200V fast switching MOSFET HUASHUO HSL3P20 P channel device with trench technology and low gate charge
Product Overview
The HSL3P20 is a P-channel, 200V fast switching MOSFET featuring high cell density trench technology. It offers excellent RDS(ON) and efficiency, making it suitable for most low-power switching and load switch applications. This device meets RoHS and Green Product requirements and is available in a Green Device option. Key advantages include super low gate charge, excellent Cdv/dt effect decline, and advanced high cell density trench technology.
Product Attributes
- Brand: HSL
- Type: P-Channel MOSFET
- Technology: Trench
- Certifications: RoHS, Green Product
Technical Specifications
| Symbol | Parameter | Conditions | Min. | Typ. | Max. | Unit |
|---|---|---|---|---|---|---|
| VDS | Drain-Source Voltage | -200 | V | |||
| VGS | Gate-Source Voltage | 20 | V | |||
| ID@TC=25 | Continuous Drain Current, VGS @ -10V1 | -3 | A | |||
| ID@TC=70 | Continuous Drain Current, VGS @ -10V1 | -2 | A | |||
| ID@TA=25 | Continuous Drain Current, VGS @ -10V1 | -0.9 | A | |||
| ID@TA=70 | Continuous Drain Current, VGS @ -10V1 | -0.68 | A | |||
| IDM | Pulsed Drain Current2 | -3.5 | A | |||
| PD@TA=25 | Total Power Dissipation3 | 1.5 | W | |||
| TSTG | Storage Temperature Range | -55 | 150 | |||
| TJ | Operating Junction Temperature Range | -55 | 150 | |||
| RJA | Thermal Resistance Junction-ambient | 85 | /W | |||
| RJC | Thermal Resistance Junction-Case1 | 36 | /W | |||
| BVDSS | Drain-Source Breakdown Voltage | VGS=0V , ID=-250uA | -200 | V | ||
| RDS(ON) | Static Drain-Source On-Resistance2 | VGS=-10V , ID=-0.5A | 1.9 | 2.4 | ||
| VGS(th) | Gate Threshold Voltage | VGS=VDS , ID =-250uA | -2.0 | -3.0 | -4.0 | V |
| IDSS | Drain-Source Leakage Current | VDS=-160V , VGS=0V , TJ=25 | 1 | uA | ||
| IDSS | Drain-Source Leakage Current | VDS=-160V , VGS=0V , TJ=55 | 10 | uA | ||
| IGSS | Gate-Source Leakage Current | VGS=20V , VDS=0V | 100 | nA | ||
| gfs | Forward Transconductance | VDS=-5V , ID=-0.8A | 0.5 | S | ||
| Qg | Total Gate Charge | VDS=-100V , VGS=-4.5V , ID=-0.5A | 8.5 | nC | ||
| Qgs | Gate-Source Charge | 1.5 | ||||
| Qgd | Gate-Drain Charge | 1.8 | ||||
| Td(on) | Turn-On Delay Time | VDD=-100V , VGS=-10V , RG=6 ID=-0.5A | 1.9 | ns | ||
| Tr | Rise Time | 1.2 | ns | |||
| Td(off) | Turn-Off Delay Time | 22 | ns | |||
| Tf | Fall Time | 11 | ns | |||
| Ciss | Input Capacitance | VDS=-100V , VGS=0V , f=1MHz | 500 | pF | ||
| Coss | Output Capacitance | 39 | pF | |||
| Crss | Reverse Transfer Capacitance | 20 | pF | |||
| IS | Continuous Source Current1,4 | VG=VD=0V , Force Current | -1.2 | A | ||
| ISM | Pulsed Source Current2,4 | -3.5 | A | |||
| VSD | Diode Forward Voltage2 | VGS=0V , IS=-1A , TJ=25 | -1.3 | V |
Notes:
1. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2. The data tested by pulsed, pulse width 300s, duty cycle 2%.
3. The power dissipation is limited by 150 junction temperature.
4. The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.
2410122016_HUASHUO-HSL3P20_C22359225.pdf
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