Switching Applications and Battery Protection Using Leiditech DMG2305UXQ 20V P Channel MOSFET Device

Key Attributes
Model Number: DMG2305UXQ
Product Custom Attributes
Drain To Source Voltage:
20V
Current - Continuous Drain(Id):
4.9A
RDS(on):
88mΩ@4.5V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
1V@250uA
Reverse Transfer Capacitance (Crss@Vds):
160pF
Number:
1 P-Channel
Pd - Power Dissipation:
1.31W
Input Capacitance(Ciss):
1.2nF@15V
Gate Charge(Qg):
14.3nC@4.5V
Mfr. Part #:
DMG2305UXQ
Package:
SOT-23
Product Description

Product Overview

The DMG2305UXQ is a 20V P-Channel Enhancement Mode MOSFET designed with advanced trench technology. It offers excellent RDS(ON), low gate charge, and the ability to operate with gate voltages as low as 4.5V. This device is highly suitable for battery protection and other switching applications, including load switching and uninterruptible power supplies.

Product Attributes

  • Brand: Leiditech
  • Model: DMG2305UXQ
  • Package Type: SOT-23
  • Device Marking: A5SHB
  • Reel Size: 180mm
  • Tape Width: 8 mm
  • Quantity per Reel: 3000 units

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VDS Drain-Source Voltage -20 V
VGS Gate-Source Voltage 12 V
ID@TA=25 Continuous Drain Current, VGS @ -4.5V -4.9 A
ID@TA=70 Continuous Drain Current, VGS @ -4.5V -3.9 A
IDM Pulsed Drain Current -14 A
PD@TA=25 Total Power Dissipation 1.31 W
PD@TA=70 Total Power Dissipation 0.84 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
RJA Thermal Resistance Junction-Ambient 120 /W
RJA Thermal Resistance Junction-Ambient (t 10s) 95 /W
Electrical Characteristics
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=-250uA -20 V
BVDSS/TJ BVDSS Temperature Coefficient Reference to 25 , ID=-1mA -0.014 V/
RDS(ON) Static Drain-Source On-Resistance VGS=-4.5V , ID=-4.9A 32 38 m
RDS(ON) Static Drain-Source On-Resistance VGS=-2.5V , ID=-3.4A 45 55 m
RDS(ON) Static Drain-Source On-Resistance VGS=-1.8V , ID=-2A 65 85 m
VGS(th) Gate Threshold Voltage VGS=VDS , ID =-250uA -0.4 -1.0 V
VGS(th) VGS(th) Temperature Coefficient 3.95 mV/
IDSS Drain-Source Leakage Current VDS=-16V , VGS=0V , TJ=25 -1 uA
IDSS Drain-Source Leakage Current VDS=-16V , VGS=0V , TJ=55 -5 uA
IGSS Gate-Source Leakage Current VGS=12V , VDS=0V 100 nA
gfs Forward Transconductance VDS=-5V , ID=-3A 12.8 S
Qg Total Gate Charge (-4.5V) VDS=-15V , VGS=-4.5V , ID=-3A 10.2 14.3 nC
Qgs Gate-Source Charge 1.89 2.6
Qgd Gate-Drain Charge 3.1 4.3
Td(on) Turn-On Delay Time VDD=-10V , VGS=-4.5V , RG=3.3 , ID=-3A 5.6 11.2 ns
Tr Rise Time 40.8 73
Td(off) Turn-Off Delay Time 33.6 67
Tf Fall Time 18 36
Ciss Input Capacitance VDS=-15V , VGS=0V , f=1MHz 857 1200 pF
Coss Output Capacitance 114 160
Crss Reverse Transfer Capacitance 108 151
IS Continuous Source Current VG=VD=0V , Force Current -4.9 A
ISM Pulsed Source Current -14 A
VSD Diode Forward Voltage VGS=0V , IS=-1A , TJ=25 -1 V
trr Reverse Recovery Time IF=-3A , di/dt=100A/s , TJ=25 21.8 nS
Qrr Reverse Recovery Charge 6.9 nC

Note:

  • 1. Data tested by surface mounted on a 1 inch FR-4 board with 2OZ copper.
  • 2. Data tested by pulsed, pulse width 300s, duty cycle 2%.
  • 3. Power dissipation is limited by 150 junction temperature.
  • 4. Data is theoretically the same as ID and IDM; in real applications, should be limited by total power dissipation.

Package Mechanical Data-SOT-23

Symbol Dimensions in Millimeters MIN. MAX.
A 0.900 1.150
A1 0.000 0.100
A2 0.900 1.050
b 0.300 0.500
c 0.080 0.150
D 2.800 3.000
E 1.200 1.400
E1 2.250 2.550
e 0.950TYP
e1 1.800 2.000
L 0.550REF
L1 0.300 0.500
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2409292333_Leiditech-DMG2305UXQ_C3647045.pdf
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