Single N Channel Enhancement Mode MOSFET HUAYI HYG025N06LS1B with Low RDS ON and High Current Rating

Key Attributes
Model Number: HYG025N06LS1B
Product Custom Attributes
Drain To Source Voltage:
60V
Current - Continuous Drain(Id):
160A
Operating Temperature -:
-55℃~+175℃
RDS(on):
3.3mΩ@10V
Gate Threshold Voltage (Vgs(th)):
3V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
10.2pF
Number:
1 N-channel
Output Capacitance(Coss):
1.31nF
Input Capacitance(Ciss):
3.915nF
Pd - Power Dissipation:
125W
Gate Charge(Qg):
58.3nC@10V
Mfr. Part #:
HYG025N06LS1B
Package:
TO-263-2L
Product Description

HYG025N06LS1P/B Single N-Channel Enhancement Mode MOSFET

The HYG025N06LS1P/B is a single N-Channel enhancement mode MOSFET designed for high-performance applications. It features low on-state resistance (RDS(ON) = 2.5 m typ. @ VGS = 10V) and high continuous drain current capability (160A). This MOSFET is 100% avalanche tested, reliable, and rugged, with halogen-free devices available (RoHS Compliant). It is suitable for high frequency point-of-load synchronous buck converters and power tool applications.

Product Attributes

  • Brand: Hymexa
  • Product Code: HYG025N06LS1P/B
  • Channel Type: Single N-Channel
  • Mode: Enhancement Mode
  • Certifications: RoHS Compliant, Halogen-Free Available

Technical Specifications

Parameter Rating Unit Test Conditions Min Typ. Max
Absolute Maximum Ratings
Drain-Source Voltage (VDSS) 60 V Tc=25C Unless Otherwise Noted - - -
Gate-Source Voltage (VGSS) 20 V - - - -
Maximum Junction Temperature (TJ) -55 to 175 C - - - -
Storage Temperature Range (TSTG) -55 to 175 C - - - -
Source Current-Continuous (IS) (Body Diode) 160 A Tc=25C, Mounted on Large Heat Sink - - -
Pulsed Drain Current (IDM) 620 A Tc=25C, pulse width limited by max.junction temperature - - -
Continuous Drain Current (ID) 160 A Tc=25C - - -
Continuous Drain Current (ID) 113 A Tc=100C - - -
Maximum Power Dissipation (PD) 125 W Tc=25C - - -
Maximum Power Dissipation (PD) 62.5 W Tc=100C - - -
Thermal Resistance, Junction-to-Case (RJC) 1.2 C/W - - - -
Thermal Resistance, Junction-to-Ambient (RJA) 62 C/W Surface mounted on FR-4 board - - -
Single Pulsed-Avalanche Energy (EAS) 301.8 mJ L=0.3mH, Limited by TJmax, starting TJ=25C, VDS =48V.,VGS =10V - - -
Static Characteristics
Drain-Source Breakdown Voltage (BVDSS) 60 V VGS=0V,IDS=250A 60 - -
Drain-to-Source Leakage Current (IDSS) 1 A VDS=60V,VGS=0V - - 1
Drain-to-Source Leakage Current (IDSS) 50 A TJ=100C - - 50
Gate Threshold Voltage (VGS(th)) 1.0 to 3.0 V VDS=VGS, IDS=250A 1.0 2.1 3.0
Gate-Source Leakage Current (IGSS) 100 nA VGS=20V,VDS=0V - - 100
Drain-Source On-State Resistance (RDS(ON)) 2.5 to 3.3 m VGS=10V,IDS=40A - 2.5 3.3
Drain-Source On-State Resistance (RDS(ON)) 3.8 to 4.6 m VGS=4.5V,IDS=40A - 3.8 4.6
Diode Characteristics
Diode Forward Voltage (VSD) 0.85 to 1.3 V ISD=40A,VGS=0V - 0.85 1.3
Reverse Recovery Time (trr) 41.1 ns ISD=40A,dISD/dt=100A/s - 41.1 -
Reverse Recovery Charge (Qrr) 48.2 nC - - 48.2 -
Dynamic Characteristics
Gate Resistance (RG) 0.58 VGS=0V,VDS=0V,F=1MHz - 0.58 -
Input Capacitance (Ciss) 3915 pF VGS=0V, VDS=25V, Frequency=1.0MHz - 3915 -
Output Capacitance (Coss) 1310 pF - - 1310 -
Reverse Transfer Capacitance (Crss) 10.2 pF - - 10.2 -
Turn-on Delay Time (td(ON)) 15.3 ns VDD=30V,RG=4, IDS=40A,VGS=10V - 15.3 -
Turn-on Rise Time (Tr) 34 ns - - 34 -
Turn-off Delay Time (td(OFF)) 33 ns - - 33 -
Turn-off Fall Time (Tf) 9.4 ns - - 9.4 -
Gate Charge Characteristics
Total Gate Charge (Qg(10V)) 58.3 nC VDS =48V, VGS=10V, ID=40A - 58.3 -
Total Gate Charge (Qg(4.5V)) 27.7 nC - - 27.7 -
Gate-Source Charge (Qgs) 15.7 nC - - 15.7 -
Gate-Drain Charge (Qgd) 9.7 nC - - 9.7 -

2409302203_HUAYI-HYG025N06LS1B_C2836680.pdf

Contact Our Experts And Get A Free Consultation!

Our mission is to offer "High Quality" & "Good Service" & "Fast Delivery" to help our clients to gain more profits.