Fast Recovery Rectifier 1 Ampere 1000 Volt FUXINSEMI DFR1M with Underwriters Laboratory 94V 0 Rating
Product Overview
The DFR1A through DFR1M series are 1.0A Surface Mount Fast Recovery Rectifiers designed for high-reliability applications. These rectifiers feature a glass-passivated chip junction, built-in strain relief for automated placement, and high forward surge current capability. They are ideal for surface-mounted applications requiring low reverse leakage and high temperature soldering capabilities, guaranteed up to 260C for 10 seconds at the terminals.
Product Attributes
- Case: JEDEC SOD-123 molded plastic body
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: Color band denotes cathode end
- Mounting Position: Any
- Flammability Classification: Underwriters Laboratory 94V-0
- Brand: FUXINSEMICONDUCTOR (implied by www.fuxinsemi.com)
Technical Specifications
| PARAMETER | SYMBOLS | UNITS | DFR1A | DFR1B | DFR1D | DFR1G | DFR1J | DFR1K | DFR1M |
|---|---|---|---|---|---|---|---|---|---|
| Maximum repetitive peak reverse voltage | VRRM | V | 50 | 100 | 200 | 400 | 600 | 800 | 1000 |
| Maximum RMS voltage | VRMS | V | 35 | 70 | 140 | 280 | 420 | 560 | 700 |
| Maximum DC blocking voltage | VDC | V | 50 | 100 | 200 | 400 | 600 | 800 | 1000 |
| Maximum average forward rectified current 0.375(9.5mm) lead length at TA=75C | I(AV) | A | 1.0 | ||||||
| Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) | IFSM | A | 25.0 | ||||||
| Maximum instantaneous forward voltage at 1.0A | VF | V | 1.3 | ||||||
| Maximum DC reverse current TA=25C at rated DC blocking voltage | IR | A | 5.0 | ||||||
| Maximum DC reverse current TA=100C at rated DC blocking voltage | IR | mA | 50.0 | ||||||
| Typical thermal resistance (NOTE 3) | RJA | C/W | 85.0 | ||||||
| Typical junction capacitance (NOTE 2) | CJ | pF | 15.0 | ||||||
| Maximum reverse recovery time (NOTE 1) | trr | ns | 150 | 250 | 500 | ||||
| Operating junction and storage temperature range | TJ,TSTG | C | -55 to +150 | ||||||
Dimensions (SOD-123)
| Dimension | Inches | (Millimeters) |
|---|---|---|
| Length | 2.70.2 | (68.65.1) |
| Width | 1.80.2 | (45.75.1) |
| Height | 1.00.2 | (25.45.1) |
| Lead Width | 0.60.25 | (15.26.4) |
| Lead Length | 1.10.25 | (27.96.4) |
| Body Thickness | 0.10-0.30 | (2.5-7.6) |
Suggested Solder Pad Layout (SOD-123)
| Pad | Dimension A | Dimension B | Dimension C |
|---|---|---|---|
| Dimensions | 0.075 (1.90) | 0.055 (1.40) | 0.075 (1.90) |
Marking Code
| Type Number | Marking Code |
|---|---|
| DFR1A | F1 |
| DFR1B | F2 |
| DFR1D | F3 |
| DFR1G | F4 |
| DFR1J | F5 |
| DFR1K | F6 |
| DFR1M | F7 |
Soldering Conditions (Reflow Soldering)
| Parameter | Value |
|---|---|
| Preheat Temperature (Tsmin) | 150 C |
| Preheat Temperature (Tsmax) | 200 C |
| Preheat Time (ts) | 60~120 sec |
| Time maintained above Temperature (TL) | 217 C |
| Time (tL) | 60~260 sec |
| Peak Temperature (TP) | 255 +0/-5 C |
| Time within 5C of actual Peak Temperature (tp) | 10~30 sec |
| Average Ramp-up Rate (Tsmax to TL) | < 3 C/sec |
| Ramp-up Rate (25C to Peak) | < 3 C/sec |
| Ramp-down Rate | < 6 C/sec |
Storage Environment
- Temperature: 5 ~40 C
- Humidity: 55%25%
2011091105_FUXINSEMI-DFR1M_C915613.pdf
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