p channel mosfet HUASHUO HSBA6117 featuring fast switching and low gate charge for power management solutions

Key Attributes
Model Number: HSBA6117
Product Custom Attributes
Drain To Source Voltage:
60V
Current - Continuous Drain(Id):
60A
Operating Temperature -:
-55℃~+150℃
RDS(on):
14mΩ@4.5V,12A
Gate Threshold Voltage (Vgs(th)):
1V
Reverse Transfer Capacitance (Crss@Vds):
241pF@30V
Number:
1 P-Channel
Input Capacitance(Ciss):
4.635nF@30V
Pd - Power Dissipation:
90W
Gate Charge(Qg):
85nC@10V
Mfr. Part #:
HSBA6117
Package:
PRPAK5x6-8L
Product Description

Product Overview

The HSBA6117 is a P-channel, 60V fast-switching MOSFET designed with high cell density trench technology. It offers excellent RDS(ON) and gate charge, making it suitable for synchronous buck converter applications. This MOSFET meets RoHS and Green Product requirements, is 100% EAS guaranteed, and features approved full function reliability. Key advantages include super low gate charge, excellent CdV/dt effect decline, and advanced high cell density trench technology.

Product Attributes

  • Brand: HS-Semi
  • Product Type: P-Channel MOSFET
  • Certifications: RoHS, Green Product
  • Reliability: 100% EAS Guaranteed, Full Function Reliability Approved

Technical Specifications

Parameter Rating Units Conditions Min. Typ. Max.
VDS Drain-Source Voltage -60 V
VGS Gate-Source Voltage 20 V
ID@TC=25 Continuous Drain Current, -VGS @ -10V1 -60 A
ID@TC=100 Continuous Drain Current, -VGS @ -10V1 -35 A
IDM Pulsed Drain Current2 -170 A
EAS Single Pulse Avalanche Energy3 330 mJ
IAS Avalanche Current 40 A
PD@TC=25 Total Power Dissipation4 90 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
RJA Thermal Resistance Junction-Ambient1 --- /W 62
RJC Thermal Resistance Junction-Case1 --- /W 1.3
BVDSS Drain-Source Breakdown Voltage -60 V VGS=0V , ID=-250uA
RDS(ON) Static Drain-Source On-Resistance2 --- m VGS=-10V , ID=-18A 14
RDS(ON) Static Drain-Source On-Resistance2 --- m VGS=-4.5V , ID=-12A 17
VGS(th) Gate Threshold Voltage -1.0 V VGS=VDS , ID =-250uA -2.5
VGS(th) VGS(th) Temperature Coefficient --- mV/ 4.28
IDSS Drain-Source Leakage Current --- uA VDS=-48V , VGS=0V , TJ=25 1
IDSS Drain-Source Leakage Current --- uA VDS=-48V , VGS=0V , TJ=55 5
IGSS Gate-Source Leakage Current --- nA VGS=20V , VDS=0V 100
gfs Forward Transconductance --- S VDS=-10V , ID=-18A 43
Rg Gate Resistance --- VDS=0V , VGS=0V , f=1MHz 2.6
Qg Total Gate Charge --- nC VDS=-30V , VGS=-10V , ID=-12A 85
Qgs Gate-Source Charge --- nC 11
Qgd Gate-Drain Charge --- nC 30
td(on) Turn-On Delay Time --- ns VDD=-30V , VGS=-10V , RG=6, ID=-1A 18
tr Rise Time --- ns 12
td(off) Turn-Off Delay Time --- ns 100
tf Fall Time --- ns 68
Ciss Input Capacitance --- pF VDS=-30V , VGS=0V , f=1MHz 4635
Coss Output Capacitance --- pF 524
Crss Reverse Transfer Capacitance --- pF 241
IS Continuous Source Current1,5 --- A VG=VD=0V , Force Current -40
VSD Diode Forward Voltage2 --- V VGS=0V , IS=-1A , TJ=25 -1.2

Notes:
1. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2. The data tested by pulsed, pulse width 300s, duty cycle 2%.
3. The EAS data shows Max. rating. The test condition is VDD=-30V, VGS=-10V, L=0.5mH, IAS=-40A.
4. The power dissipation is limited by 150 junction temperature.
5. The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.

Ordering Information

Part Number Package Code Packaging Quantity
HSBA6117 PRPAK5*6 Tape&Reel 3000

2410121630_HUASHUO-HSBA6117_C5341692.pdf
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