Schottky Barrier Rectifier 30V 5A FUXINSEMI FCMS04 RoHS Directive Compliant Halogen Free Plastic Body
Key Attributes
Model Number:
FCMS04
Product Custom Attributes
Reverse Leakage Current (Ir):
300uA@30V
Non-Repetitive Peak Forward Surge Current:
120A
Diode Configuration:
Independent
Operating Junction Temperature Range:
-55℃~+150℃
Voltage - DC Reverse (Vr) (Max):
30V
Voltage - Forward(Vf@If):
450mV@5.0A
Current - Rectified:
5A
Mfr. Part #:
FCMS04
Package:
SOD-128
Product Description
Product Overview
The FCMS04 30V 5.0A Schottky Barrier Rectifier is designed for surface-mounted applications, offering low forward voltage (Low VF) and high forward surge current capability. Its plastic body meets UL Flammability Classification 94V-0 and is ideal for automated placement with built-in strain relief. This rectifier features a metal silicon junction for majority carrier conduction, resulting in low power loss and high efficiency. It is compliant with RoHS Directive 2011/65/EU and Halogen-free standards, making it suitable for various industrial applications requiring reliable and efficient rectification.
Product Attributes
- Brand: Fuxinsemi
- Package Type: JEDEC SOD-128
- Material: Molded plastic body
- Flammability Classification: UL 94V-0
- Certifications: RoHS Directive 2011/65/EU, Halogen-free
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: Color band denotes cathode end
- Mounting Position: Any
Technical Specifications
| Symbol | Parameter | Conditions | MIN. | TYP. | MAX. | UNIT |
|---|---|---|---|---|---|---|
| VRRM | Repetitive peak reverse voltage | 30 | V | |||
| VRMS | RMS voltage | 20 | V | |||
| VR | Continuous reverse voltage | 30 | V | |||
| IF(AV) | Forward rectified current | See Fig.2 | 5.0 | A | ||
| IFSM | Forward surge current | 8.3ms single half sine-wave (JEDEC method) | 150 | A | ||
| IR | Reverse current | @ VR = 30V, T = 25C | 0.1 | 1.0 | mA | |
| VF | Maximum forward voltage | @ IF = 5.0A, T = 25C | 0.45 | V | ||
| RJA | Thermal resistance Junction to ambient | 800 | C/W | |||
| CJ | Diode junction capacitance | f=1MHz and applied 4V DC reverse voltage | 50 | pF | ||
| TSTG | Storage temperature | -55 | +150 | C | ||
| TJ | Operating temperature | -55 | +150 | C | ||
| Model | FCMS04 | |||||
| Type Number | FCMS04 30V 5.0A | |||||
| Marking Code | AF |
Dimensions:
| Dimension | Inches | (Millimeters) |
|---|---|---|
| A | 0.126 - 0.141 | (3.20 - 3.60) |
| B | 0.049 - 0.065 | (1.25 - 1.65) |
| C | 0.173 - 0.189 | (4.40 - 4.80) |
| D (Overall Width) | 0.110 - 0.094 | (2.80 - 2.40) |
| E (Overall Length) | 0.047 - 0.028 | (1.20 - 0.70) |
| F (Lead Length) | 0.012 - 0.004 | (0.30 - 0.10) |
| G (Height) | 0.063 | (1.60) |
| H (Width) | 0.110 | (2.80) |
| I (Length) | 0.087 | (2.20) |
Soldering Conditions:
High temperature soldering guaranteed: 260 C / 10 seconds at terminals.
Suggested thermal profiles for soldering processes:
Reflow soldering:
- Average ramp-up rate (Tsmin to Tsmax): <3 C/sec
- Preheat - Temperature Min (Tsmin): 150 C
- Preheat - Temperature Max (Tsmax): 200 C
- Preheat - Time (tsmin to tsmax): 60-120 sec
- Ramp-up Rate (Tsmax to TL): <3 C/sec
- Time maintained above: Temperature (TL): 217 C
- Time maintained above: Time (tL): 60-260 sec
- Peak Temperature (TP): 255 C (+0/-5 C)
- Time within 5C of actual Peak Temperature (tp): 10-30 sec
- Ramp-down Rate: <6 C/sec
- Time 25C to Peak Temperature: <6 minutes
Storage environment: Temperature=5 ~40 C, Humidity=55%25%
2501151750_FUXINSEMI-FCMS04_C42442663.pdf
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