High cell density trenched p channel mosfet HUASHUO HSP3105 for synchronous buck converter applications
Product Overview
The HSP3105 is a high cell density trenched P-channel MOSFET designed for synchronous buck converter applications. It offers excellent RDS(ON) and gate charge characteristics, meeting RoHS and Green Product requirements. This device is 100% EAS guaranteed with full function reliability approval, making it suitable for demanding applications.
Product Attributes
- Brand: HS-Semi
- Model: HSP3105
- Certifications: RoHS, Green Product
- Reliability: 100% EAS Guaranteed
- Technology: Advanced high cell density Trench technology
Technical Specifications
| Symbol | Parameter | Conditions | Min. | Typ. | Max. | Units |
|---|---|---|---|---|---|---|
| Absolute Maximum Ratings | ||||||
| VDS | Drain-Source Voltage | -30 | V | |||
| VGS | Gate-Source Voltage | 20 | V | |||
| ID@TA=25 | Continuous Drain Current, VGS @ -10V1 | -60 | A | |||
| ID@TA=70 | Continuous Drain Current, VGS @ -10V1 | -38 | A | |||
| IDM | Pulsed Drain Current2 | -150 | A | |||
| EAS | Single Pulse Avalanche Energy3 | 125 | mJ | |||
| IAS | Avalanche Current | -50 | A | |||
| PD@TA=25 | Total Power Dissipation4 | 74 | W | |||
| TSTG | Storage Temperature Range | -55 | 150 | |||
| TJ | Operating Junction Temperature Range | -55 | 150 | |||
| Thermal Data | ||||||
| RJA | Thermal Resistance Junction-Ambient1 | 62 | /W | |||
| RJA | Thermal Resistance Junction-Ambient1(t10s) | 1.68 | /W | |||
| RJC | Thermal Resistance Junction-Case1 | 24 | /W | |||
| Electrical Characteristics (TJ=25 , unless otherwise noted) | ||||||
| BVDSS | Drain-Source Breakdown Voltage | VGS=0V , ID=-250uA | -30 | V | ||
| RDS(ON),max | Static Drain-Source On-Resistance2 | VGS=-10V , ID=-30A | 10 | 14 | m | |
| RDS(ON),max | Static Drain-Source On-Resistance2 | VGS=-4.5V , ID=-15A | 16 | 22 | m | |
| VGS(th) | Gate Threshold Voltage | VGS=VDS , ID =-250uA | -1.0 | -2.5 | V | |
| IDSS | Drain-Source Leakage Current | VDS=-24V , VGS=0V , TJ=25 | -1 | uA | ||
| IDSS | Drain-Source Leakage Current | VDS=-24V , VGS=0V , TJ=55 | -5 | uA | ||
| IGSS | Gate-Source Leakage Current | VGS=20V , VDS=0V | 100 | nA | ||
| gfs | Forward Transconductance | VDS=-5V , ID=-10A | 30 | S | ||
| Rg | Gate Resistance | VDS=0V , VGS=0V , f=1MHz | 9 | |||
| Qg | Total Gate Charge (-4.5V) | VDS=-15V , VGS=-4.5V , ID=-15A | 22 | nC | ||
| Qgs | Gate-Source Charge | 8.7 | ||||
| Qgd | Gate-Drain Charge | 7.2 | ||||
| Td(on) | Turn-On Delay Time | VDD=-15V , VGS=-10V , RG=3.3 ID=-15A | 8 | ns | ||
| Tr | Rise Time | 73.7 | ||||
| Td(off) | Turn-Off Delay Time | 61.8 | ||||
| Tf | Fall Time | 24.4 | ||||
| Ciss | Input Capacitance | VDS=-15V , VGS=0V , f=1MHz | 2215 | pF | ||
| Coss | Output Capacitance | 310 | ||||
| Crss | Reverse Transfer Capacitance | 237 | ||||
| IS | Continuous Source Current1,5 | VG=VD=0V , Force Current | -60 | A | ||
| VSD | Diode Forward Voltage2 | VGS=0V , IS=-1A , TJ=25 | -1 | V | ||
Notes:
- 1 The data tested by surface mounted on a 1 inch 2 FR-4 board with 2OZ copper.
- 2 The data tested by pulsed, pulse width 300us, duty cycle 2%.
- 3 The EAS data shows Max. rating. The test condition is VDD=-25V, VGS=-10V, L=0.1mH, IAS=-50A.
- 4 The power dissipation is limited by 150 junction temperature.
- 5 The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.
2410121525_HUASHUO-HSP3105_C701027.pdf
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