Power module Infineon FP75R12N2T7 EconoPIM2 with industrial certifications and solder contact technology

Key Attributes
Model Number: FP75R12N2T7
Product Custom Attributes
Pd - Power Dissipation:
-
Td(off):
320ns
Td(on):
146ns
Collector-Emitter Breakdown Voltage (Vces):
1.2kV
Reverse Transfer Capacitance (Cres):
-
IGBT Type:
-
Gate-Emitter Threshold Voltage (Vge(th)@Ic):
5.15V@1.28mA
Gate Charge(Qg):
1.25uC@600V,15V
Operating Temperature:
-40℃~+175℃
Reverse Recovery Time(trr):
-
Switching Energy(Eoff):
4.95mJ
Turn-On Energy (Eon):
8.05mJ
Input Capacitance(Cies):
15.1nF@25V
Pulsed Current- Forward(Ifm):
-
Output Capacitance(Coes):
-
Mfr. Part #:
FP75R12N2T7
Package:
Through Hole,107.5x45mm
Product Description

EconoPIM2 Module with TRENCHSTOP IGBT7 and Emitter Controlled 7 Diode and NTC

The FP75R12N2T7 EconoPIM2 module integrates TRENCHSTOP IGBT7 and Emitter Controlled 7 diode technology, offering high power and thermal cycling capability. It features a low VCEsat and supports overload operation up to 175C. Designed for industrial applications, this module is qualified according to IEC 60747, 60749, and 60068 standards. Its construction includes a copper base plate and an Al2O3 substrate with low thermal resistance, utilizing solder contact technology.

Product Attributes

  • Brand: Infineon
  • Product Line: EconoPIM2
  • IGBT Technology: TRENCHSTOP IGBT7
  • Diode Technology: Emitter Controlled 7
  • Substrate Material: Al2O3
  • Base Plate Material: Copper
  • Certifications: Qualified for industrial applications according to IEC 60747, 60749 and 60068

Technical Specifications

Parameter Symbol Note or test condition Values Unit
General Module Characteristics
Isolation test voltage VISOL RMS, f = 50 Hz, t = 1 min 2.5 kV
Internal Isolation basic insulation (class 1, IEC 61140)
Creepage distance dCreep terminal to heatsink 10.0 mm
Clearance dClear terminal to heatsink 7.5 mm
Comparative tracking index CTI > 200
RTI Elec. 140 C
Stray inductance module LsCE 35 nH
Module lead resistance, terminals - chip RAA'+CC' TC=25C, per switch 5.6 m
Module lead resistance, terminals - chip RCC'+EE' TC=25C, per switch 5.3 m
Storage temperature Tstg -40 to 125 C
Mounting torque for modul mounting M M5, Screw 3 to 6 Nm
Weight G 180 g
IGBT, Inverter
Collector-emitter voltage VCES Tvj = 25 C 1200 V
Continous DC collector current ICDC Tvj max = 175 C, TC = 100 C 75 A
Repetitive peak collector current ICRM tP = 1 ms 150 A
Gate-emitter peak voltage VGES 20 V
Collector-emitter saturation voltage VCE sat IC = 75 A, VGE = 15 V 1.55 (Tvj=25C), 1.69 (Tvj=125C), 1.77 (Tvj=175C) V
Gate threshold voltage VGEth IC = 1.28 mA, VCE = VGE, Tvj = 25 C 5.15 to 6.45 V
Gate charge QG VGE = 15 V, VCE = 600 V 1.25 C
Internal gate resistor RGint Tvj = 25 C 2
Input capacitance Cies f = 100 kHz, Tvj = 25 C, VCE = 25 V, VGE = 0 V 15.1 nF
Reverse transfer capacitance Cres f = 100 kHz, Tvj = 25 C, VCE = 25 V, VGE = 0 V 0.053 nF
Collector-emitter cut-off current ICES VCE = 1200 V, VGE = 0 V, Tvj = 25 C 0.014 mA
Gate-emitter leakage current IGES VCE = 0 V, VGE = 20 V, Tvj = 25 C 100 nA
Turn-on delay time (inductive load) tdon IC = 75 A, VCE = 600 V, VGE = 15 V, RGon = 5.6 0.146 (Tvj=25C), 0.162 (Tvj=125C), 0.169 (Tvj=175C) s
Rise time (inductive load) tr IC = 75 A, VCE = 600 V, VGE = 15 V, RGon = 5.6 0.053 (Tvj=25C), 0.057 (Tvj=125C), 0.060 (Tvj=175C) s
Turn-off delay time (inductive load) tdoff IC = 75 A, VCE = 600 V, VGE = 15 V, RGoff = 5.6 0.320 (Tvj=25C), 0.390 (Tvj=125C), 0.440 (Tvj=175C) s
Fall time (inductive load) tf IC = 75 A, VCE = 600 V, VGE = 15 V, RGoff = 5.6 0.110 (Tvj=25C), 0.200 (Tvj=125C), 0.270 (Tvj=175C) s
Turn-on energy loss per pulse Eon IC = 75 A, VCE = 600 V, L = 35 nH, VGE = 15 V, RGon = 5.6 , di/dt = 1050 A/s 8.05 (Tvj=25C), 10.6 (Tvj=125C), 12.3 (Tvj=175C) mJ
Turn-off energy loss per pulse Eoff IC = 75 A, VCE = 600 V, L = 35 nH, VGE = 15 V, RGoff = 5.6 , dv/dt = 3150 V/s 4.95 (Tvj=25C), 7.76 (Tvj=125C), 9.51 (Tvj=175C) mJ
SC data ISC VGE 15 V, VCC = 800 V, VCEmax=VCES-LsCE*di/dt, tP 8 s 260 (Tvj=150C), 250 (Tvj=175C) A
Thermal resistance, junction to case RthJC per IGBT 0.475 K/W
Thermal resistance, case to heatsink RthCH per IGBT, grease= 1 W/(m*K) 0.141 K/W
Temperature under switching conditions Tvj op -40 to 175 C
Diode, Inverter
Repetitive peak reverse voltage VRRM Tvj = 25 C 1200 V
Continous DC forward current IF 75 A
Repetitive peak forward current IFRM tP = 1 ms 150 A
I2t - value I2t tP = 10 ms, VR = 0 V 1150 (Tvj=125C), 740 (Tvj=175C) As
Forward voltage VF IF = 75 A, VGE = 0 V 1.72 (Tvj=25C), 1.59 (Tvj=125C), 1.52 (Tvj=175C) V
Peak reverse recovery current IRM VR = 600 V, IF = 75 A, VGE = -15 V, -diF/dt = 1050 A/s 38 (Tvj=25C), 51 (Tvj=125C), 59 (Tvj=175C) A
Recovered charge Qr VR = 600 V, IF = 75 A, VGE = -15 V, -diF/dt = 1050 A/s 5.43 (Tvj=25C), 10.4 (Tvj=125C), 14.1 (Tvj=175C) C
Reverse recovery energy Erec VR = 600 V, IF = 75 A, VGE = -15 V, -diF/dt = 1050 A/s 1.79 (Tvj=25C), 3.5 (Tvj=125C), 4.83 (Tvj=175C) mJ
Thermal resistance, junction to case RthJC per diode 0.708 K/W
Thermal resistance, case to heatsink RthCH per diode, grease= 1 W/(m*K) 0.153 K/W
Temperature under switching conditions Tvj op -40 to 175 C
Diode, Rectifier
Repetitive peak reverse voltage VRRM Tvj = 150 C 1600 V
Maximum RMS forward current per chip IFRMSM TC = 95 C 75 A
Maximum RMS current at rectifier output IRMSM TC = 95 C 100 A
Surge forward current IFSM tP = 10 ms 745 (Tvj=25C), 515 (Tvj=150C) A
I2t - value I2t tP = 10 ms 2780 (Tvj=25C), 1330 (Tvj=150C) As
Forward voltage VF Tvj = 150 C, IF = 75 A 1.06 V
Reverse current Ir Tvj = 150 C, VR = 1600 V 1 mA
Thermal resistance, junction to case RthJC per diode 0.697 K/W
Thermal resistance, case to heatsink RthCH per diode, Paste= 1 W /(m*K) / grease= 1 W/(m*K) 0.153 K/W
NTC-Thermistor
Temperature sensor NTC Integrated

2504101957_Infineon-FP75R12N2T7_C45898807.pdf

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