Fast Switching N Channel MOSFET HSU150N03 with High Cell Density and Low Gate Charge Characteristics

Key Attributes
Model Number: HSU150N03
Product Custom Attributes
Drain To Source Voltage:
30V
Current - Continuous Drain(Id):
150A
Operating Temperature -:
-55℃~+150℃
RDS(on):
3.2mΩ@10V,30A
Gate Threshold Voltage (Vgs(th)):
2.5V
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
410pF
Number:
1 N-channel
Output Capacitance(Coss):
480pF
Input Capacitance(Ciss):
3.5nF
Pd - Power Dissipation:
60W
Gate Charge(Qg):
39nC@10V
Mfr. Part #:
HSU150N03
Package:
TO-252-2
Product Description

Product Overview

The HSU150N03 is a high cell density trenched N-channel MOSFET designed for fast switching applications. It offers excellent RDS(ON) and gate charge, making it ideal for synchronous buck converter applications. This product meets RoHS and Green Product requirements, is 100% EAS guaranteed, and has full function reliability approval. It features super low gate charge and excellent CdV/dt effect decline due to its advanced high cell density trench technology.

Product Attributes

  • Brand: HSU-SEMI
  • Product Type: N-Ch Fast Switching MOSFETs
  • Certifications: RoHS, Green Product
  • Reliability: 100% EAS Guaranteed, Full Function Reliability Approved
  • Technology: Advanced high cell density Trench technology

Technical Specifications

Model Parameter Conditions Min. Typ. Max. Units
HSU150N03 Drain-Source Voltage (VDS) 30 V
Gate-Source Voltage (VGS) ±20 V
Continuous Drain Current (ID@TC=25) VGS @ 10V 1,6 150 A
Continuous Drain Current (ID@TC=100) VGS @ 10V 1,6 95 A
Pulsed Drain Current (IDM) 2 590 A
Single Pulse Avalanche Energy (EAS) 3 226 mJ
Avalanche Current (IAS) 30 A
Total Power Dissipation (PD@TC=25) 4 60 W
Storage Temperature Range (TSTG) -55 150
Operating Junction Temperature Range (TJ) -55 150
Thermal Resistance Junction-Ambient (RJA) 1 --- 62 /W
Thermal Resistance Junction-Case (RJC) 1 --- 1.4 /W
Drain-Source Breakdown Voltage (BVDSS) VGS=0V , ID=250uA 30 --- --- V
Static Drain-Source On-Resistance (RDS(ON),typ) VGS=10V , ID=30A 2 2.4 3.2 m
Static Drain-Source On-Resistance (RDS(ON)) VGS=4.5V , ID=20A 2 4.4 6.5 m
HSU150N03 Gate Threshold Voltage (VGS(th)) VGS=VDS , ID =250uA 1.2 --- 2.5 V
Drain-Source Leakage Current (IDSS) VDS=24V , VGS=0V , TJ=25 --- --- 1 uA
Drain-Source Leakage Current (IDSS) VDS=24V , VGS=0V , TJ=55 --- --- 5 uA
Gate-Source Leakage Current (IGSS) VGS=±20V , VDS=0V --- --- ±100 nA
Total Gate Charge (Qg) VDS=15V , VGS=10V , ID=30A --- 39 --- nC
Gate-Source Charge (Qgs) --- 10 --- nC
Gate-Drain Charge (Qgd) --- 12 --- nC
Turn-On Delay Time (Td(on)) VDD=15V , VGS=10V , RG=3.3, ID=30A --- 20.1 --- ns
Rise Time (Tr) --- 23 --- ns
Turn-Off Delay Time (Td(off)) --- 99 --- ns
Fall Time (Tf) --- 37 --- ns
Input Capacitance (Ciss) VDS=15V , VGS=0V , f=1MHz --- 3500 --- pF
Output Capacitance (Coss) --- 480 --- pF
Reverse Transfer Capacitance (Crss) --- 410 --- pF
HSU150N03 Continuous Source Current (IS) VG=VD=0V , Force Current 1,6 --- --- 150 A
Diode Forward Voltage (VSD) VGS=0V , IS=1A , TJ=25 2 --- --- 1.2 V
Reverse Recovery Time (trr) If=20A,di/dt=100A/us --- 44 --- ns
Reverse Recovery Charge (Qrr) --- 37 --- nC

Package Outline Dimensions (TO252):

SYMBOL MILLIMETERS (MIN) MILLIMETERS (NOM) MILLIMETERS (MAX) SYMBOL MILLIMETERS (MIN) MILLIMETERS (NOM) MILLIMETERS (MAX)
A 2.20 2.30 2.38 H 9.90 10.10 10.30
A1 0.00 --- 0.10 L 1.40 1.50 1.70
A2 0.97 1.07 1.17 L1 2.90 REF
b 0.72 0.78 0.85 L2 0.51 BSC
b3 5.23 5.33 5.46 L3 0.90 --- 1.25
c 0.47 0.53 0.58 L4 0.60 0.80 1.00
D 6.00 6.10 6.20 L5 1.70 1.80 1.90
D1 5.30 REF ---
E 6.50 6.60 6.70 1
E1 4.70 4.83 4.92 2
e 2.286 BSC K 0.40 REF

2010160905_HUASHUO-HSU150N03_C845614.pdf
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