High cell density trench technology P channel mosfet HUASHUO HSM4435 with 30 volt rating and low gate charge
Product Overview
The HSM4435 is a P-channel, 30V fast-switching MOSFET designed with high cell density trench technology. It offers excellent RDS(ON) and low gate charge, making it suitable for synchronous buck converter applications. This MOSFET meets RoHS and Green Product requirements and is 100% EAS guaranteed with full function reliability approval. Key features include 100% EAS guaranteed, Green Device availability, super low gate charge, excellent CdV/dt effect decline, and advanced high cell density trench technology.
Product Attributes
- Brand: HS-Semi
- Product Type: P-Ch MOSFETs
- Certifications: RoHS, Green Product
- Reliability: 100% EAS Guaranteed, Full Function Reliability Approved
Technical Specifications
| Symbol | Parameter | Conditions | Min. | Typ. | Max. | Unit |
|---|---|---|---|---|---|---|
| Absolute Maximum Ratings | ||||||
| VDS | Drain-Source Voltage | -30 | V | |||
| VGS | Gate-Source Voltage | 20 | V | |||
| ID@TA=25 | Continuous Drain Current, VGS @ -10V1 | -9.5 | A | |||
| ID@TA=70 | Continuous Drain Current, VGS @ -10V1 | -7.6 | A | |||
| IDM | Pulsed Drain Current2 | -50 | A | |||
| EAS | Single Pulse Avalanche Energy3 | 72.2 | mJ | |||
| IAS | Avalanche Current | -38 | A | |||
| PD@TA=25 | Total Power Dissipation4 | 3.1 | W | |||
| PD@TA=70 | Total Power Dissipation4 | 2 | W | |||
| TSTG | Storage Temperature Range | -55 | 150 | |||
| TJ | Operating Junction Temperature Range | -55 | 150 | |||
| Thermal Data | ||||||
| RJA | Thermal Resistance Junction-Ambient1 | 75 | /W | |||
| RJA | Thermal Resistance Junction-Ambient1(t10s) | 40 | /W | |||
| RJC | Thermal Resistance Junction-Case1 | 24 | /W | |||
| VDS | -30 | V | ||||
| RDS(ON),typ | 18 | m | ||||
| ID | -9.5 | A | ||||
| Electrical Characteristics (TJ=25 , unless otherwise noted) | ||||||
| BVDSS | Drain-Source Breakdown Voltage | VGS=0V , ID=-250uA | -30 | V | ||
| BVDSS/TJ | BVDSS Temperature Coefficient | Reference to 25 , ID=-1mA | -0.022 | V/ | ||
| RDS(ON) | Static Drain-Source On-Resistance2 | VGS=-10V , ID=-6A | 18 | 20 | m | |
| VGS=-4.5V , ID=-4A | 27 | 32 | m | |||
| VGS(th) | Gate Threshold Voltage | VGS=VDS , ID =-250uA | -1.0 | -2.5 | V | |
| VGS(th) | VGS(th) Temperature Coefficient | 4.6 | mV/ | |||
| IDSS | Drain-Source Leakage Current | VDS=-24V , VGS=0V , TJ=25 | -1 | uA | ||
| VDS=-24V , VGS=0V , TJ=55 | -5 | uA | ||||
| IGSS | Gate-Source Leakage Current | VGS=20V , VDS=0V | 100 | nA | ||
| gfs | Forward Transconductance | VDS=-5V , ID=-6A | 17 | S | ||
| Rg | Gate Resistance | VDS=0V , VGS=0V , f=1MHz | 13 | |||
| Qg | Total Gate Charge (-4.5V) | VDS=-15V , VGS=-4.5V , ID=-6A | 12.6 | nC | ||
| Qgs | Gate-Source Charge | 4.8 | ||||
| Qgd | Gate-Drain Charge | 4.8 | ||||
| td(on) | Turn-On Delay Time | VDD=-15V , VGS=-10V , RG=3.3, ID=-6A | 4.6 | ns | ||
| tr | Rise Time | 14.8 | ns | |||
| td(off) | Turn-Off Delay Time | 41 | ns | |||
| tf | Fall Time | 19.6 | ns | |||
| Ciss | Input Capacitance | VDS=-15V , VGS=0V , f=1MHz | 1345 | pF | ||
| Coss | Output Capacitance | 194 | pF | |||
| Crss | Reverse Transfer Capacitance | 158 | pF | |||
| Diode Characteristics | ||||||
| IS | Continuous Source Current1,5 | VG=VD=0V , Force Current | -9.5 | A | ||
| ISM | Pulsed Source Current2,5 | -50 | A | |||
| VSD | Diode Forward Voltage2 | VGS=0V , IS=-1A , TJ=25 | -1.2 | V | ||
| trr | Reverse Recovery Time | IF=-6A , dI/dt=100A/s , TJ=25 | 16.3 | nS | ||
| Qrr | Reverse Recovery Charge | 5.9 | nC | |||
| Ordering Information | ||||||
| Part Number | Package code | Packaging | ||||
| HSM4435 | SOP-8 | 4000/Tape&Reel | ||||
Notes:
1 The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2 The data tested by pulsed, pulse width 300us, duty cycle 2%.
3 The EAS data shows Max. rating. The test condition is VDD=-25V, VGS=-10V, L=0.1mH, IAS=-38A.
4 The power dissipation is limited by 150 junction temperature.
5 The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.
2410121455_HUASHUO-HSM4435_C2908112.pdf
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