High cell density trenched p channel mosfet HUASHUO HSP3105 for synchronous buck converter applications

Key Attributes
Model Number: HSP3105
Product Custom Attributes
Drain To Source Voltage:
30V
Current - Continuous Drain(Id):
60A
Operating Temperature -:
-55℃~+150℃
RDS(on):
-
Gate Threshold Voltage (Vgs(th)):
2.5V
Reverse Transfer Capacitance (Crss@Vds):
237pF@15V
Number:
1 P-Channel
Input Capacitance(Ciss):
2.215nF@15V
Pd - Power Dissipation:
74W
Gate Charge(Qg):
-
Mfr. Part #:
HSP3105
Package:
TO-220
Product Description

Product Overview

The HSP3105 is a high cell density trenched P-channel MOSFET designed for synchronous buck converter applications. It offers excellent RDS(ON) and gate charge characteristics, meeting RoHS and Green Product requirements. This device is 100% EAS guaranteed with full function reliability approval, making it suitable for demanding applications.

Product Attributes

  • Brand: HS-Semi
  • Model: HSP3105
  • Certifications: RoHS, Green Product
  • Reliability: 100% EAS Guaranteed
  • Technology: Advanced high cell density Trench technology

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Units
Absolute Maximum Ratings
VDS Drain-Source Voltage -30 V
VGS Gate-Source Voltage 20 V
ID@TA=25 Continuous Drain Current, VGS @ -10V1 -60 A
ID@TA=70 Continuous Drain Current, VGS @ -10V1 -38 A
IDM Pulsed Drain Current2 -150 A
EAS Single Pulse Avalanche Energy3 125 mJ
IAS Avalanche Current -50 A
PD@TA=25 Total Power Dissipation4 74 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-Ambient1 62 /W
RJA Thermal Resistance Junction-Ambient1(t10s) 1.68 /W
RJC Thermal Resistance Junction-Case1 24 /W
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=-250uA -30 V
RDS(ON),max Static Drain-Source On-Resistance2 VGS=-10V , ID=-30A 10 14 m
RDS(ON),max Static Drain-Source On-Resistance2 VGS=-4.5V , ID=-15A 16 22 m
VGS(th) Gate Threshold Voltage VGS=VDS , ID =-250uA -1.0 -2.5 V
IDSS Drain-Source Leakage Current VDS=-24V , VGS=0V , TJ=25 -1 uA
IDSS Drain-Source Leakage Current VDS=-24V , VGS=0V , TJ=55 -5 uA
IGSS Gate-Source Leakage Current VGS=20V , VDS=0V 100 nA
gfs Forward Transconductance VDS=-5V , ID=-10A 30 S
Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz 9
Qg Total Gate Charge (-4.5V) VDS=-15V , VGS=-4.5V , ID=-15A 22 nC
Qgs Gate-Source Charge 8.7
Qgd Gate-Drain Charge 7.2
Td(on) Turn-On Delay Time VDD=-15V , VGS=-10V , RG=3.3 ID=-15A 8 ns
Tr Rise Time 73.7
Td(off) Turn-Off Delay Time 61.8
Tf Fall Time 24.4
Ciss Input Capacitance VDS=-15V , VGS=0V , f=1MHz 2215 pF
Coss Output Capacitance 310
Crss Reverse Transfer Capacitance 237
IS Continuous Source Current1,5 VG=VD=0V , Force Current -60 A
VSD Diode Forward Voltage2 VGS=0V , IS=-1A , TJ=25 -1 V

Notes:

  • 1 The data tested by surface mounted on a 1 inch 2 FR-4 board with 2OZ copper.
  • 2 The data tested by pulsed, pulse width 300us, duty cycle 2%.
  • 3 The EAS data shows Max. rating. The test condition is VDD=-25V, VGS=-10V, L=0.1mH, IAS=-50A.
  • 4 The power dissipation is limited by 150 junction temperature.
  • 5 The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.

2410121525_HUASHUO-HSP3105_C701027.pdf

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