow soldering processes, indicating its use in surface-mount device assembly. The product is associated with Fuxinsemi.

Product Attributes

  • Brand: Fuxinsemi

Technical Specifications

Specification Value
Model MBRB41H100CTT4G-FS
Soldering Conditions (Reflow Soldering)
Average ramp-up rate (Tsmin to Tsmax) < 3 C/sec
Preheat - Temperature Min (Tsmin) 150 C
Preheat - Temperature Max (Tsmax) 200 C
Preheat - Time (tsmin to tsmax) 60~120 sec
Ramp-up Rate (Tsmax to TL) < 3 C/sec
Time maintained above: Temperature (TL) 217 C
Time maintained above: Time (tL) 60~260 sec
Peak Temperature (TP) 255 C
Time within 5 C of actual Peak Temperature (tP) 10~30 sec
Ramp-down Rate < 6 C/sec
Time 25 C to Peak Temperature < 6 minutes
Storage Environment
Temperature 5 ~ 40 C
Humidity 55% 25%

2512291555_FUXINSEMI-MBRB41H100CTT4G-FS_C7422635.pdf

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