Power Switching Silicon N Channel VDMOSFET GL GL25N40A8 Featuring Low Gate Charge and TO 220 Package

Key Attributes
Model Number: GL25N40A8
Product Custom Attributes
Drain To Source Voltage:
400V
Current - Continuous Drain(Id):
25A
RDS(on):
155mΩ@10V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
4V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
25pF
Output Capacitance(Coss):
320pF
Pd - Power Dissipation:
250W
Input Capacitance(Ciss):
2.65nF
Gate Charge(Qg):
60nC@10V
Mfr. Part #:
GL25N40A8
Package:
TO-220
Product Description

Product Overview

The GL25N40A8 is a high-performance Silicon N-Channel Enhanced VDMOSFET manufactured using self-aligned planar technology. This advanced design significantly reduces conduction losses, enhances switching performance, and improves avalanche energy capabilities, making it ideal for various power switching circuits that require system miniaturization and higher efficiency. The device is supplied in a RoHS-compliant TO-220 package.

Key Features:

  • Fast Switching
  • Low ON Resistance (Rdson 0.155)
  • Low Gate Charge (Typical 60nC)
  • Low Reverse Transfer Capacitances (Typical 25pF)
  • 100% Single Pulse Avalanche Energy Tested

Applications:

  • Power switch circuits for adaptors and chargers.

Product Attributes

  • Brand: GL
  • Technology: Silicon N-Channel Enhanced VDMOSFET
  • Package: TO-220
  • Compliance: RoHS standard

Technical Specifications

Symbol Parameter Test Conditions Rating Units
Absolute Maximum Ratings (Tc=25 unless otherwise specified)
VDSS Drain-to-Source Voltage 400 V
ID Continuous Drain Current 25 A
ID Continuous Drain Current TC=100 C 17.5 A
IDMa1 Pulsed Drain Current 100 A
VGS Gate-to-Source Voltage 30 V
EAsa2 Single Pulse Avalanche Energy 1850 mJ
EAra1 Avalanche Energy, Repetitive 155 mJ
IAR a1 Avalanche Current 25 A
dv/dta3 Peak Diode Recovery dv/dt 5.0 V/ns
PD Power Dissipation 250 W
Derating Factor above 25C 2.0 W/
TJ, Tstg Operating Junction and Storage Temperature Range 55 to 150
TL Maximum Temperature for Soldering 300
Thermal Characteristics
RJC Thermal Resistance, Junction-to-Case 0.5 / W
RJA Thermal Resistance, Junction-to-Ambient 62.5 / W
Electrical Characteristics (Tc= 25 unless otherwise specified)
OFF Characteristics
VDSS Drain to Source Breakdown Voltage VGS=0V,ID=250A 400 V
BVDSS/TJ Bvdss Temperature Coefficient ID=250uA,Reference25 0.53 V/
IDSS Drain to Source Leakage Current VDS=400V, VGS=0V,Ta=25 -- 1.0 A
VDS=320V, VGS=0V,Ta=125 -- 100 A
IGSS(F) Gate to Source Forward Leakage VGS=+30V -- 100 nA
IGSS(R) Gate to Source Reverse Leakage VGS=-30V -- -100 nA
ON Characteristics
RDS(ON) Drain-to-Source On-Resistance VGS=10V,ID=12.5A 0.13
0.155
VGS(TH) Gate Threshold Voltage VDS=VGS,ID=250A 2.0 V
4.0 V
gfs Forward Transconductance VDS=15V,ID=12.5A 16 S
Dynamic Characteristics
Ciss Input Capacitance VGS=0V VDS=25V f=1.0MHz 2650 pF
Coss Output Capacitance 320 pF
Crss Reverse Transfer Capacitance 25 pF
Resistive Switching Characteristics
td(ON) Turn-on Delay Time ID=25A,VDD=200V VGS=10V,Rg=25 35 ns
tr Rise Time 71 ns
td(OFF) Turn-Off Delay Time 160 ns
tf Fall Time 72 ns
Qg Total Gate Charge ID=25A,VDD=200V VGS=10V 60 nC
Qgs Gate to Source Charge 12 nC
Qgd Gate to Drain (Miller)Charge 19 nC
Source-Drain Diode Characteristics
ISD Continuous Source Current (Body Diode) 25 A
ISM Maximum Pulsed Current (Body Diode) 100 A
VSD Diode Forward Voltage IS=25A,VGS=0V 1.5 V
trr Reverse Recovery Time IS=25A,Tj=25 dIF/dt=100A/s,VGS=0V 303 ns
Qrr Reverse Recovery Charge 1867 C

2410121714_GL-GL25N40A8_C2988053.pdf

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