P Channel MOSFET HUASHUO HSM4113 Featuring Super Low Gate Charge and Excellent Switching Performance
Key Attributes
Model Number:
HSM4113
Product Custom Attributes
Drain To Source Voltage:
40V
Current - Continuous Drain(Id):
7.5A
Operating Temperature -:
-55℃~+150℃
RDS(on):
40mΩ@10V,6A
Gate Threshold Voltage (Vgs(th)):
1V
Reverse Transfer Capacitance (Crss@Vds):
80pF@15V
Number:
1 P-Channel
Input Capacitance(Ciss):
1.004nF@15V
Pd - Power Dissipation:
3.1W
Gate Charge(Qg):
-
Mfr. Part #:
HSM4113
Package:
SOP-8
Product Description
Product Overview
The HSM4113 is a P-Channel Fast Switching MOSFET designed with high cell density trench technology. It offers excellent RDS(ON) and gate charge, making it ideal for synchronous buck converter applications. This MOSFET meets RoHS and Green Product requirements, is 100% EAS guaranteed, and features full function reliability approval. Key benefits include super low gate charge and excellent CdV/dt effect decline.
Product Attributes
- Brand: HS-Semi
- Product Type: P-Channel MOSFET
- Technology: Advanced high cell density Trench technology
- Certifications: RoHS, Green Product
- Reliability: 100% EAS Guaranteed, Full function reliability approved
Technical Specifications
| Symbol | Parameter | Conditions | Min. | Typ. | Max. | Unit |
|---|---|---|---|---|---|---|
| Absolute Maximum Ratings | ||||||
| VDS | Drain-Source Voltage | -40 | V | |||
| VGS | Gate-Source Voltage | ±20 | V | |||
| ID@TC=25 | Continuous Drain Current, -VGS @ -10V1 | -7.5 | A | |||
| ID@TC=100 | Continuous Drain Current, -VGS @ -10V1 | -5.7 | A | |||
| IDM | Pulsed Drain Current2 | -15 | A | |||
| EAS | Single Pulse Avalanche Energy3 | 36 | mJ | |||
| IAS | Avalanche Current | -27.2 | A | |||
| PD@TC=25 | Total Power Dissipation4 | 3.1 | W | |||
| TSTG | Storage Temperature Range | -55 | 150 | |||
| TJ | Operating Junction Temperature Range | -55 | 150 | |||
| Thermal Data | ||||||
| RJA | Thermal Resistance Junction-Ambient1 | --- | 85 | /W | ||
| RJC | Thermal Resistance Junction-Case1 | --- | 40 | /W | ||
| P-Channel Electrical Characteristics (TJ=25 , unless otherwise noted) | ||||||
| BVDSS | Drain-Source Breakdown Voltage | VGS=0V , ID=-250uA | -40 | --- | --- | V |
| BVDSS/TJ | BVDSS Temperature Coefficient | Reference to 25 , ID=-1mA | --- | -0.012 | --- | V/ |
| RDS(ON),max | Static Drain-Source On-Resistance2 | VGS=-10V , ID=-6A | --- | --- | 40 | m |
| VGS=-4.5V , ID=-3A | --- | --- | 70 | m | ||
| VGS(th) | Gate Threshold Voltage | VGS=VDS , ID =-250uA | -1.0 | --- | -2.5 | V |
| VGS(th) | VGS(th) Temperature Coefficient | --- | 4.32 | --- | mV/ | |
| IDSS | Drain-Source Leakage Current | VDS=-32V , VGS=0V , TJ=25 | --- | --- | 1 | uA |
| VDS=-32V , VGS=0V , TJ=55 | --- | --- | 5 | uA | ||
| IGSS | Gate-Source Leakage Current | VGS=±20V , VDS=0V | --- | --- | ±100 | nA |
| gfs | Forward Transconductance | VDS=-5V , ID=-6A | --- | 12 | --- | S |
| Qg | Total Gate Charge (-4.5V) | VDS=-20V , VGS=-4.5V , ID=-6A | --- | 9 | --- | nC |
| Qgs | Gate-Source Charge | --- | 2.54 | --- | nC | |
| Qgd | Gate-Drain Charge | --- | 3.1 | --- | nC | |
| Td(on) | Turn-On Delay Time | VDD=-15V , VGS=-10V , RG=3.3, ID=-1A | --- | 19.2 | --- | ns |
| Tr | Rise Time | --- | 12.8 | --- | ns | |
| Td(off) | Turn-Off Delay Time | --- | 48.6 | --- | ns | |
| Tf | Fall Time | --- | 4.6 | --- | ns | |
| Ciss | Input Capacitance | VDS=-15V , VGS=0V , f=1MHz | --- | 1004 | --- | pF |
| Coss | Output Capacitance | --- | 108 | --- | pF | |
| Crss | Reverse Transfer Capacitance | --- | 80 | --- | pF | |
| Diode Characteristics | ||||||
| IS | Continuous Source Current1,5 | VG=VD=0V , Force Current | --- | --- | -7.5 | A |
| ISM | Pulsed Source Current2,5 | --- | --- | -15 | A | |
| VSD | Diode Forward Voltage2 | VGS=0V , IS=-1A , TJ=25 | --- | --- | -1 | V |
Notes:
- 1 The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
- 2 The data tested by pulsed, pulse width ≤ 300us, duty cycle ≤ 2%.
- 3 The EAS data shows Max. rating. The test condition is VDD=-25V, VGS=-10V, L=0.1mH, IAS=-27.2A.
- 4 The power dissipation is limited by 150 junction temperature.
- 5 The data is theoretically the same as ID and IDM; in real applications, should be limited by total power dissipation.
Ordering Information
| Part Number | Package Code | Packaging |
|---|---|---|
| HSM4113 | SOP-8 | 2500/Tape&Reel |
2410121456_HUASHUO-HSM4113_C700983.pdf
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