Durable Single N Channel MOSFET HYG170N03LR1C2 with Low On Resistance and Halogen Free Certification

Key Attributes
Model Number: HYG170N03LR1C2
Product Custom Attributes
Drain To Source Voltage:
30V
Current - Continuous Drain(Id):
24A
Operating Temperature -:
-55℃~+175℃
RDS(on):
21.5mΩ@4.5V,4A
Gate Threshold Voltage (Vgs(th)):
1.9V
Reverse Transfer Capacitance (Crss@Vds):
38pF
Number:
1 N-channel
Pd - Power Dissipation:
20W
Input Capacitance(Ciss):
412pF
Gate Charge(Qg):
9.5nC@10V
Mfr. Part #:
HYG170N03LR1C2
Package:
PDFN-8L(5x6)
Product Description

HYG170N03LR1C2 Single N-Channel Enhancement Mode MOSFET

The HYG170N03LR1C2 is a single N-Channel enhancement mode MOSFET designed for various applications. It features low on-resistance (RDS(ON)= 14.5 m typ. @VGS = 10V), 100% avalanche tested, and a reliable, rugged design. This MOSFET is suitable for load switch and battery protection applications. Halogen-free devices are available.

Product Attributes

  • Brand: Hymexa
  • Product Code: HYG170N03LR1C2
  • Package Type: PDFN8L(5x6)
  • Certifications: RoHS compliant, Halogen-free

Technical Specifications

Parameter Test Conditions Min Typ. Max Unit
Absolute Maximum Ratings
Drain-Source Voltage (VDSS) Tc=25 Unless Otherwise Noted - - 30 V
Gate-Source Voltage (VGSS) - - - ±20 V
Junction Temperature Range (TJ) - -55 - 175
Storage Temperature Range (TSTG) - -55 - 175
Continuous Drain Current (ID) Tc=25 - - 24 A
Continuous Drain Current (ID) Tc=100 - - 17 A
Pulsed Drain Current (IDM) Tc=25 * - - 60 A
Maximum Power Dissipation (PD) Tc=25 - - 20 W
Maximum Power Dissipation (PD) Tc=100 - - 10 W
Thermal Resistance, Junction-to-Case (RJC) - - 7.5 - /W
Thermal Resistance, Junction-to-Ambient (RJA) ** - 45 - /W
Single Pulsed-Avalanche Energy (EAS) L=0.1mH *** - 15 - mJ
Electrical Characteristics
Drain-Source Breakdown Voltage (BVDSS) VGS=0V, IDS=250A 30 - - V
Drain-to-Source Leakage Current (IDSS) VDS=30V,VGS=0V - - 1 μA
Drain-to-Source Leakage Current (IDSS) TJ=125 - - 50 μA
Gate Threshold Voltage (VGS(th)) VDS=VGS, IDS=250A 1 1.9 3 V
Gate-Source Leakage Current (IGSS) VGS=±20V,VDS=0V - ±100 - nA
Drain-Source On-State Resistance (RDS(ON)) VGS=10V,IDS=6A - 14.5 17.0
Drain-Source On-State Resistance (RDS(ON)) VGS=4.5V,IDS=4A - 21.5 26.0
Diode Forward Voltage (VSD*) ISD=6A,VGS=0V - 0.8 - V
Reverse Recovery Time (trr) ISD=6A,dISD/dt=100A/μs - 5.8 - ns
Reverse Recovery Charge (Qrr) - - 1.7 - nC
Input Capacitance (Ciss) VGS=0V, VDS=25V, Frequency=1.0MHz - 412 - pF
Output Capacitance (Coss) - - 51 - pF
Reverse Transfer Capacitance (Crss) - - 38 - pF
Turn-on Delay Time (td(ON)) VDD=15V,RG=4Ω, IDS=6A,VGS=10V - 6.0 - ns
Turn-on Rise Time (Tr) - - 17.1 - ns
Turn-off Delay Time (td(OFF)) - - 12.1 - ns
Turn-off Fall Time (Tf) - - 3.0 - ns
Total Gate Charge (Qg) VDS =24V, VGS=10V, IDS=6A - 9.5 11.5 nC
Total Gate Charge (Qg) VDS =24V, VGS=4.5V, IDS=4A - 4.9 6.0 nC
Gate-Source Charge (Qgs) - - 1.9 - nC
Gate-Drain Charge (Qgd) - - 2.2 - nC

2410122028_HUAYI-HYG170N03LR1C2_C5121297.pdf

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