High surge current axial super fast rectifiers including FUXINSEMI SF56G for demanding applications
Key Attributes
Model Number:
SF56G
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
150A
Reverse Leakage Current (Ir):
5mA
Reverse Recovery Time (trr):
35ns
Operating Junction Temperature Range:
-55℃~+150℃@(Tj)
Diode Configuration:
Independent
Voltage - DC Reverse (Vr) (Max):
400V
Voltage - Forward(Vf@If):
1.25V@5A
Current - Rectified:
5A
Mfr. Part #:
SF56G
Package:
DO-27
Product Description
Product Overview
The SF51G through SF58G series are 5.0A Axial Super Fast Rectifiers designed for high-efficiency applications. These rectifiers feature a glass passivated chip junction for high reliability, low reverse leakage current, and low forward voltage drop. Their super-fast switching speed makes them ideal for high-frequency applications. The leaded epoxy package is UL94-V0 rated for flame retardancy. These rectifiers are suitable for applications requiring high current capability and high surge current capability. Lead-free and Halogen-free options are available to meet RoHS requirements.
Product Attributes
- Brand: Fuxin Semiconductor
- Product Type: Axial Super Fast Rectifiers
- Package Type: DO-201AD (Leaded Epoxy)
- Flame Retardancy: UL94-V0 rated
- Lead Material: Solderable per MIL-STD-202, Method 208
- Polarity: Color band denotes cathode end
- Mounting Position: Any
- Environmental Compliance: Lead-free parts for green partner, meet RoHS requirements. Suffix "-H" indicates Halogen-free parts.
Technical Specifications
| Model | VRRM (V) | VRMS (V) | VR (V) | VF (V) @ IF=5.0A | trr (ns) | IO (A) | IFSM (A) | IR (A) @ VR=VRRM | CJ (pF) @ VR=4V, f=1MHz | TJ (C) | TSTG (C) | RJA (C/W) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SF51G | 50 | 35 | 50 | 0.95 | < 50 | 5.0 | 150 | < 5.0 | < 100 | -65 to +150 | -65 to +175 | 30 |
| SF52G | 100 | 70 | 100 | 0.95 | < 50 | 5.0 | 150 | < 5.0 | < 100 | -65 to +150 | -65 to +175 | 30 |
| SF53G | 150 | 105 | 150 | 0.95 | < 50 | 5.0 | 150 | < 5.0 | < 100 | -65 to +150 | -65 to +175 | 30 |
| SF54G | 200 | 140 | 200 | 1.00 | < 50 | 5.0 | 150 | < 5.0 | < 100 | -65 to +150 | -65 to +175 | 30 |
| SF55G | 300 | 210 | 300 | 1.10 | < 50 | 5.0 | 150 | < 5.0 | < 100 | -65 to +150 | -65 to +175 | 30 |
| SF56G | 400 | 280 | 400 | 1.15 | < 50 | 5.0 | 150 | < 5.0 | < 100 | -65 to +150 | -65 to +175 | 30 |
| SF57G | 500 | 350 | 500 | 1.25 | < 50 | 5.0 | 150 | < 5.0 | < 100 | -65 to +150 | -65 to +175 | 30 |
| SF58G | 600 | 420 | 600 | 1.25 | < 50 | 5.0 | 150 | < 5.0 | < 100 | -65 to +150 | -65 to +175 | 30 |
| Parameter | Conditions | Symbol | Min. | Typ. | Max. | Unit |
|---|---|---|---|---|---|---|
| Forward Rectified Current | Ambient Temperature = 55C | IO | - | - | 5.0 | A|
| Forward Surge Current | 8.3ms single half sine-wave (JEDEC method) | IFSM | - | - | 150 | A|
| Reverse Current | VR = VRRM, TJ = 125C | IR | - | - | 5.0 | A|
| Diode Junction Capacitance | f=1MHz and applied 4V DC reverse voltage | CJ | - | - | 100 | pF|
| Operating Temperature | TJ | -65 | - | +150 | C||
| Storage Temperature | TSTG | -65 | - | +175 | C||
| Thermal Resistance | Junction to ambient | RJA | - | - | 30 | C/W
Mechanical Data:
- Case: Molded plastic, DO-201AD
- Lead: Axial leads, solderable per MIL-STD-202, Method 208 guaranteed
- Dimensions: 0.94(24.0) MIN. length, 0.375(9.5) to 0.285(7.2) diameter
- Lead Diameter: 0.051(1.30) to 0.043(1.10) inches (mm)
- Body Diameter: 0.220(5.6) to 0.197(5.0) inches (mm)
Marking:
- Type number marking on device.
- Example: SF58G for standard, SF58GH for Halogen-free.
Taping Specifications:
- Ammo packing available.
- Box quantity: 1,250 pcs/inner box.
- Carton quantity: 12,500 pcs/carton.
Soldering Profile:
- Lead-free temperature profile for wave-soldering: Preheat max gradient 2C/s, Peak max well time 5s, Cool down max gradient -4C/s. Peak soldering temperature not to exceed 260C.
2009181038_FUXINSEMI-SF56G_C784619.pdf
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