Load Switching Component HUAYI HYG023N04NR1D N Channel Enhancement Mode MOSFET with Avalanche Tested

Key Attributes
Model Number: HYG023N04NR1D
Product Custom Attributes
Drain To Source Voltage:
45V
Current - Continuous Drain(Id):
140A
Operating Temperature -:
-55℃~+175℃
RDS(on):
2.9mΩ@10V
Gate Threshold Voltage (Vgs(th)):
4V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
485pF
Number:
1 N-channel
Output Capacitance(Coss):
615pF
Pd - Power Dissipation:
100W
Input Capacitance(Ciss):
3.412nF
Gate Charge(Qg):
82nC@10V
Mfr. Part #:
HYG023N04NR1D
Package:
TO-252-2L
Product Description

Product Overview

The HYG023N04NR1D is a single N-Channel Enhancement Mode MOSFET from Hymexa, designed for high-performance applications. It features a low on-state resistance of 2.3 m (typ.) at VGS = 10V, 45V/140A rating, and is 100% avalanche tested for reliability. This rugged component is suitable for load switching and battery protection circuits. Halogen-free options are available.

Product Attributes

  • Brand: Hymexa
  • Origin: China (Huayi Microelectronics Co., Ltd.)
  • Material: Halogen-Free Devices Available (RoHS compliant, lead-free)
  • Certifications: RoHS compliant

Technical Specifications

ParameterSymbolTest ConditionsMinTyp.MaxUnit
Absolute Maximum Ratings
Drain-Source VoltageVDSSTc=25Unless Otherwise Noted45V
Gate-Source VoltageVGSS25V
Junction Temperature RangeTJ-55175
Storage Temperature RangeTSTG-55175
Source Current-Continuous(Body Diode)ISTc=25, Mounted on Large Heat Sink140A
Pulsed Drain CurrentIDMTc=25560A
Continuous Drain CurrentIDTc=25140A
Continuous Drain CurrentIDTc=10099A
Maximum Power DissipationPDTc=25100W
Maximum Power DissipationPDTc=10050W
Thermal Resistance, Junction-to-CaseRJC1.5/W
Thermal Resistance, Junction-to-AmbientRJASurface mounted on FR-4 board60/W
Single Pulsed-Avalanche EnergyEASL=0.3mH, starting TJ=25, RG=25, VGS=10V390mJ
Electrical Characteristics
Drain-Source Breakdown VoltageBVDSSVGS=0V, IDS=250A45--V
Drain-to-Source Leakage CurrentIDSSVDS=45V,VGS=0V-1A
Drain-to-Source Leakage CurrentIDSSTJ=125-50A
Gate Threshold VoltageVGS(th)VDS=VGS, IDS=250A22.84V
Gate-Source Leakage CurrentIGSSVGS=25V,VDS=0V-100nA
Drain-Source On-State ResistanceRDS(ON)VGS=10V,IDS=40A2.32.9m
Diode Forward VoltageVSD*ISD=40A,VGS=0V0.81.0V
Reverse Recovery TimetrrISD=20A,dISD/dt=100A/s22-ns
Reverse Recovery ChargeQrr16-nC
Gate ResistanceRGVGS=0V,VDS=0V,F=1MHz0.6-
Input CapacitanceCissVGS=0V, VDS=25V, Frequency=1MHz3412-pF
Output CapacitanceCoss615-pF
Reverse Transfer CapacitanceCrss485-pF
Turn-on Delay Timetd(ON)VDD=20V,RG=4, IDS=20A,VGS=10V16-ns
Turn-on Rise TimeTr59-ns
Turn-off Delay Timetd(OFF)40-ns
Turn-off Fall TimeTf62-ns
Total Gate ChargeQgVDS =32V, VGS=10V, ID=20A82-nC
Gate-Source ChargeQgs16-nC
Gate-Drain ChargeQgd31-nC

2410122027_HUAYI-HYG023N04NR1D_C2999757.pdf

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