Trench technology N channel MOSFET HUASHUO HSP18N20 providing and low gate charge in power circuits

Key Attributes
Model Number: HSP18N20
Product Custom Attributes
Drain To Source Voltage:
200V
Current - Continuous Drain(Id):
18A
Operating Temperature -:
-55℃~+150℃
RDS(on):
170mΩ@10V,9A
Gate Threshold Voltage (Vgs(th)):
2.5V
Reverse Transfer Capacitance (Crss@Vds):
70pF@25V
Number:
1 N-channel
Input Capacitance(Ciss):
2.047nF@25V
Pd - Power Dissipation:
83W
Gate Charge(Qg):
45nC@10V
Mfr. Part #:
HSP18N20
Package:
TO-220
Product Description

Product Overview

The HSP18N20 is a high-performance N-channel MOSFET featuring an extreme high cell density trench technology. It offers excellent RDS(ON) and gate charge characteristics, making it ideal for synchronous buck converter applications. This device meets RoHS and Green Product requirements and is 100% EAS guaranteed with full function reliability approval. Key advantages include super low gate charge, excellent Cdv/dt effect decline, and advanced high cell density trench technology.

Product Attributes

  • Brand: HS (implied by www.hs-semi.cn)
  • Type: N-Ch MOSFET
  • Technology: Trench
  • Certifications: RoHS, Green Device Available
  • Reliability: 100% EAS guaranteed, full function reliability approved

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VDS Drain-Source Voltage 200 V
VGS Gate-Source Voltage 20 V
ID@TC=25 Continuous Drain Current, VGS @ 10V1 18 A
ID@TC=100 Continuous Drain Current, VGS @ 10V1 11.7 A
IDM Pulsed Drain Current2 40 A
EAS Single Pulse Avalanche Energy3 15 mJ
IAS Avalanche Current 10 A
PD@TC=25 Total Power Dissipation3 83 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-ambient --- 60 /W
RJC Thermal Resistance Junction-Case1 --- 1.1 /W
Product Summary
Model HSP18N20
Type N-Ch 200V Fast Switching MOSFETs
VDS 200 V
RDS(ON),max VGS=10V 170 m
ID @TC=25 18 A
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=250uA 200 --- --- V
RDS(ON) Static Drain-Source On-Resistance2 VGS=10V , ID=9A --- 170 m
VGS=4.5V , ID=9A --- 180 m
VGS(th) Gate Threshold Voltage VGS=VDS , ID =250uA 1.2 --- 2.5 V
IDSS Drain-Source Leakage Current VDS=160V , VGS=0V , TJ=25 --- 1 uA
VDS=160V , VGS=0V , TJ=55 --- 5 uA
IGSS Gate-Source Leakage Current VGS=20V , VDS=0V --- 100 nA
gfs Forward Transconductance VDS=5V , ID=9A 22 --- S
Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz --- 2
Qg Total Gate Charge (10V) VDS=80V , VGS=10V , ID=9A 45 --- nC
Qgs Gate-Source Charge 9 ---
Qgd Gate-Drain Charge 10.5 ---
td(on) Turn-On Delay Time VDD=50V , VGS=10V , RG=3.3, ID=9A 13 --- ns
tr Rise Time 8.2 --- ns
td(off) Turn-Off Delay Time 25 --- ns
tf Fall Time 11 --- ns
Ciss Input Capacitance VDS=25V , VGS=0V , f=1MHz 2047 --- pF
Coss Output Capacitance 109 --- pF
Crss Reverse Transfer Capacitance 70 --- pF
Diode Characteristics
IS Continuous Source Current1,5 VG=VD=0V , Force Current --- 18 A
ISM Pulsed Source Current2,5 --- 40 A
VSD Diode Forward Voltage2 VGS=0V , IS=1A , TJ=25 --- 1.2 V
trr Reverse Recovery Time IF=10A , dI/dt=100A/s , TJ=25 37 --- ns
Qrr Reverse Recovery Charge 103 --- nC

2409291036_HUASHUO-HSP18N20_C508807.pdf
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