Power switching N-channel MOSFET HUASHUO HSX120N20 featuring low RDS ON and high current capability

Key Attributes
Model Number: HSX120N20
Product Custom Attributes
Drain To Source Voltage:
200V
Current - Continuous Drain(Id):
120A
RDS(on):
11mΩ@10V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
4.5V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
37pF
Number:
1 N-channel
Output Capacitance(Coss):
467pF
Pd - Power Dissipation:
500W
Input Capacitance(Ciss):
3.52nF
Gate Charge(Qg):
46nC@10V
Mfr. Part #:
HSX120N20
Package:
TO-247
Product Description

Product Overview

The HSX120N20 is a high-performance N-channel MOSFET featuring extreme high cell density, offering excellent RDS(ON) and gate charge for synchronous buck converter applications. This device meets RoHS and Green Product requirements and is 100% EAS guaranteed with full function reliability approval. It is designed for power switching applications and offers an excellent Cdv/dt effect decline due to its advanced high cell density trench technology.

Product Attributes

  • Brand: HS-Semi
  • Product Type: N-Ch Fast Switching MOSFETs
  • Technology: Advanced high cell density Trench technology
  • Certifications: RoHS and Green Product requirement
  • Reliability: 100% EAS guaranteed with full function reliability approved

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VDS Drain-Source Voltage 200 V
VGS Gate-Source Voltage 20 V
ID@TC=25 Continuous Drain Current, VGS @ 10V1 120 A
ID@TC=100 Continuous Drain Current, VGS @ 10V1 92 A
IDM Pulsed Drain Current2 520 A
EAS Single Pulse Avalanche Energy3 845 mJ
PD@TC=25 Total Power Dissipation3 500 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-ambient1 --- 40 /W
RJC Thermal Resistance Junction-Case1 --- 0.36 /W
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=250uA 200 --- --- V
RDS(ON) Static Drain-Source On-Resistance2 VGS=10V , ID=20A 8.9 11 m
VGS(th) Gate Threshold Voltage VGS=VDS , ID =250uA 2.5 3.3 4.5 V
IDSS Drain-Source Leakage Current VDS=200V , VGS=0V , TJ=25 --- 1 uA
VDS=200V , VGS=0V , TJ=55 --- 5 uA
IGSS Gate-Source Leakage Current VGS=20V , VDS=0V --- 100 nA
Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz 5.0 ---
Qg Total Gate Charge (10V) VDS=100V , VGS=10V , ID=20A 46 --- nC
Qgs Gate-Source Charge 20 ---
Qgd Gate-Drain Charge 12 ---
td(on) Turn-On Delay Time VDD=100V , VGS=10V , RG=2.5 , ID=20A 21 --- ns
tr Rise Time 22 --- ns
td(off) Turn-Off Delay Time 32 --- ns
tf Fall Time 23 --- ns
Ciss Input Capacitance VDS=50V , VGS=0V , f=1MHz 3520 --- pF
Coss Output Capacitance 467 ---
Crss Reverse Transfer Capacitance 37 ---
Diode Characteristics
IS Continuous Source Current1,5 VG=VD=0V , Force Current --- 120 A
VSD Diode Forward Voltage2 VGS=0V , IS=30A , TJ=25 --- 1.2 V
trr Body Diode Reverse Recovery Time IF = 15A, dIF/dt = 100A/s 133 --- ns
Qrr Body Diode Reverse Recovery Charge IF = 15A, dIF/dt = 100A/s 677 --- nC

Notes:

  • 1. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
  • 2. The data tested by pulsed, pulse width 300s, duty cycle 2%.
  • 3. The EAS data shows Max. rating. The test condition is VDD=25V, VGS=10V, L=0.5mH.
  • 4. The power dissipation is limited by 150 junction temperature.
  • 5. The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.

2410122016_HUASHUO-HSX120N20_C22359324.pdf
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