motor drive applications using LRC LN3424DT2AG N Channel Enhancement MOSFET with trench technology

Key Attributes
Model Number: LN3424DT2AG
Product Custom Attributes
Drain To Source Voltage:
30V
Current - Continuous Drain(Id):
12A
RDS(on):
16.5mΩ@4.5V,5A
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
1.8V
Reverse Transfer Capacitance (Crss@Vds):
119pF@15V
Number:
1 N-channel
Input Capacitance(Ciss):
1.136nF@15V
Pd - Power Dissipation:
1.4W
Gate Charge(Qg):
11nC@4.5V
Mfr. Part #:
LN3424DT2AG
Package:
DFN2020-6S
Product Description

Product Overview

The LN3424DT2G is a 30V N-Channel Enhancement MOSFET designed for efficient power management applications. Featuring low RDS(ON) achieved through trench technology, it offers fast switching speeds and a low thermal impedance. This MOSFET is suitable for DC/DC conversion, power routing, and motor drive applications.

Product Attributes

  • Brand: Leshan Radio Company, LTD.
  • Product Type: N-Channel Enhancement MOSFET
  • Material Compliance: Halogen Free, RoHS compliant

Technical Specifications

Parameter Symbol Min. Typ. Max. Unit Notes
DrainSource Breakdown Voltage V(BR)DSS 30 - - V (VDS = VGS , ID = 250 uA)
Gate-Source Threshold Voltage VGS(th) - 1.55 - V (VGS = 0V , ID = 250 uA)
Gate-Body Leakage IGSS - - 100 nA (VDS = 0 V, VGS = 20 V)
Zero Gate Voltage Drain Current IDSS - - 1 A (VDS = 24 V, VGS = 0 V)
Zero Gate Voltage Drain Current (High Temp) IDSS - - 8 A (VDS = 24 V, VGS = 0 V, TJ = 55C)
Drain-Source On-Resistance RDS(on) - 10.5 - m (VGS = 10 V, ID = 6 A)
Drain-Source On-Resistance RDS(on) - 16.5 - m (VGS = 4.5 V, ID = 5 A)
Diode Forward Voltage VSD - - 1.55 V (IS = 1.9 A, VGS = 0 V)
Continuous Drain Current ID - - 40 A (Note 1)
Pulsed Drain Current IDM - - 40 A (Note 2)
Continuous Source Current (Diode Conduction) IS - - 3.8 A (Note 1)
Power Dissipation PD - 2.4 - W (Note 1, TA = 25C)
Power Dissipation PD - 1.4 - W (Note 1, TA = 70C)
Maximum Junction-to-Ambient Thermal Resistance RJA - 90 - C/W (Note 1, Steady State)
Operating Junction and Storage Temperature Range TJ , TSTG -55 - 150 C -
Gate-to-Source Voltage VGS - - 20 V -
Total Gate Charge Qg - 11 - nC (VDS = 15 V, VGS = 4.5 V, ID = 6 A)
Gate-Source Charge Qgs - 4.3 - nC (VDS = 15 V, ID = 6 A)
Gate-Drain Charge Qgd - 3.2 - nC (VDS = 15 V, ID = 6 A)
Turn-On Delay Time td(on) - 6 - ns (VGS = 10 V, ID = 6 A)
Rise Time tr - 11 - ns (VGS = 10 V, ID = 6 A)
Turn-Off Delay Time td(off) - 29 - ns (VGS = 10 V, ID = 6 A)
Fall Time tf - 6 - ns (VGS = 10 V, ID = 6 A)
Input Capacitance Ciss - 1136 - pF (VDS = 15 V, VGS = 0 V, f = 1 MHz)
Output Capacitance Coss - 133 - pF (VDS = 15 V, VGS = 0 V, f = 1 MHz)
Reverse Transfer Capacitance Crss - 119 - pF (VDS = 15 V, VGS = 0 V, f = 1 MHz)
Gate Resistance Rg - 0.72 - (VGS = 0 V, VDS=0V,f=1MHz)
Model - LN3424DT2AG
Device Marking - 2B
Shipping - 4000/Tape&Reel
Package Type - DFN2020-6S
Package Dimensions (mm) - D: 1.95-2.05, E: 1.95-2.05, A: 0.60-0.70, A1: 0.01-0.05, b: 0.25-0.35
Soldering Footprint Dimensions (mm) - X: 0.40, X1: 0.95, X2: 1.70, e: 0.65

2410010232_LRC-LN3424DT2AG_C976212.pdf

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