NChannel MOSFET with 1000V ESD protection and low onstate resistance LRC L2N7002WT1G compact SOT323 package

Key Attributes
Model Number: L2N7002WT1G
Product Custom Attributes
Drain To Source Voltage:
60V
Current - Continuous Drain(Id):
115mA
Operating Temperature -:
-55℃~+150℃
RDS(on):
7.5Ω@10V,500mA
Gate Threshold Voltage (Vgs(th)):
2.5V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
5pF
Number:
1 N-channel
Output Capacitance(Coss):
25pF
Input Capacitance(Ciss):
50pF
Pd - Power Dissipation:
225mW
Gate Charge(Qg):
-
Mfr. Part #:
L2N7002WT1G
Package:
SOT-323
Product Description

Product Overview

The L2N7002WT1G is a small signal N-Channel MOSFET from LESHAN RADIO COMPANY, LTD., designed for general-purpose applications. It features ESD protection up to 1000V and is available in a compact SOT-323 (SC-70) package. This device is suitable for various electronic circuits requiring efficient switching and low on-state resistance.

Product Attributes

  • Brand: LESHAN RADIO COMPANY, LTD.
  • Package Type: SOT 323 (SC-70)
  • Channel Type: NChannel
  • ESD Protected: 1000V
  • RoHS Compliance: Material complies with RoHS requirements.

Technical Specifications

Characteristic Symbol Min Typ Max Unit
MAXIMUM RATINGS
DrainSource Voltage VDSS 60 Vdc
DrainGate Voltage (RGS = 1.0 M) VDGR 60 Vdc
Drain Current Continuous (TC = 25C) (Note 1.) ID 115 mA
Drain Current Continuous (TC = 100C) (Note 1.) ID mA
Drain Current Pulsed (Note 2.) IDM mAdc
GateSource Voltage Continuous VGS 75 Vdc
GateSource Voltage Nonrepetitive (tp 50 s) VGSM 800 Vpk
THERMAL CHARACTERISTICS
Total Device Dissipation FR5 Board (Note 3.) (TA = 25C) PD 225 mW
Derate above 25C 1.8 mW/C
Thermal Resistance, Junction to Ambient RJA 556 C/W
Total Device Dissipation Alumina Substrate,(Note 4.) (TA = 25C) PD 300 mW
Derate above 25C 2.4 mW/C
Thermal Resistance, Junction to Ambient RJA 417 C/W
Junction and Storage Temperature TJ, Tstg -55 to +150 C
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
DrainSource Breakdown Voltage (VGS = 0, ID = 10 Adc) V(BR)DSS 60 Vdc
Zero Gate Voltage Drain Current TJ = 25C (VGS = 0, VDS = 60 Vdc) IDSS 1.0 Adc
Zero Gate Voltage Drain Current TJ = 125C (VGS = 0, VDS = 60 Vdc) IDSS 500 Adc
GateBody Leakage Current, Forward (VGS = 20 Vdc) IGSSF 1 Adc
GateBody Leakage Current, Reverse (VGS = 20 Vdc) IGSSR Adc
Gate Threshold Voltage (VDS = VGS, ID = 250 Adc) VGS(th) 1.0 1.6 2.5 Vdc
OnState Drain Current (VDS 2.0 VDS(on), VGS = 10 Vdc) ID(on) 500 mA
Static DrainSource OnState Voltage (VGS = 10 Vdc, ID = 500 mAdc) VDS(on) 0.375 Vdc
Static DrainSource OnState Voltage (VGS = 5.0 Vdc, ID = 50 mAdc) VDS(on) Vdc
Static DrainSource OnState Resistance (VGS = 10 V, ID = 500 mAdc) TC = 25C rDS(on) 1.4 1.8 Ohms
Static DrainSource OnState Resistance (VGS = 10 V, ID = 500 mAdc) TC = 125C rDS(on) Ohms
Static DrainSource OnState Resistance (VGS = 5.0 Vdc, ID = 50 mAdc) TC = 25C rDS(on) 7.5 Ohms
Static DrainSource OnState Resistance (VGS = 5.0 Vdc, ID = 50 mAdc) TC = 125C rDS(on) 13.5 Ohms
Forward Transconductance (VDS 2.0 VDS(on), ID = 200 mAdc) gFS 80 mmhos
DYNAMIC CHARACTERISTICS
Input Capacitance (VDS = 25 Vdc, VGS = 0, f = 1.0 MHz) Ciss 17 50 pF
Output Capacitance (VDS = 25 Vdc, VGS = 0, f = 1.0 MHz) Coss 10 25 pF
Reverse Transfer Capacitance (VDS = 25 Vdc, VGS = 0, f = 1.0 MHz) Crss 2.5 5.0 pF
SWITCHING CHARACTERISTICS (Note 2.)
TurnOn Delay Time (V DD = 25 Vdc , ID 500 mAdc) td(on) 7 20 ns
TurnOff Delay Time (V RG = 25 , RL = 50 , Vgen = 10 V) td(off) 11 40 ns
BODYDRAIN DIODE RATINGS
Diode Forward OnVoltage (IS = 115 mAdc, V GS = 0 V) VSD -1.5 Vdc
Source Current Continuous (Body Diode) IS -115 mAdc
Source Current Pulsed ISM -800 mAdc

Ordering Information:

  • Model: L2N7002WT1G
  • Device Marking: 6C
  • Shipping: 10000 Tape & Reel

Device Marking Diagram:

6C = Device Code
M = Month Code

Pin Assignment:

Top View:
3 (Gate) - 2 (Source) - 1 (Drain)

Simplified Schematic:

Gate - Source - Drain

Dimensions (SC-70 / SOT-323):

DIM MIN NOM MAX MIN INCHES
A 0.80 0.90 1.00 0.032 0.039
A1 0.00 0.05 0.10 0.000 0.004
A2 0.70 0.028
b 0.30 0.35 0.40 0.012 0.016
c 0.10 0.18 0.25 0.004 0.010
D 1.80 2.10 2.20 0.071 0.087
E 1.15 1.24 1.35 0.045 0.053
e 1.20 1.30 1.40 0.047 0.055
e1 0.65 BSC 0.026 BSC
L 2.00 2.10 2.40 0.079 0.095
HE 0.425 REF 0.017 REF

Soldering Footprint:

MIN NOM MAX MIN MAX UNIT
A 0.05 0.075 0.10 0.002 0.004 INCH
C 0.014 0.016 INCH
D 0.075 0.080 0.085 0.003 0.003 INCH
E 0.085 0.090 0.095 0.003 0.004 INCH
e 0.035 0.040 0.045 0.001 0.002 INCH

1810251916_LRC-L2N7002WT1G_C12778.pdf

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