Fast Switching N Channel MOSFET HUASHUO HSP15810C Featuring Trench Technology for High Frequency Switching Circuits

Key Attributes
Model Number: HSP15810C
Product Custom Attributes
Drain To Source Voltage:
100V
Current - Continuous Drain(Id):
120A
Operating Temperature -:
-55℃~+150℃
RDS(on):
5.5mΩ@10V
Gate Threshold Voltage (Vgs(th)):
4V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
14pF@50V
Number:
1 N-channel
Input Capacitance(Ciss):
4.725nF@50V
Pd - Power Dissipation:
227W
Gate Charge(Qg):
72nC@10V
Mfr. Part #:
HSP15810C
Package:
TO-220
Product Description

Product Overview

HSP15810C is a N-Channel, 100V Fast Switching MOSFET designed for high-frequency switching applications. It features advanced high cell density Trench technology, offering super low RDS(ON) and 100% EAS Guaranteed performance. This MOSFET is ideal for applications such as motor drivers, Battery Management Systems (BMS), and high-frequency switching with synchronous rectification. A green device option is available.

Product Attributes

  • Brand: HS-Semi
  • Model: HSP15810C
  • Technology: N-Channel, Fast Switching MOSFET, Advanced high cell density Trench technology
  • Certifications: Green Device Available

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VDS Drain-Source Voltage 100 V
VGS Gate-Source Voltage ±20 V
ID@TC=25 Continuous Drain Current, VGS @ 10V1,6 120 A
ID@TC=100 Continuous Drain Current, VGS @ 10V1,6 100 A
IDM Pulsed Drain Current2 480 A
EAS Single Pulse Avalanche Energy3 196 mJ
IAS Avalanche Current 28 A
PD@TC=25 Total Power Dissipation4 227 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-Ambient --- 62 /W
RJC Thermal Resistance Junction-Case1 --- 0.5 /W
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=250uA 100 --- --- V
RDS(ON) Static Drain-Source On-Resistance2 VGS=10V , ID=30A 4.7 5.5 m
VGS(th) Gate Threshold Voltage VGS=VDS , ID =250uA 2.0 3.0 4.0 V
IDSS Drain-Source Leakage Current VDS=100V , VGS=0V , TJ=25 --- 1 uA
IDSS Drain-Source Leakage Current VDS=100V , VGS=0V , TJ=125 --- 10 uA
IGSS Gate-Source Leakage Current VGS=±20V , VDS=0V --- ±100 nA
gfs Forward Transconductance VDS=5V , ID=30A 50 --- S
Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz --- 1
Qg Total Gate Charge (10V) VDS=50V , VGS=10V , ID=20A 72 --- nC
Qgs Gate-Source Charge 28 --- nC
Qgd Gate-Drain Charge 15 --- nC
Td(on) Turn-On Delay Time VDD=50V , VGS=10V , RG=3.0, ID=20A 35 --- ns
Tr Rise Time 18 --- ns
Td(off) Turn-Off Delay Time 45 --- ns
Tf Fall Time 55 --- ns
Ciss Input Capacitance VDS=50V , VGS=0V , f=1MHz 4725 --- pF
Coss Output Capacitance 609 --- pF
Crss Reverse Transfer Capacitance 14 --- pF
Diode Characteristics
IS Continuous Source Current1,5 VG=VD=0V , Force Current --- 120 A
VSD Diode Forward Voltage2 VGS=0V , IS=50A , TJ=25 --- 1.3 V
trr Reverse Recovery Time IF=30A , dI/dt=100A/s , TJ=25 70 --- nS
Qrr Reverse Recovery Charge 170 --- nC

2410121637_HUASHUO-HSP15810C_C2828504.pdf
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