Fast Recovery Rectifier 1 Ampere 1000 Volt FUXINSEMI DFR1M with Underwriters Laboratory 94V 0 Rating

Key Attributes
Model Number: DFR1M
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
25A
Reverse Leakage Current (Ir):
5uA@1kV
Reverse Recovery Time (trr):
500ns
Operating Junction Temperature Range:
-55℃~+150℃@(Tj)
Diode Configuration:
Independent
Voltage - DC Reverse (Vr) (Max):
1kV
Voltage - Forward(Vf@If):
1.3V@1A
Current - Rectified:
1A
Mfr. Part #:
DFR1M
Package:
SOD-123
Product Description

Product Overview

The DFR1A through DFR1M series are 1.0A Surface Mount Fast Recovery Rectifiers designed for high-reliability applications. These rectifiers feature a glass-passivated chip junction, built-in strain relief for automated placement, and high forward surge current capability. They are ideal for surface-mounted applications requiring low reverse leakage and high temperature soldering capabilities, guaranteed up to 260C for 10 seconds at the terminals.

Product Attributes

  • Case: JEDEC SOD-123 molded plastic body
  • Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
  • Polarity: Color band denotes cathode end
  • Mounting Position: Any
  • Flammability Classification: Underwriters Laboratory 94V-0
  • Brand: FUXINSEMICONDUCTOR (implied by www.fuxinsemi.com)

Technical Specifications

PARAMETER SYMBOLS UNITS DFR1A DFR1B DFR1D DFR1G DFR1J DFR1K DFR1M
Maximum repetitive peak reverse voltage VRRM V 50 100 200 400 600 800 1000
Maximum RMS voltage VRMS V 35 70 140 280 420 560 700
Maximum DC blocking voltage VDC V 50 100 200 400 600 800 1000
Maximum average forward rectified current 0.375(9.5mm) lead length at TA=75C I(AV) A 1.0
Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM A 25.0
Maximum instantaneous forward voltage at 1.0A VF V 1.3
Maximum DC reverse current TA=25C at rated DC blocking voltage IR A 5.0
Maximum DC reverse current TA=100C at rated DC blocking voltage IR mA 50.0
Typical thermal resistance (NOTE 3) RJA C/W 85.0
Typical junction capacitance (NOTE 2) CJ pF 15.0
Maximum reverse recovery time (NOTE 1) trr ns 150 250 500
Operating junction and storage temperature range TJ,TSTG C -55 to +150

Dimensions (SOD-123)

Dimension Inches (Millimeters)
Length 2.70.2 (68.65.1)
Width 1.80.2 (45.75.1)
Height 1.00.2 (25.45.1)
Lead Width 0.60.25 (15.26.4)
Lead Length 1.10.25 (27.96.4)
Body Thickness 0.10-0.30 (2.5-7.6)

Suggested Solder Pad Layout (SOD-123)

Pad Dimension A Dimension B Dimension C
Dimensions 0.075 (1.90) 0.055 (1.40) 0.075 (1.90)

Marking Code

Type Number Marking Code
DFR1A F1
DFR1B F2
DFR1D F3
DFR1G F4
DFR1J F5
DFR1K F6
DFR1M F7

Soldering Conditions (Reflow Soldering)

Parameter Value
Preheat Temperature (Tsmin) 150 C
Preheat Temperature (Tsmax) 200 C
Preheat Time (ts) 60~120 sec
Time maintained above Temperature (TL) 217 C
Time (tL) 60~260 sec
Peak Temperature (TP) 255 +0/-5 C
Time within 5C of actual Peak Temperature (tp) 10~30 sec
Average Ramp-up Rate (Tsmax to TL) < 3 C/sec
Ramp-up Rate (25C to Peak) < 3 C/sec
Ramp-down Rate < 6 C/sec

Storage Environment

  • Temperature: 5 ~40 C
  • Humidity: 55%25%

2011091105_FUXINSEMI-DFR1M_C915613.pdf

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