Fast Switching N Channel MOSFET HSU150N03 with High Cell Density and Low Gate Charge Characteristics
Product Overview
The HSU150N03 is a high cell density trenched N-channel MOSFET designed for fast switching applications. It offers excellent RDS(ON) and gate charge, making it ideal for synchronous buck converter applications. This product meets RoHS and Green Product requirements, is 100% EAS guaranteed, and has full function reliability approval. It features super low gate charge and excellent CdV/dt effect decline due to its advanced high cell density trench technology.
Product Attributes
- Brand: HSU-SEMI
- Product Type: N-Ch Fast Switching MOSFETs
- Certifications: RoHS, Green Product
- Reliability: 100% EAS Guaranteed, Full Function Reliability Approved
- Technology: Advanced high cell density Trench technology
Technical Specifications
| Model | Parameter | Conditions | Min. | Typ. | Max. | Units | |
|---|---|---|---|---|---|---|---|
| HSU150N03 | Drain-Source Voltage (VDS) | 30 | V | ||||
| Gate-Source Voltage (VGS) | ±20 | V | |||||
| Continuous Drain Current (ID@TC=25) | VGS @ 10V | 1,6 | 150 | A | |||
| Continuous Drain Current (ID@TC=100) | VGS @ 10V | 1,6 | 95 | A | |||
| Pulsed Drain Current (IDM) | 2 | 590 | A | ||||
| Single Pulse Avalanche Energy (EAS) | 3 | 226 | mJ | ||||
| Avalanche Current (IAS) | 30 | A | |||||
| Total Power Dissipation (PD@TC=25) | 4 | 60 | W | ||||
| Storage Temperature Range (TSTG) | -55 | 150 | |||||
| Operating Junction Temperature Range (TJ) | -55 | 150 | |||||
| Thermal Resistance Junction-Ambient (RJA) | 1 | --- | 62 | /W | |||
| Thermal Resistance Junction-Case (RJC) | 1 | --- | 1.4 | /W | |||
| Drain-Source Breakdown Voltage (BVDSS) | VGS=0V , ID=250uA | 30 | --- | --- | V | ||
| Static Drain-Source On-Resistance (RDS(ON),typ) | VGS=10V , ID=30A | 2 | 2.4 | 3.2 | m | ||
| Static Drain-Source On-Resistance (RDS(ON)) | VGS=4.5V , ID=20A | 2 | 4.4 | 6.5 | m | ||
| HSU150N03 | Gate Threshold Voltage (VGS(th)) | VGS=VDS , ID =250uA | 1.2 | --- | 2.5 | V | |
| Drain-Source Leakage Current (IDSS) | VDS=24V , VGS=0V , TJ=25 | --- | --- | 1 | uA | ||
| Drain-Source Leakage Current (IDSS) | VDS=24V , VGS=0V , TJ=55 | --- | --- | 5 | uA | ||
| Gate-Source Leakage Current (IGSS) | VGS=±20V , VDS=0V | --- | --- | ±100 | nA | ||
| Total Gate Charge (Qg) | VDS=15V , VGS=10V , ID=30A | --- | 39 | --- | nC | ||
| Gate-Source Charge (Qgs) | --- | 10 | --- | nC | |||
| Gate-Drain Charge (Qgd) | --- | 12 | --- | nC | |||
| Turn-On Delay Time (Td(on)) | VDD=15V , VGS=10V , RG=3.3, ID=30A | --- | 20.1 | --- | ns | ||
| Rise Time (Tr) | --- | 23 | --- | ns | |||
| Turn-Off Delay Time (Td(off)) | --- | 99 | --- | ns | |||
| Fall Time (Tf) | --- | 37 | --- | ns | |||
| Input Capacitance (Ciss) | VDS=15V , VGS=0V , f=1MHz | --- | 3500 | --- | pF | ||
| Output Capacitance (Coss) | --- | 480 | --- | pF | |||
| Reverse Transfer Capacitance (Crss) | --- | 410 | --- | pF | |||
| HSU150N03 | Continuous Source Current (IS) | VG=VD=0V , Force Current | 1,6 | --- | --- | 150 | A |
| Diode Forward Voltage (VSD) | VGS=0V , IS=1A , TJ=25 | 2 | --- | --- | 1.2 | V | |
| Reverse Recovery Time (trr) | If=20A,di/dt=100A/us | --- | 44 | --- | ns | ||
| Reverse Recovery Charge (Qrr) | --- | 37 | --- | nC |
Package Outline Dimensions (TO252):
| SYMBOL | MILLIMETERS (MIN) | MILLIMETERS (NOM) | MILLIMETERS (MAX) | SYMBOL | MILLIMETERS (MIN) | MILLIMETERS (NOM) | MILLIMETERS (MAX) |
|---|---|---|---|---|---|---|---|
| A | 2.20 | 2.30 | 2.38 | H | 9.90 | 10.10 | 10.30 |
| A1 | 0.00 | --- | 0.10 | L | 1.40 | 1.50 | 1.70 |
| A2 | 0.97 | 1.07 | 1.17 | L1 | 2.90 | REF | |
| b | 0.72 | 0.78 | 0.85 | L2 | 0.51 | BSC | |
| b3 | 5.23 | 5.33 | 5.46 | L3 | 0.90 | --- | 1.25 |
| c | 0.47 | 0.53 | 0.58 | L4 | 0.60 | 0.80 | 1.00 |
| D | 6.00 | 6.10 | 6.20 | L5 | 1.70 | 1.80 | 1.90 |
| D1 | 5.30 | REF | 0° | --- | 8° | ||
| E | 6.50 | 6.60 | 6.70 | 1 | 5° | 7° | 9° |
| E1 | 4.70 | 4.83 | 4.92 | 2 | 5° | 7° | 9° |
| e | 2.286 | BSC | K | 0.40 | REF |
2010160905_HUASHUO-HSU150N03_C845614.pdf
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