Schottky barrier rectifier FUXINSEMI SS210A with solder plated terminals and UL 94V0 plastic package
Product Overview
The SS22A thru SS220A series are surface mount Schottky barrier rectifiers designed for applications requiring high forward surge current capability and high efficiency. These rectifiers feature a metal silicon junction for majority carrier conduction, resulting in low power loss. They are ideal for automated placement due to their built-in strain relief and are compliant with RoHS Directive 2011/65/EU. The plastic package carries an Underwriters Laboratory Flammability Classification 94V-0, and the components are suitable for high-temperature soldering.
Product Attributes
- Brand: Fuxinsemi
- Package Type: JEDEC DO-214AC (SMA)
- Material: Metal silicon junction, majority carrier conduction
- Flammability Classification: UL 94V-0
- Certifications: RoHS Directive 2011/65/EU
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
- Mounting Position: Any
Technical Specifications
| Symbol | SS22A | SS23A | SS24A | SS25A | SS26A | SS28A | SS210A | SS215A | SS220A | Units | Description |
|---|---|---|---|---|---|---|---|---|---|---|---|
| VRRM | 20 | 30 | 40 | 50 | 60 | 80 | 100 | 150 | 200 | V | Maximum repetitive peak reverse voltage |
| VRMS | 14 | 21 | 28 | 35 | 42 | 56 | 70 | 105 | 140 | V | Maximum RMS voltage |
| VDC | 20 | 30 | 40 | 50 | 60 | 80 | 100 | 150 | 200 | V | Maximum DC blocking voltage |
| I(AV) | 2.0 | A | Maximum average forward rectified current at TL (see fig.1) | ||||||||
| IFSM | 50.0 | A | Peak forward surge current 8.3ms single half sine-wave superimposed on rated load | ||||||||
| VF | 0.55 | 0.55 | 0.55 | 0.70 | 0.70 | 0.85 | 0.85 | 0.95 | 0.95 | V | Maximum instantaneous forward voltage at 2.0A |
| IR | 0.1 | 0.5 | mA | Maximum DC reverse current at rated DC blocking voltage | |||||||
| RJA | 80 | °C/W | Typical thermal resistance (NOTE 2) | ||||||||
| CJ | 2.0 | pF | Typical junction capacitance (NOTE 1) | ||||||||
| TJ, TSTG | -55 to +150 | °C | Operating junction temperature range and Storage temperature range | ||||||||
Dimensions
Package: SMA / DO-214AC
| Dimension | Inches | (Millimeters) |
|---|---|---|
| A | 0.177 - 0.157 | (4.50 - 3.99) |
| B | 0.108 - 0.096 | (2.75 - 2.45) |
| C | 0.060 - 0.030 | (1.52 - 0.76) |
| D | 0.012 (max) | (0.305 max) |
| E | 0.008 (max) | (0.203 max) |
| F | 0.096 - 0.078 | (2.42 - 1.98) |
| G | 0.067 (1.70) | 0.051 (1.30) |
| H | 0.208 - 0.188 | (5.28 - 4.80) |
Marking
Type number marking code.
Soldering Conditions
Reflow soldering:
| Parameter | Value | Unit |
|---|---|---|
| Preheat Temperature (Tsmin to Tsmax) | 150 - 200 | °C |
| Time (ts) | 60 - 120 | sec |
| Time maintained above TL (217°C) (tL) | 60 - 260 | sec |
| Peak Temperature (TP) | 255 +0/-5 | °C |
| Time within 5°C of actual Peak Temperature (tp) | 10 - 30 | sec |
| Ramp-down Rate | <6 | °C/sec |
Soldering temperature guaranteed: 260 °C / 10 seconds at terminals.
2012151837_FUXINSEMI-SS210A_C842787.pdf
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