P Channel MOSFET 60V Fast Switching Device HUASHUO HSH6115 Suitable for Synchronous Buck Converters

Key Attributes
Model Number: HSH6115
Product Custom Attributes
Drain To Source Voltage:
60V
Current - Continuous Drain(Id):
45A
Operating Temperature -:
-55℃~+150℃
RDS(on):
25mΩ@10V
Gate Threshold Voltage (Vgs(th)):
2.5V@250uA
Type:
P-Channel
Reverse Transfer Capacitance (Crss@Vds):
141pF
Number:
1 P-Channel
Output Capacitance(Coss):
224pF
Input Capacitance(Ciss):
3.635nF
Pd - Power Dissipation:
86.8W
Gate Charge(Qg):
25nC@4.5V
Mfr. Part #:
HSH6115
Package:
TO-263
Product Description

Product Overview

The HSH6115 is a P-channel, 60V fast-switching MOSFET designed for high-efficiency synchronous buck converter applications. It features high cell density trench technology, offering excellent RDS(ON) and low gate charge. This device meets RoHS and Green Product requirements and is 100% EAS guaranteed with full function reliability approval. Key advantages include super low gate charge and excellent CdV/dt effect decline.

Product Attributes

  • Brand: HS-Semi
  • Product Type: P-Channel MOSFET
  • Voltage Rating: 60V
  • Switching Speed: Fast Switching
  • Certifications: RoHS, Green Product
  • Reliability: 100% EAS Guaranteed

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VDS Drain-Source Voltage -60 V
VGS Gate-Source Voltage ±20 V
ID@TC=25 Continuous Drain Current1 -45 A
ID@TC=100 Continuous Drain Current1 -34 A
IDM Pulsed Drain Current2 -90 A
EAS Single Pulse Avalanche Energy3 113 mJ
IAS Avalanche Current -47.6 A
PD@TC=25 Total Power Dissipation4 86.8 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-Ambient1 --- 62 /W
RJC Thermal Resistance Junction-Case1 --- 1.44 /W
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=-250uA -60 --- --- V
RDS(ON) Static Drain-Source On-Resistance2 VGS=-10V , ID=-18A --- 25 m
VGS=-4.5V , ID=-12A --- 33
VGS(th) Gate Threshold Voltage VGS=VDS , ID =-250uA -1.0 --- -2.5 V
IDSS Drain-Source Leakage Current VDS=-48V , VGS=0V , TJ=25 --- 1 uA
VDS=-48V , VGS=0V , TJ=55 --- 5
IGSS Gate-Source Leakage Current VGS=±20V , VDS=0V --- ±100 nA
gfs Forward Transconductance VDS=-10V , ID=-18A 23 --- S
Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz 7 14
Qg Total Gate Charge (-4.5V) VDS=-20V , VGS=-4.5V , ID=-12A 25 --- nC
Qgs Gate-Source Charge 6.7 ---
Qgd Gate-Drain Charge 5.5 ---
td(on) Turn-On Delay Time VDD=-15V , VGS=-10V , RG=3.3, ID=-1A 38 --- ns
tr Rise Time 23.6 ---
td(off) Turn-Off Delay Time 100 ---
tf Fall Time 6.8 ---
Ciss Input Capacitance VDS=-15V , VGS=0V , f=1MHz 3635 --- pF
Coss Output Capacitance 224 ---
Crss Reverse Transfer Capacitance 141 ---
Diode Characteristics
IS Continuous Source Current1,5 VG=VD=0V , Force Current --- -45 A
VSD Diode Forward Voltage2 VGS=0V , IS=-1A , TJ=25 --- -1 V

Notes:
1. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2. The data tested by pulsed, pulse width ≤ 300µs, duty cycle ≤ 2%.
3. The EAS data shows Max. rating. The test condition is VDD=-25V, VGS=-10V, L=0.1mH, IAS=-47.6A.
4. The power dissipation is limited by 150 junction temperature.
5. The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.


2410121447_HUASHUO-HSH6115_C2828506.pdf
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