Surface Mount Bridge Rectifier FUXINSEMI KMB16F with Molded Plastic Case and Solder Plated Terminals
Product Overview
The Fuxin KMB12F THRU KMB120F series are 1.0A Surface Mount Schottky Barrier Single-Phase Bridge Rectifiers, designed for efficient power conversion. These rectifiers offer surge overload ratings up to 30 amperes peak and a 1.0A rating in a low-profile surface mount mini-dip bridge, saving valuable space on printed circuit boards. Ideal for automated replacement, they feature reliable, low-cost construction utilizing molded plastic technology. Lead-free parts meet RoHS requirements.
Product Attributes
- Material: Silicon epitaxial chip, metal silicon junction
- Flame Retardant: Epoxy UL94-V0 rated
- Case: Molded plastic, MBF
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: Marked on body
- Mounting Position: Any
- Certifications: Lead-free parts meet RoHS requirements
Technical Specifications
| Parameter | Symbol | Units | KMB12F | KMB14F | KMB16F | KMB110F | KMB115F | KMB120F |
|---|---|---|---|---|---|---|---|---|
| Maximum repetitive peak reverse voltage | VRRM | V | 20 | 40 | 60 | 100 | 150 | 200 |
| Maximum RMS voltage | VRMS | V | 14 | 28 | 42 | 70 | 105 | 140 |
| Maximum DC blocking voltage | VDC | V | 20 | 40 | 60 | 100 | 150 | 200 |
| Maximum average forward rectified current at TL(see fig.1) | I(AV) | A | 1.0 | 1.0 | 1.0 | 1.0 | 1.0 | 1.0 |
| Peak forward surge current 8.3ms single half sine-wave superimposed on rated load | IFSM | A | 30.0 | 30.0 | 30.0 | 30.0 | 30.0 | 30.0 |
| Maximum instantaneous forward voltage at 1.0A | VF | V | 0.55 | 0.55 | 0.55 | 0.55 | 0.92 | 0.92 |
| Maximum DC reverse current TJ=25C at rated DC blocking voltage | IR | mA | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 |
| Maximum DC reverse current TJ=100C at rated DC blocking voltage | IR | mA | 10.0 | 10.0 | 10.0 | 10.0 | 10.0 | 10.0 |
| Typical junction capacitance (NOTE 1) | CJ | pF | 28 | 28 | 28 | 28 | 28 | 28 |
| Typical thermal resistance (NOTE 2) | RJA | C/W | 75 | 75 | 75 | 75 | 75 | 75 |
| Operating junction temperature range | TJ, TSTG | C | -55 to +150 | -55 to +150 | -55 to +150 | -55 to +150 | -55 to +150 | -55 to +150 |
| Storage temperature range | TJ, TSTG | C | -55 to +125 | -55 to +125 | -55 to +125 | -55 to +125 | -55 to +125 | -55 to +125 |
Dimensions (MBF Package):
- A: 0.197(5.0)
- B: 0.181(4.6)
- C: 0.063(1.6)
- D: 0.047(1.2)
- E: 0.157(4.0)
- F: 0.142(3.6)
- G: 0.043(1.1)
- H: 0.027(0.7)
- I: 0.276(7.0)
- J: 0.260(6.6)
- K: 0.014(.35)
- L: 0.006(.15)
- M: 0.071(1.8)
- N: 0.030(0.75)
- O: 0.018(0.45)
- P: 0.106(2.7)
- Q: 0.09(2.3)
Soldering Conditions:
- Storage Environment: Temperature = 5 ~40C, Humidity = 55%25%
- Reflow Soldering:
- Average ramp-up rate(Tsmin to Tsmax): <3C/sec
- Preheat Temperature (Tsmin): 150C
- Preheat Temperature (Tsmax): 200C
- Time (ts from Tsmin to Tsmax): 60~120sec
- Ramp-up Rate (Tsmax to Tp): <3C/sec
- Time maintained above TL: 60~260sec (TL = 217C)
- Peak Temperature (Tp): 255C (0/5C)
- Time within 5C of actual Peak Temperature (tp): 10~30sec
- Ramp-down Rate: <6C/sec
- Time 25C to Peak Temperature: <6minutes
2011091105_FUXINSEMI-KMB16F_C915618.pdf
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