N channel power MOSFET Guangdong Hottech IRLML6344 with 30V drain source voltage and low on resistance

Key Attributes
Model Number: IRLML6344
Product Custom Attributes
Drain To Source Voltage:
30V
Current - Continuous Drain(Id):
5A
RDS(on):
29mΩ@4.5V,5A
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
1.1V
Reverse Transfer Capacitance (Crss@Vds):
46pF@15V
Number:
1 N-channel
Input Capacitance(Ciss):
650pF@25V
Pd - Power Dissipation:
1.3W
Gate Charge(Qg):
6.8nC@4.5V
Mfr. Part #:
IRLML6344
Package:
SOT-23
Product Description

Product Overview

The IRLML6344 is an N-CHANNEL POWER MOSFET designed for various electronic applications. It offers a maximum drain-source voltage of 30V and a maximum gate-source voltage of 12V, with low on-resistance characteristics.

Product Attributes

  • Brand: SHENZHEN HOTTECH ELECTRONICS CO.,LTD
  • Case Material: Molded plastic
  • Flammability Classification: UL 94V-0
  • Terminal Finish: Lead free plating, solderable per MIL-STD-202, method 208

Technical Specifications

ParameterSymbolValueUnitConditions
FEATURES
VDS maxVDS30V
VGS maxVGS12V
RDS(on) max @VGS=4.5VRDS(on)29mVGS=4.5V
RDS(on) max @VGS=2.5VRDS(on)37mVGS=2.5V
MECHANICAL DATA
CaseSOT-23
Weight0.008grams (approximate)
MAXIMUM RATINGS
Drain-source voltageVDS30VTA= 25C
Continuous drain current @VGS=10VID5.0ATA= 25C
Continuous drain current @VGS=10V,TA=70CID4.0ATA=70C
Pulsed drain currentIDM25A
Maximum power dissipationPD1.3WTA= 25C
Maximum power dissipation @TA=70CPD0.8WTA=70C
Gate-to-source voltageVGS12V
Junction and storage temperature rangeTJ,TSTG-55 ~+ 150C
Thermal resistance from junction-to-ambient (note 1)RJA100C/W
ELECTRICAL CHARACTERISTICS
Drain-to-source breakdown voltageV(BR)DSS30VVGS=0V,ID=250A
Breakdown voltage temp. coefficientV(BR)DSS/ TJ0.02V/CReference to 25C,ID=1mA
Static drain-to-source on- resistanceRDS(on)22mVGS= 4.5V, ID = 5.0A
Static drain-to-source on- resistanceRDS(on)27mVGS = 2.5V, ID = 4.0A
Gate threshold voltageVGS(th)0.5 ~ 1.1VVDS = VGS, ID = 10A
Drain-to-source leakage currentIDSS1.0AVDS =24V, VGS = 0V
Gate-to-source forward leakageIGSS100nAVGS= 12V
Gate-to-source reverse leakageIGSS-100nAVGS=-12V
Internal gate resistanceRG1.7
Forward transconductancegfs19SVDS= 10V, ID= 5.0A
Total gate chargeQg6.8nCID=5.0A,VDS=15V,VGS=4.5V (note 2)
Gate-to-source chargeQgs0.3nC
Gate-to-drain ("Miller") charge Qgd2.4nC
Turn-on delay timetd(on)4.2nsVDD=15V,ID=1.0A,RG=6.8,VGS=4.5V (note 2)
Rise timetr5.6ns
Turn-off delay timetd(off)22ns
Fall timetf9.1ns
Input capacitanceCiss650pFVGS=0V,VDS=25V =1.0MHz
Output capacitanceCoss65pF
Reverse transfer capacitanceCrss46pF
Continuous source current (body diode)IS1.3A
Pulsed source current (body diode,note 1)ISM25A
Diode forward voltage (note 2)VSD1.2VTJ=25C,IS=5.0A,VGS=0V
Reverse recovery time (note 2)trr10 ~ 15nsTJ=25C,VR=15V,IF=1.3A, di/dt =100A/s
Reverse recovery charge (note 2)Qrr3.8 ~ 5.7nC

2410122008_Guangdong-Hottech-IRLML6344_C5364313.pdf

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