N Channel MOSFET 120V HUASHUO HSU48N12A Fast Switching Component for TV Converters and Power Systems

Key Attributes
Model Number: HSU48N12A
Product Custom Attributes
Drain To Source Voltage:
120V
Current - Continuous Drain(Id):
48A
Operating Temperature -:
-55℃~+150℃
RDS(on):
30mΩ@10V,30A
Gate Threshold Voltage (Vgs(th)):
4V
Reverse Transfer Capacitance (Crss@Vds):
3.7pF@50V
Number:
1 N-channel
Input Capacitance(Ciss):
1.39nF@50V
Pd - Power Dissipation:
113W
Gate Charge(Qg):
20.6nC@10V
Mfr. Part #:
HSU48N12A
Package:
TO-252
Product Description

HSU48N12A N-Channel 120V Fast Switching MOSFET

The HSU48N12A is a high-performance N-channel MOSFET designed for fast switching applications. Leveraging Advanced Trench MOS Technology, this device offers 100% EAS Tested and is available as a Green Device. It is ideal for power management in TV converters and DC/DC converters, providing efficient power handling with its robust design and low on-resistance characteristics.

Product Attributes

  • Brand: HS-Semi
  • Technology: Advanced Trench MOS
  • Device Type: N-Channel MOSFET
  • Features: 100% EAS Tested, Green Device Available

Technical Specifications

Parameter Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VDS 120 V
VGS ±20 V
ID@TC=25 VGS @ 10V1 48 A
ID@TC=100 VGS @ 10V1 34 A
ID@TA=25 VGS @ 10V1 6.6 A
ID@TA=100 VGS @ 10V1 5.5 A
IDM Pulsed Drain Current2 150 A
EAS Single Pulse Avalanche Energy3 6 mJ
IAS Avalanche Current 5 A
PD@TC=25 Total Power Dissipation4 113 W
PD@TA=25 Total Power Dissipation4 2.5 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-Ambient1 --- 50 /W
RJC Thermal Resistance Junction-Case1 --- 1.1 /W
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage (VGS=0V , ID=250uA) 120 --- --- V
RDS(ON),max Static Drain-Source On-Resistance2 (VGS=10V , ID=30A) --- 25 30 m
VGS(th) Gate Threshold Voltage (VGS=VDS , ID =250uA) 2.0 3.0 4.0 V
VGS(th) VGS(th) Temperature Coefficient --- -5.5 --- mV/
IDSS Drain-Source Leakage Current (VDS=96V , VGS=0V , TJ=25) --- --- 1 uA
IDSS Drain-Source Leakage Current (VDS=96V , VGS=0V , TJ=55) --- --- 5 uA
IGSS Gate-Source Leakage Current (VGS=±20V , VDS=0V) --- --- ±100 nA
gfs Forward Transconductance (VDS=5V , ID=20A) --- 50 --- S
Qg Total Gate Charge (10V) (VDS=50V , VGS=10V , ID=20A) --- 20.6 --- nC
Qgs Gate-Source Charge --- 6.8 ---
Qgd Gate-Drain Charge --- 5.3 ---
Td(on) Turn-On Delay Time (VDD=30V , VGS=10V , RG=3.3, ID=1A) --- 12.6 --- ns
Tr Rise Time --- 8.2 ---
Td(off) Turn-Off Delay Time --- 30.8 ---
Tf Fall Time --- 13.2 ---
Ciss Input Capacitance (VDS=50V , VGS=0V , f=1MHz) --- 1390 --- pF
Coss Output Capacitance --- 198 ---
Crss Reverse Transfer Capacitance --- 3.7 ---
Diode Characteristics
IS Continuous Source Current1,5 (VG=VD=0V , Force Current) --- --- 20 A
VSD Diode Forward Voltage2 (VGS=0V , IS=1A , TJ=25) --- --- 1.2 V
trr Reverse Recovery Time (IF=20A , dI/dt=100A/s , TJ=25) --- 54 --- nS
Qrr Reverse Recovery Charge --- 167 --- nC

Notes:
1: Tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2: Tested by pulsed, pulse width ≤ 300µs, duty cycle ≤ 2%.
3: EAS data shows Max. rating. Test condition is VDS=25V, VGS=10V, L=0.5mH, IAS=5A.
4: Power dissipation is limited by 150 junction temperature.
5: Data is theoretically the same as ID and IDM; in real applications, should be limited by total power dissipation.


2410121655_HUASHUO-HSU48N12A_C5341696.pdf

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