Schottky barrier rectifier FUXINSEMI SS210A with solder plated terminals and UL 94V0 plastic package

Key Attributes
Model Number: SS210A
Product Custom Attributes
Reverse Leakage Current (Ir):
100uA@100V
Operating Junction Temperature Range:
-55℃~+125℃
Voltage - DC Reverse (Vr) (Max):
100V
Diode Configuration:
Independent
Voltage - Forward(Vf@If):
850mV@2A
Current - Rectified:
2A
Mfr. Part #:
SS210A
Package:
SMA(DO-214AC)
Product Description

Product Overview

The SS22A thru SS220A series are surface mount Schottky barrier rectifiers designed for applications requiring high forward surge current capability and high efficiency. These rectifiers feature a metal silicon junction for majority carrier conduction, resulting in low power loss. They are ideal for automated placement due to their built-in strain relief and are compliant with RoHS Directive 2011/65/EU. The plastic package carries an Underwriters Laboratory Flammability Classification 94V-0, and the components are suitable for high-temperature soldering.

Product Attributes

  • Brand: Fuxinsemi
  • Package Type: JEDEC DO-214AC (SMA)
  • Material: Metal silicon junction, majority carrier conduction
  • Flammability Classification: UL 94V-0
  • Certifications: RoHS Directive 2011/65/EU
  • Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
  • Mounting Position: Any

Technical Specifications

Symbol SS22A SS23A SS24A SS25A SS26A SS28A SS210A SS215A SS220A Units Description
VRRM 20 30 40 50 60 80 100 150 200 V Maximum repetitive peak reverse voltage
VRMS 14 21 28 35 42 56 70 105 140 V Maximum RMS voltage
VDC 20 30 40 50 60 80 100 150 200 V Maximum DC blocking voltage
I(AV) 2.0 A Maximum average forward rectified current at TL (see fig.1)
IFSM 50.0 A Peak forward surge current 8.3ms single half sine-wave superimposed on rated load
VF 0.55 0.55 0.55 0.70 0.70 0.85 0.85 0.95 0.95 V Maximum instantaneous forward voltage at 2.0A
IR 0.1 0.5 mA Maximum DC reverse current at rated DC blocking voltage
RJA 80 °C/W Typical thermal resistance (NOTE 2)
CJ 2.0 pF Typical junction capacitance (NOTE 1)
TJ, TSTG -55 to +150 °C Operating junction temperature range and Storage temperature range

Dimensions

Package: SMA / DO-214AC

Dimension Inches (Millimeters)
A 0.177 - 0.157 (4.50 - 3.99)
B 0.108 - 0.096 (2.75 - 2.45)
C 0.060 - 0.030 (1.52 - 0.76)
D 0.012 (max) (0.305 max)
E 0.008 (max) (0.203 max)
F 0.096 - 0.078 (2.42 - 1.98)
G 0.067 (1.70) 0.051 (1.30)
H 0.208 - 0.188 (5.28 - 4.80)

Marking

Type number marking code.

Soldering Conditions

Reflow soldering:

Parameter Value Unit
Preheat Temperature (Tsmin to Tsmax) 150 - 200 °C
Time (ts) 60 - 120 sec
Time maintained above TL (217°C) (tL) 60 - 260 sec
Peak Temperature (TP) 255 +0/-5 °C
Time within 5°C of actual Peak Temperature (tp) 10 - 30 sec
Ramp-down Rate <6 °C/sec

Soldering temperature guaranteed: 260 °C / 10 seconds at terminals.


2012151837_FUXINSEMI-SS210A_C842787.pdf

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