High Cell Density Trench N Channel MOSFET HUASHUO HSU50N06 Suitable for Fast Switching Applications

Key Attributes
Model Number: HSU50N06
Product Custom Attributes
Drain To Source Voltage:
60V
Current - Continuous Drain(Id):
55A
Operating Temperature -:
-55℃~+150℃
RDS(on):
16mΩ@10V,20A
Gate Threshold Voltage (Vgs(th)):
2.5V
Reverse Transfer Capacitance (Crss@Vds):
107pF@48V
Number:
1 N-channel
Pd - Power Dissipation:
45W
Input Capacitance(Ciss):
2.823nF@48V
Gate Charge(Qg):
23nC@4.5V
Mfr. Part #:
HSU50N06
Package:
TO-252-2
Product Description

Product Overview

The HSU50N06 is a high cell density trenched N-channel MOSFET designed for fast switching applications, particularly in synchronous buck converter circuits. It offers excellent RDS(ON) and gate charge characteristics, meeting RoHS and Green Product requirements. This MOSFET is 100% EAS guaranteed with full function reliability approval, featuring super low gate charge, excellent CdV/dt effect decline, and advanced high cell density Trench technology.

Product Attributes

  • Brand: HS-Semi
  • Product Type: N-Ch Fast Switching MOSFETs
  • Certifications: RoHS, Green Product
  • Reliability: 100% EAS Guaranteed, Full Function Reliability Approved
  • Technology: Advanced high cell density Trench technology

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VDS Drain-Source Voltage 60 V
VGS Gate-Source Voltage 20 V
ID@TC=25 Continuous Drain Current, VGS @ 10V1 55 A
ID@TC=100 Continuous Drain Current, VGS @ 10V1 30 A
IDM Pulsed Drain Current2 90 A
EAS Single Pulse Avalanche Energy3 39.2 mJ
IAS Avalanche Current 38 A
PD@TC=25 Total Power Dissipation4 45 W
PD@TA=25 Total Power Dissipation4 2 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-Ambient1 --- 62 /W
RJC Thermal Resistance Junction-Case1 --- 2.8 /W
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=250uA 60 --- --- V
BVDSS/TJ BVDSS Temperature Coefficient Reference to 25 , ID=1mA --- 0.057 --- V/
RDS(ON) Static Drain-Source On-Resistance2 VGS=10V , ID=20A --- 11 16 m
VGS=4.5V , ID=10A --- 16 20 m
VGS(th) Gate Threshold Voltage VGS=VDS , ID =250uA 1.2 1.8 2.5 V
VGS(th) VGS(th) Temperature Coefficient --- -5.68 --- mV/
IDSS Drain-Source Leakage Current VDS=48V , VGS=0V , TJ=25 --- --- 1 uA
VDS=48V , VGS=0V , TJ=55 --- --- 5 uA
IGSS Gate-Source Leakage Current VGS=20V , VDS=0V --- --- 100 nA
gfs Forward Transconductance VDS=5V , ID=15A --- 45 --- S
Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz --- 1.7 ---
Qg Total Gate Charge (4.5V) VDS=48V , VGS=4.5V , ID=15A --- 23 --- nC
Qgs Gate-Source Charge --- 7.1 ---
Qgd Gate-Drain Charge --- 7.6 ---
Td(on) Turn-On Delay Time VDD=30V , VGS=10V , RG=3.3, ID=15A --- 7.2 --- ns
Tr Rise Time --- 50 --- ns
Td(off) Turn-Off Delay Time --- 36.4 --- ns
Tf Fall Time --- 7.6 --- ns
Ciss Input Capacitance VDS=15V , VGS=0V , f=1MHz --- 2823 --- pF
Coss Output Capacitance --- 155 --- pF
Crss Reverse Transfer Capacitance --- 107 --- pF
Diode Characteristics
IS Continuous Source Current1,5 VG=VD=0V , Force Current --- --- 55 A
ISM Pulsed Source Current2,5 --- --- 90 A
VSD Diode Forward Voltage2 VGS=0V , IS=A , TJ=25 --- --- 1 V
trr Reverse Recovery Time IF=15A , dI/dt=100A/s , TJ=25 --- 16.3 --- nS
Qrr Reverse Recovery Charge --- 11 --- nC

Ordering Information

Part Number Package Code Packaging
HSU50N06 TO252-2 2500/Tape&Reel

2410121641_HUASHUO-HSU50N06_C5128197.pdf
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