Low On Resistance MOSFET HUAYI HYG006N04LS1TA for Inverter Systems and Power Management Applications

Key Attributes
Model Number: HYG006N04LS1TA
Product Custom Attributes
Drain To Source Voltage:
40V
Current - Continuous Drain(Id):
600A
Operating Temperature -:
-55℃~+175℃
RDS(on):
0.75mΩ@4.5V
Gate Threshold Voltage (Vgs(th)):
-
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
115pF
Number:
1 N-channel
Output Capacitance(Coss):
3.2nF
Pd - Power Dissipation:
428W
Input Capacitance(Ciss):
15.4nF
Gate Charge(Qg):
230nC@10V
Mfr. Part #:
HYG006N04LS1TA
Package:
TOLL
Product Description

HYG006N04LS1TA N-Channel Enhancement Mode MOSFET

The HYG006N04LS1TA is a high-performance N-Channel Enhancement Mode MOSFET designed for switching applications and power management in inverter systems. It offers a low on-resistance of 0.45 m (typ.) at VGS = 10V and 0.61 m (typ.) at VGS = 4.5V, along with 100% avalanche testing for enhanced reliability and ruggedness. Halogen-free and RoHS compliant options are available.

Product Attributes

  • Brand: HYG (Huayi Microelectronics Co., Ltd.)
  • Origin: China
  • Certifications: RoHS Compliant, Halogen-Free Available

Technical Specifications

Parameter Test Conditions Min Typ. Max Unit
Absolute Maximum Ratings
Drain-Source Voltage (VDSS) 40 V
Gate-Source Voltage (VGSS) 20 V
Junction Temperature (TJ) -55 175 C
Storage Temperature (TSTG) -55 175 C
Source Current-Continuous (IS) Tc=25C, Mounted on Large Heat Sink 600 A
Pulsed Drain Current (IDM) Tc=25C 2400 A
Continuous Drain Current (ID) Tc=25C 600 A
Continuous Drain Current (ID) Tc=100C 424 A
Maximum Power Dissipation (PD) Tc=25C 428 W
Maximum Power Dissipation (PD) Tc=100C 214 W
Thermal Resistance, Junction-to-Case (RJC) 0.35 C/W
Thermal Resistance, Junction-to-Ambient (RJA) Surface mounted on 1in FR-4 board 45 C/W
Single Pulsed-Avalanche Energy (EAS) L=1mH 2300 mJ
Electrical Characteristics
Drain-Source Breakdown Voltage (BVDSS) VGS=0V, IDS= 250A 40 - - V
Drain-to-Source Leakage Current (IDSS) VDS=40V,VGS=0V - - 1 A
Drain-to-Source Leakage Current (IDSS) TJ=125C - - 50 A
Gate Threshold Voltage (VGS(th)) VDS=VGS, IDS= 250A 1.3 1.8 2.4 V
Gate-Source Leakage Current (IGSS) VGS=20V,VDS=0V - - 100 nA
Drain-Source On-State Resistance (RDS(ON)) VGS= 10V,IDS=80A - 0.45 0.60 m
Drain-Source On-State Resistance (RDS(ON)) VGS= 4.5V,IDS=80A - 0.61 0.75 m
Diode Forward Voltage (VSD) ISD=80A,VGS=0V - 0.78 1.2 V
Reverse Recovery Time (trr) ISD=40A,dISD/dt=100A/s - 80 - ns
Reverse Recovery Charge (Qrr) - 148 - nC
Gate Resistance (RG) VGS=0V,VDS=0V,F=1MHz - 3.2 -
Input Capacitance (Ciss) VGS=0V, VDS= 25V, Frequency=300kHz - 15400 - pF
Output Capacitance (Coss) - 3200 - pF
Reverse Transfer Capacitance (Crss) - 115 - pF
Turn-on Delay Time (td(ON)) VDD= 20V,RG=2.5, IDS= 80A,VGS= 10V - 28 - ns
Turn-on Rise Time (Tr) - 104 - ns
Turn-off Delay Time (td(OFF)) - 125 - ns
Turn-off Fall Time (Tf) - 114 - ns
Total Gate Charge (Qg) VGS=10V, VDS =32V, VGS=10V,IDs=80A - 230 - nC
Total Gate Charge (Qg) VGS=4.5V - 110 - nC
Gate-Source Charge (Qgs) - 50 - nC
Gate-Drain Charge (Qgd) - 38 - nC

2409271603_HUAYI-HYG006N04LS1TA_C2982928.pdf

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