High cell density trench technology P channel mosfet HUASHUO HSM4435 with 30 volt rating and low gate charge

Key Attributes
Model Number: HSM4435
Product Custom Attributes
Drain To Source Voltage:
30V
Current - Continuous Drain(Id):
9.5A
RDS(on):
20mΩ@10V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
2.5V@250uA
Type:
P-Channel
Reverse Transfer Capacitance (Crss@Vds):
158pF
Number:
1 P-Channel
Output Capacitance(Coss):
194pF
Pd - Power Dissipation:
3.1W
Input Capacitance(Ciss):
1.345nF
Gate Charge(Qg):
12.6nC@4.5V
Mfr. Part #:
HSM4435
Package:
SOP-8
Product Description

Product Overview

The HSM4435 is a P-channel, 30V fast-switching MOSFET designed with high cell density trench technology. It offers excellent RDS(ON) and low gate charge, making it suitable for synchronous buck converter applications. This MOSFET meets RoHS and Green Product requirements and is 100% EAS guaranteed with full function reliability approval. Key features include 100% EAS guaranteed, Green Device availability, super low gate charge, excellent CdV/dt effect decline, and advanced high cell density trench technology.

Product Attributes

  • Brand: HS-Semi
  • Product Type: P-Ch MOSFETs
  • Certifications: RoHS, Green Product
  • Reliability: 100% EAS Guaranteed, Full Function Reliability Approved

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VDS Drain-Source Voltage -30 V
VGS Gate-Source Voltage 20 V
ID@TA=25 Continuous Drain Current, VGS @ -10V1 -9.5 A
ID@TA=70 Continuous Drain Current, VGS @ -10V1 -7.6 A
IDM Pulsed Drain Current2 -50 A
EAS Single Pulse Avalanche Energy3 72.2 mJ
IAS Avalanche Current -38 A
PD@TA=25 Total Power Dissipation4 3.1 W
PD@TA=70 Total Power Dissipation4 2 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-Ambient1 75 /W
RJA Thermal Resistance Junction-Ambient1(t10s) 40 /W
RJC Thermal Resistance Junction-Case1 24 /W
VDS -30 V
RDS(ON),typ 18 m
ID -9.5 A
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=-250uA -30 V
BVDSS/TJ BVDSS Temperature Coefficient Reference to 25 , ID=-1mA -0.022 V/
RDS(ON) Static Drain-Source On-Resistance2 VGS=-10V , ID=-6A 18 20 m
VGS=-4.5V , ID=-4A 27 32 m
VGS(th) Gate Threshold Voltage VGS=VDS , ID =-250uA -1.0 -2.5 V
VGS(th) VGS(th) Temperature Coefficient 4.6 mV/
IDSS Drain-Source Leakage Current VDS=-24V , VGS=0V , TJ=25 -1 uA
VDS=-24V , VGS=0V , TJ=55 -5 uA
IGSS Gate-Source Leakage Current VGS=20V , VDS=0V 100 nA
gfs Forward Transconductance VDS=-5V , ID=-6A 17 S
Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz 13
Qg Total Gate Charge (-4.5V) VDS=-15V , VGS=-4.5V , ID=-6A 12.6 nC
Qgs Gate-Source Charge 4.8
Qgd Gate-Drain Charge 4.8
td(on) Turn-On Delay Time VDD=-15V , VGS=-10V , RG=3.3, ID=-6A 4.6 ns
tr Rise Time 14.8 ns
td(off) Turn-Off Delay Time 41 ns
tf Fall Time 19.6 ns
Ciss Input Capacitance VDS=-15V , VGS=0V , f=1MHz 1345 pF
Coss Output Capacitance 194 pF
Crss Reverse Transfer Capacitance 158 pF
Diode Characteristics
IS Continuous Source Current1,5 VG=VD=0V , Force Current -9.5 A
ISM Pulsed Source Current2,5 -50 A
VSD Diode Forward Voltage2 VGS=0V , IS=-1A , TJ=25 -1.2 V
trr Reverse Recovery Time IF=-6A , dI/dt=100A/s , TJ=25 16.3 nS
Qrr Reverse Recovery Charge 5.9 nC
Ordering Information
Part Number Package code Packaging
HSM4435 SOP-8 4000/Tape&Reel

Notes:
1 The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2 The data tested by pulsed, pulse width 300us, duty cycle 2%.
3 The EAS data shows Max. rating. The test condition is VDD=-25V, VGS=-10V, L=0.1mH, IAS=-38A.
4 The power dissipation is limited by 150 junction temperature.
5 The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.


2410121455_HUASHUO-HSM4435_C2908112.pdf
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