Single N Channel MOSFET HUAYI HYG110N11LS1C2 with Low RDS ON and Halogen Free RoHS Compliant Package

Key Attributes
Model Number: HYG110N11LS1C2
Product Custom Attributes
Drain To Source Voltage:
115V
Current - Continuous Drain(Id):
60A
RDS(on):
19mΩ@4.5V
Operating Temperature -:
-55℃~+175℃
Gate Threshold Voltage (Vgs(th)):
3V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
6.6pF
Number:
1 N-channel
Input Capacitance(Ciss):
2.606nF
Pd - Power Dissipation:
71.4W
Gate Charge(Qg):
45.5nC@10V
Mfr. Part #:
HYG110N11LS1C2
Package:
PDFN-8(4.9x5.8)
Product Description

HYG110N11LS1C2 Single N-Channel Enhancement Mode MOSFET

Product Overview

The HYG110N11LS1C2 is a single N-Channel Enhancement Mode MOSFET designed for high-performance applications. It features a low on-resistance (RDS(ON)) of 9.8 m typ. at VGS = 10V and 14.5 m typ. at VGS = 4.5V, 100% avalanche tested, and a reliable, rugged design. Halogen-free devices are available, making it RoHS compliant. This MOSFET is suitable for DC-DC power management, quick charger applications, and LED lighting.

Product Attributes

  • Brand: Hymexa
  • Model: HYG110N11LS1C2
  • Origin: China
  • Certifications: RoHS Compliant, Halogen-Free
  • Package Type: PDFN8L (5x6)

Technical Specifications

Parameter Test Conditions Min Typ. Max Unit
Absolute Maximum Ratings
Drain-Source Voltage (VDSS) Tc=25C Unless Otherwise Noted - - 115 V
Gate-Source Voltage (VGSS) Tc=25C Unless Otherwise Noted - - ±20 V
Maximum Junction Temperature (TJ) Tc=25C Unless Otherwise Noted - - 175 °C
Storage Temperature Range (TSTG) Tc=25C Unless Otherwise Noted -55 - 175 °C
Source Current-Continuous (IS) Body Diode, Tc=25°C, Mounted on Large Heat Sink - - 60 A
Pulsed Drain Current (IDM) Tc=25°C - - 220 A
Continuous Drain Current (ID) Tc=25°C - - 60 A
Continuous Drain Current (ID) Tc=100°C - - 42 A
Maximum Power Dissipation (PD) Tc=25°C - - 71.4 W
Maximum Power Dissipation (PD) Tc=100°C - - 35.7 W
Thermal Resistance, Junction-to-Case (RθJC) Tc=25°C - 2.1 - °C/W
Thermal Resistance, Junction-to-Ambient (RθJA) ** Surface mounted on FR-4 board. - 47 - °C/W
Single Pulsed-Avalanche Energy (EAS) *** L=0.3mH - 148.7 - mJ
Electrical Characteristics
Drain-Source Breakdown Voltage (BVDSS) VGS=0V, IDS=250μA 115 - - V
Drain-to-Source Leakage Current (IDSS) VDS=115V,VGS=0V - - 1 μA
Drain-to-Source Leakage Current (IDSS) TJ=100°C - - 50 μA
Gate Threshold Voltage (VGS(th)) VDS=VGS, IDS=250μA 1.0 1.9 3.0 V
Gate-Source Leakage Current (IGSS) VGS=±20V,VDS=0V - - 100 nA
Drain-Source On-State Resistance (RDS(ON)*) VGS=10V,IDS=20A - 9.8 13
Drain-Source On-State Resistance (RDS(ON)*) VGS=4.5V,IDS=20A - 14.5 19
Diode Forward Voltage (VSD*) ISD=20A,VGS=0V - 0.84 1.3 V
Reverse Recovery Time (trr) ISD=20A,dISD/dt=100A/μs - 41.8 - ns
Reverse Recovery Charge (Qrr) ISD=20A,dISD/dt=100A/μs - 55.2 - nC
Gate Resistance (RG) VGS=0V,VDS=0V,F=1MHz - 1.6 - Ω
Input Capacitance (Ciss) VGS=0V, VDS=50V, Frequency=1.0MHz - 2606 - pF
Output Capacitance (Coss) VGS=0V, VDS=50V, Frequency=1.0MHz - 278 - pF
Reverse Transfer Capacitance (Crss) VGS=0V, VDS=50V, Frequency=1.0MHz - 6.6 - pF
Turn-on Delay Time (td(ON)) VDD=60V,RG=2.5Ω, IDS=20A,VGS=10V - 12.6 - ns
Turn-on Rise Time (Tr) VDD=60V,RG=2.5Ω, IDS=20A,VGS=10V - 24.9 - ns
Turn-off Delay Time (td(OFF)) VDD=60V,RG=2.5Ω, IDS=20A,VGS=10V - 32.6 - ns
Turn-off Fall Time (Tf) VDD=60V,RG=2.5Ω, IDS=20A,VGS=10V - 45.9 - ns
Total Gate Charge (Qg(10V)) VDS =60V, VGS=10V, ID=20A - 45.5 - nC
Total Gate Charge (Qg(4.5V)) VDS =60V, VGS=4.5V, ID=20A - 22.8 - nC
Gate-Source Charge (Qgs) VDS =60V, VGS=10V, ID=20A - 10.9 - nC
Gate-Drain Charge (Qgd) VDS =60V, VGS=10V, ID=20A - 9.6 - nC

2409302230_HUAYI-HYG110N11LS1C2_C2980991.pdf

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