Power Switching MOSFET HUASHUO HSL3002 N Channel Trenched Device with Low Gate Charge and High Density

Key Attributes
Model Number: HSL3002
Product Custom Attributes
Drain To Source Voltage:
30V
Current - Continuous Drain(Id):
6A
Operating Temperature -:
-55℃~+150℃@(Tj)
RDS(on):
24mΩ@10V,5A
Gate Threshold Voltage (Vgs(th)):
2.5V
Reverse Transfer Capacitance (Crss@Vds):
59pF@15V
Number:
1 N-channel
Input Capacitance(Ciss):
583pF@15V
Pd - Power Dissipation:
1.5W
Gate Charge(Qg):
6nC@4.5V
Mfr. Part #:
HSL3002
Package:
SOT-223
Product Description

Product Overview

The HSL3002 is a high cell density trenched N-channel MOSFET designed for fast switching applications, particularly in synchronous buck converter circuits. It offers excellent RDS(ON) and gate charge characteristics. This device meets RoHS and Green Product requirements and is 100% EAS guaranteed with full functional reliability approval. Key advantages include super low gate charge, excellent Cdv/dt effect decline, and advanced high cell density trench technology.

Product Attributes

  • Brand: HSL
  • Product Type: N-Ch MOSFET
  • Technology: Trench
  • Certifications: RoHS, Green Product
  • Reliability: 100% EAS Guaranteed

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VDS Drain-Source Voltage 30 V
VGS Gate-Source Voltage ±20 V
ID@TA=25 Continuous Drain Current, VGS @ 10V1 6 A
ID@TA=70 Continuous Drain Current, VGS @ 10V1 4.7 A
IDM Pulsed Drain Current2 30 A
PD@TA=25 Total Power Dissipation4 1.5 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-ambient 85 /W
RJC Thermal Resistance Junction-Case1 48 /W
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=250uA 30 --- --- V
ΔBVDSS/ΔTJ BVDSS Temperature Coefficient Reference to 25 , ID=1mA --- 0.025 --- V/
RDS(ON) Static Drain-Source On-Resistance2 VGS=10V , ID=5A --- 24 28 m
VGS=4.5V , ID=4A --- 34 40 VGS
VGS(th) Gate Threshold Voltage VGS=VDS , ID =250uA 1.2 1.5 2.5 V
ΔVGS(th)/ΔTJ VGS(th) Temperature Coefficient --- -4.8 --- mV/
IDSS Drain-Source Leakage Current VDS=24V , VGS=0V , TJ=25 --- --- 1 uA
VDS=24V , VGS=0V , TJ=55 --- --- 5
IGSS Gate-Source Leakage Current VGS=±20V , VDS=0V --- --- ±100 nA
gfs Forward Transconductance VDS=5V , ID=5A --- 7 --- S
Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz --- 2.5 5
Qg Total Gate Charge (4.5V) VDS=15V , VGS=4.5V , ID=5A --- 6 --- nC
Qgs Gate-Source Charge --- 2.2 ---
Qgd Gate-Drain Charge --- 2 ---
td(on) Turn-On Delay Time VDD=15V , VGS=10V , RG=3.3 , ID=5A --- 2.2 --- ns
tr Rise Time --- 8 ---
td(off) Turn-Off Delay Time --- 22 ---
tf Fall Time --- 4 ---
Ciss Input Capacitance VDS=15V , VGS=0V , f=1MHz --- 583 --- pF
Coss Output Capacitance --- 77 ---
Crss Reverse Transfer Capacitance --- 59 ---
Diode Characteristics
IS Continuous Source Current1,5 VG=VD=0V , Force Current --- --- 6 A
ISM Pulsed Source Current2,5 --- --- 30 A
VSD Diode Forward Voltage2 VGS=0V , IS=1A , TJ=25 --- --- 1.2 V
trr Reverse Recovery Time IF=5A , dI/dt=100A/s , TJ=25 --- 19 --- nS
Qrr Reverse Recovery Charge --- 1.1 --- nC

2410121656_HUASHUO-HSL3002_C7543689.pdf
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