Low RDS ON 100V N Channel MOSFET HUASHUO HSH15810 Designed for High Frequency Switching and Battery Management

Key Attributes
Model Number: HSH15810
Product Custom Attributes
Drain To Source Voltage:
100V
Current - Continuous Drain(Id):
120A
Operating Temperature -:
-55℃~+150℃
RDS(on):
4.5mΩ@10V,30A
Gate Threshold Voltage (Vgs(th)):
2V
Reverse Transfer Capacitance (Crss@Vds):
14pF@50V
Number:
1 N-channel
Input Capacitance(Ciss):
4.725nF@50V
Pd - Power Dissipation:
227W
Gate Charge(Qg):
72nC@10V
Mfr. Part #:
HSH15810
Package:
TO-263
Product Description

Product Overview

The HSH15810 is a N-Channel, 100V fast switching MOSFET designed for high-frequency applications. It features a super low RDS(ON) and utilizes advanced high cell density Trench technology. This device is 100% EAS Guaranteed and is available as a Green Device. Key applications include motor drivers, Battery Management Systems (BMS), and high-frequency switching with synchronous rectification.

Product Attributes

  • Brand: HS-Semi
  • Technology: Advanced high cell density Trench technology
  • Certifications: 100% EAS Guaranteed, Green Device Available

Technical Specifications

Model Parameter Conditions Min. Typ. Max. Unit
HSH15810 Drain-Source Voltage (VDS) 100 V
Gate-Source Voltage (VGS) ±20 V
Continuous Drain Current (ID@TC=25) VGS @ 10V1,6 120 A
Continuous Drain Current (ID@TC=100) VGS @ 10V1,6 100 A
Pulsed Drain Current (IDM)2 480 A
Single Pulse Avalanche Energy (EAS)3 196 mJ
Avalanche Current (IAS) 28 A
Total Power Dissipation (PD@TC=25)4 227 W
Storage Temperature Range (TSTG) -55 150
Operating Junction Temperature Range (TJ) -55 150
Drain-Source Breakdown Voltage (BVDSS) VGS=0V , ID=250uA 100 V
Static Drain-Source On-Resistance (RDS(ON))2 VGS=10V , ID=30A 3.7 4.5
Gate Threshold Voltage (VGS(th)) VGS=VDS , ID =250uA 2.0 3.0 4.0 V
Drain-Source Leakage Current (IDSS) VDS=100V , VGS=0V , TJ=25 1 µA
HSH15810 Drain-Source Leakage Current (IDSS) VDS=100V , VGS=0V , TJ=125 10 µA
Gate-Source Leakage Current (IGSS) VGS=±20V , VDS=0V ±100 nA
HSH15810 Thermal Resistance Junction-Ambient (RθJA) --- 62 °C/W
Thermal Resistance Junction-Case (RθJC)1 --- 0.5 °C/W
Forward Transconductance (gfs) VDS=5V , ID=30A 50 S
Gate Resistance (Rg) VDS=0V , VGS=0V , f=1MHz 1 Ω
Total Gate Charge (Qg) (10V) VDS=50V , VGS=10V , ID=20A 72 nC
Gate-Source Charge (Qgs) 28
Gate-Drain Charge (Qgd) 15
Turn-On Delay Time (Td(on)) VDD=50V , VGS=10V , RG=3.0Ω, ID=20A 35 ns
Rise Time (Tr) 18 ns
Turn-Off Delay Time (Td(off)) 45 ns
Fall Time (Tf) 55 ns
HSH15810 Input Capacitance (Ciss) VDS=50V , VGS=0V , f=1MHz 4725 pF
Output Capacitance (Coss) 609 pF
Reverse Transfer Capacitance (Crss) 14 pF
HSH15810 Continuous Source Current (IS)1,5 VG=VD=0V , Force Current 120 A
Diode Forward Voltage (VSD)2 VGS=0V , IS=50A , TJ=25 1.3 V
Reverse Recovery Time (trr) IF=30A , dI/dt=100A/µs , TJ=25 70 ns
HSH15810 Reverse Recovery Charge (Qrr) 170 nC

2410121642_HUASHUO-HSH15810_C701020.pdf

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