P Channel MOSFET GL GL12P40A4 Featuring TO 252 Package and RoHS Compliance for High Frequency Circuits

Key Attributes
Model Number: GL12P40A4
Product Custom Attributes
Drain To Source Voltage:
40V
Current - Continuous Drain(Id):
12A
Operating Temperature -:
-55℃~+150℃
RDS(on):
26mΩ@10V,8A
Reverse Transfer Capacitance (Crss@Vds):
65pF@20V
Number:
1 P-Channel
Pd - Power Dissipation:
45W
Input Capacitance(Ciss):
530pF@20V
Gate Charge(Qg):
15nC@10V
Mfr. Part #:
GL12P40A4
Package:
TO-252
Product Description

Product Overview

The GL12P40A4 is a P-Channel Power MOSFET from GL Silicon, utilizing advanced trench technology and design for excellent RDS(ON) with low gate charge. This MOSFET is suitable for a wide variety of applications, including power switching, hard switched and high frequency circuits, and uninterruptible power supplies. It features a high-density cell design for ultra-low Rdson, fully characterized avalanche voltage and current, and an excellent package for good heat dissipation. The product conforms to RoHS standards and is supplied in a TO-252 package.

Product Attributes

  • Brand: GL Silicon
  • Package Type: TO-252
  • RoHS Compliant: Yes

Technical Specifications

Symbol Parameter Test Conditions Rating Units
Absolute Maximum Ratings (Tc= 25 unless otherwise specified)
VDSS Drain-to-Source Voltage -40 V
ID Continuous Drain Current -12 A
ID Continuous Drain Current TC = 70 C -9.6 A
IDMa1 Pulsed Drain Current -48 A
VGS Gate-to-Source Voltage 20 V
Eas a5 L=0.5mH 90 mJ
dv/dt a3 Peak Diode Recovery dv/dt 5.0 V/ns
PD Power Dissipation 45 W
TJ, Tstg Operating Junction and Storage Temperature Range 55 to 150
TL Maximum Temperature for Soldering 300
Electrical Characteristics (Tc= 25 unless otherwise specified)
OFF Characteristics
VDSS Drain to Source Breakdown Voltage VGS=0V, ID=250A -40 V
IDSS Drain to Source Leakage Current VDS=-40V, VGS= 0V,Ta=25 1.0 A
IGSS(F) Gate to Source Forward Leakage VGS=+20V 0.1 A
IGSS(R) Gate to Source Reverse Leakage VGS=-20V -0.1 A
ON Characteristics
RDS(ON)1 Drain-to-Source On-Resistance VGS=-10V,ID=-8A 26 (Typ) m
RDS(ON)1 Drain-to-Source On-Resistance VGS=-10V,ID=-8A 35 (Max) m
RDS(ON)2 Drain-to-Source On-Resistance VGS=-4.5V,ID=-4A 34 (Typ) m
RDS(ON)2 Drain-to-Source On-Resistance VGS=-4.5V,ID=-4A 45 (Max) m
VGS(TH) Gate Threshold Voltage VDS=VGS,ID=250A -1 (Typ) V
VGS(TH) Gate Threshold Voltage VDS=VGS,ID=250A -3.0 (Max) V
Dynamic Characteristics
gfs Forward Transconductance VDS=-15V,ID=-8A 20 S
Ciss Input Capacitance VGS=0V,VDS=-20V f=1.0MHz 530 pF
Coss Output Capacitance 100 pF
Crss Reverse Transfer Capacitance 65 pF
Resistive Switching Characteristics
td(ON) Turn-on Delay Time VDD=-20V,ID=-12A VGS=-10V,RG=3 8.8 ns
tr Rise Time 6.5 ns
td(OFF) Turn-Off Delay Time 20 ns
tf Fall Time 8 ns
Qg Total Gate Charge VDD=-20V, ID=-12A VGS=-10V 15 nC
Qgs Gate to Source Charge 4.5 nC
Qgd Gate to Drain (Miller)Charge 3.5 nC
Source-Drain Diode Characteristics
IS Continuous Source Current (Body Diode) -12 A
VSD Diode Forward Voltage IS=-12A,VGS=0V -1.5 V
trr Reverse Recovery Time IS=-12A,Tj = 25 dIF/dt=100A/us,VGS=0V 45 ns
Qrr Reverse Recovery Charge 40 nC
Thermal Characteristics
RJC Junction-to-Case 2.5 /W

2410121608_GL-GL12P40A4_C5138968.pdf

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