Power Switching N Channel MOSFET GL GL80N06FA9 Featuring Low Gate Charge and TO 220F Package

Key Attributes
Model Number: GL80N06FA9
Product Custom Attributes
Drain To Source Voltage:
60V
Current - Continuous Drain(Id):
80A
Operating Temperature -:
-55℃~+175℃
RDS(on):
8mΩ@10V
Gate Threshold Voltage (Vgs(th)):
2.5V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
210pF
Output Capacitance(Coss):
290pF
Pd - Power Dissipation:
60W
Input Capacitance(Ciss):
4nF
Gate Charge(Qg):
90nC@10V
Mfr. Part #:
GL80N06FA9
Package:
TO-220F-3
Product Description

Product Overview

The GL80N06FA9 is a high-performance N-Channel Power MOSFET from Wuxi Guang Lei electronic technology co., LTD. Utilizing advanced trench technology and design, it offers excellent RDS(ON) with low gate charge, making it suitable for a wide range of power switching applications, including hard switched and high-frequency circuits, and uninterruptible power supplies. The TO-220F package ensures good heat dissipation and complies with RoHS standards.

Product Attributes

  • Brand: GL Silicon
  • Manufacturer: Wuxi Guang Lei electronic technology co., LTD
  • Channel Type: N-Channel
  • Package Type: TO-220F
  • RoHS Compliant: Yes

Technical Specifications

Parameter Test Conditions Rating Units Min. Typ. Max.
General Description
RDS(ON) VGS=10V <8.0 m 6.5
Continuous Drain Current (ID) (Tc= 25) 80 A
Power Dissipation (PD) (Tc= 25) 60 W
Single Pulse Avalanche Energy (EAS) (Tj=25, VDD=20V, VG=10V, L=0.5mH, Rg=25) 390 mJ
Operating Junction and Storage Temperature Range -55 to 175
OFF Characteristics
Drain to Source Breakdown Voltage (VDSS) VGS=0V, ID=250A 60 V 60 -- --
Drain to Source Leakage Current (IDSS) VDS=60V, VGS=0V, Ta=25 1.0 A -- -- 1.0
Gate to Source Forward Leakage (IGSS(F)) VGS=+20V 0.1 A -- -- 0.1
Gate to Source Reverse Leakage (IGSS(R)) VGS=-20V -0.1 A -- -- -0.1
ON Characteristics
Drain-to-Source On-Resistance (RDS(ON)) VGS=10V, ID=40A 8.0 m -- 6.5 8.0
Gate Threshold Voltage (VGS(TH)) VDS=VGS, ID=250A 2.5 V 1.0 -- 2.5
Dynamic Characteristics
Forward Transconductance (gfs) VDS=5V, ID=20A 20 S -- 20 --
Input Capacitance (Ciss) VGS=0V, VDS=30V, f=1.0MHz 4000 pF -- 4000 --
Output Capacitance (Coss) VGS=0V, VDS=30V, f=1.0MHz 290 pF -- 290 --
Reverse Transfer Capacitance (Crss) VGS=0V, VDS=30V, f=1.0MHz 210 pF -- 210 --
Resistive Switching Characteristics
Turn-on Delay Time (td(ON)) VDD=30V, RL=1, VGS=10V, RG=3 8.5 ns -- 8.5 --
Rise Time (tr) VDD=30V, RL=1, VGS=10V, RG=3 7 ns -- 7 --
Turn-Off Delay Time (td(OFF)) VDD=30V, RL=1, VGS=10V, RG=3 40 ns -- 40 --
Fall Time (tf) VDD=30V, RL=1, VGS=10V, RG=3 15 ns -- 15 --
Total Gate Charge (Qg) VDD=30V, ID=20A, VGS=10V 90 nC -- 90 --
Gate to Source Charge (Qgs) VDD=30V, ID=20A, VGS=10V 9 nC -- 9 --
Gate to Drain (Miller)Charge (Qgd) VDD=30V, ID=20A, VGS=10V 18 nC -- 18 --
Source-Drain Diode Characteristics
Continuous Source Current (IS) (Body Diode) 80 A -- -- 80
Diode Forward Voltage (VSD) IS=80A, VGS=0V 1.5 V -- -- 1.5
Thermal Characteristics
Junction-to-Case (RJC) Surface Mounted on FR4 Board, t10sec 2.08 /W 2.08

2411220215_GL-GL80N06FA9_C2886426.pdf

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