SiC Power MOSFET N Channel Enhancement Mode Device HXY MOSFET STW70N65DM6 HXY for Power Applications

Key Attributes
Model Number: STW70N65DM6-HXY
Product Custom Attributes
Drain To Source Voltage:
650V
Current - Continuous Drain(Id):
49A
RDS(on):
49mΩ
Gate Threshold Voltage (Vgs(th)):
4V
Reverse Transfer Capacitance (Crss@Vds):
19pF
Pd - Power Dissipation:
242W
Input Capacitance(Ciss):
1.823nF
Output Capacitance(Coss):
190pF
Gate Charge(Qg):
96nC
Mfr. Part #:
STW70N65DM6-HXY
Package:
TO-247
Product Description

Product Overview

The HUAXUANYANG STW70N65DM6 is a 3rd generation SiC Power MOSFET, N-Channel Enhancement Mode, designed for high-efficiency power applications. It features optimized packaging with a separate driver source pin, high blocking voltage with low on-resistance, and high-speed switching with low capacitances. The device boasts a fast intrinsic diode with low reverse recovery (Qrr), making it suitable for reducing switching losses and minimizing gate ringing. This RoHS compliant and halogen-free component contributes to higher system efficiency, reduced cooling requirements, increased power density, and higher system switching frequencies.

Product Attributes

  • Brand: HUAXUANYANG
  • Model: STW70N65DM6
  • Technology: 3rd generation SiC MOSFET
  • Channel Type: N-Channel Enhancement Mode
  • Package: TO-247
  • Certifications: Halogen free, RoHS compliant
  • Website: www.hxymos.com
  • Origin: Shenzhen HuaXuanYang Electronics CO.,LTD

Technical Specifications

Parameter Symbol Test Condition Value Unit
Maximum Ratings
Drain-source voltage VDS TC = 25C 650 V
Continuous drain current ID TC = 25C 123 A
Continuous drain current ID TC = 100C 49 A
Pulsed drain current ID pulse (TC = 25C, tp limited by Tjmax) 242 A
Gate-Source voltage VGS - -5/+20 V
Power dissipation Ptot TC = 25C 1000 W
Operating junction and storage temperature Tj , Tstg - -55...+175 C
Avalanche energy, single pulse EAS (L=10mH) 40 mJ
Thermal Resistance
Thermal resistance, junction case. Max RthJC - 0.62 C/W
Thermal resistance, junction ambient. Max RthJA - 30 C/W
Static Characteristic
Drain-source breakdown voltage BVDSS VGS=0V, ID = 250uA 650 V
Gate threshold voltage VGS(th) VDS=VGS,ID=7mA 19 V
Drain-source on-state resistance RDS(on) VGS=20V, ID=17.6A, Tj=25C 25 m
Drain-source on-state resistance RDS(on) VGS=20V, ID=17.6A, Tj=175C 48 m
Zero gate voltage drain current IDSS VDS=650V,VGS=0V, Tj=25C 1 A
Zero gate voltage drain current IDSS VDS=650V,VGS=0V, Tj=175C 250 A
Gate-source leakage current IGSS VGS=20V 10 nA
Transconductance gfs VDS=20V,ID=17.6A 19 S
Dynamic Characteristic
Input Capacitance Ciss VGS=0V, ID=0A, f = 1MHz 1823 pF
Output Capacitance Coss VGS=0V, ID=0A, f = 1MHz 156 pF
Reverse Transfer Capacitance Crss VGS=0V, ID=0A, f = 1MHz 40 pF
Gate Total Charge QG VDS=400V, VGS=-5/20V, ID=17.6A 15 nC
Gate-Drain charge QG VDS=400V, VGS=-5/20V, ID=17.6A 5.6 nC
Gate-Source charge Qgs VDS=400V, VGS=-5/20V, ID=17.6A 1.7 nC
Turn-on delay time td(on) VDD = 400V, VGS = -5/+20V, ID = 17.6A, RG = 10, L = 100uH 19 ns
Rise time tr VDD = 400V, VGS = -5/+20V, ID = 17.6A, RG = 10, L = 100uH 26 ns
Turn-off delay time td(off) VDD = 400V, VGS = -5/+20V, ID = 17.6A, RG = 10, L = 100uH 45 ns
Fall time tf VDD = 400V, VGS = -5/+20V, ID = 17.6A, RG = 10, L = 100uH 33 ns
Turn-On Switching Energy EON VGS=20V, VDS=0V, ID=17.6A, RG=10, L=100uH 190 J
Turn-Off Switching Energy EOFF VGS=18V, ID=17.6A, RG=10, L=100uH 15 J
Body Diode Characteristic
Body Diode Reverse Recovery Charge Qrr VR = 400V, ID = 17.6A, di/dt = 1000A/S 156 nC
Body Diode Reverse Recovery Time trr VGS=0V,ISD=8.8A, TJ=25C 2.6 s
Body Diode Forward Voltage VSD VGS=0V,ISD=8.8A, TJ=175C 3.2 V

Applications

  • Renewable energy
  • EV battery chargers
  • High voltage DC/DC converters
  • Switch Mode Power Supplies

2509181733_HXY-MOSFET-STW70N65DM6-HXY_C48972066.pdf

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