MCC MCU12P10 TP featuring high density cell design and lead free finish RoHS compliant for switching

Key Attributes
Model Number: MCU12P10-TP
Product Custom Attributes
Drain To Source Voltage:
100V
Current - Continuous Drain(Id):
9.2A
Operating Temperature -:
-55℃~+150℃@(Tj)
RDS(on):
170mΩ@10V,8A
Gate Threshold Voltage (Vgs(th)):
1.9V
Reverse Transfer Capacitance (Crss@Vds):
41pF@25V
Number:
1 P-Channel
Input Capacitance(Ciss):
1.055nF@25V
Pd - Power Dissipation:
40W
Gate Charge(Qg):
25nC@10V
Mfr. Part #:
MCU12P10-TP
Package:
DPAK
Product Description

Product Overview

The MCU12P10 is a P-Channel MOSFET from MCC Semi, designed with Advanced Trench Process Technology and a High Density Cell Design for ultra-low on-resistance. It offers a reliable and rugged performance, meeting UL 94 V-0 flammability rating and Moisture Sensitivity Level 1. This MOSFET is suitable for various applications requiring efficient power switching. Halogen-free options are available upon request by adding the "-HF" suffix, and the product is Lead Free Finish/RoHS Compliant.

Product Attributes

  • Brand: MCC Semi
  • Technology: Advanced Trench Process
  • Cell Design: High Density Cell Design
  • Flammability Rating: UL 94 V-0
  • Moisture Sensitivity Level: 1
  • RoHS Compliance: Lead Free Finish/RoHS Compliant (indicated by "P" suffix)
  • Halogen Free: Available upon request (by adding "-HF" suffix)

Technical Specifications

Parameter Symbol Test Conditions Min Typ Max Unit
Maximum Ratings
Drain-Source Voltage VDS -100 V
Gate-Source Voltage VGS ±20 V
Continuous Drain Current ID TC=25°C -9.2 A
Pulsed Drain Current IDM -30 A
Single Pulse Avalanche Energy EAS TC=100°C (Note 2) 110 mJ
Total Power Dissipation PD 1.7 W
Operating Junction Temperature Range -55 +150 °C
Storage Temperature Range -55 +150 °C
Thermal Resistance (Junction to Case) RθJC (Note 1) 3.13 °C/W
Static Characteristics
Drain-Source Breakdown Voltage V(BR)DSS VGS=0V, ID=-250µA -100 V
Gate-Source Leakage Current IGSS VDS=0V, VGS =±20V ±10 µA
Zero Gate Voltage Drain Current IDSS VDS=-100V, VGS=0V -1 µA
Gate-Threshold Voltage VGS(th) VDS=VGS, ID=-250µA (Note 3) -1 -1.9 -3 V
Drain-Source On-Resistance RDS(on) VGS=-10V, ID=-8A (Note 3) 170 200
Forward Tranconductance gFS VDS=-15V, ID=-5A (Note 3) 12 S
Dynamic Characteristics
Input Capacitance Ciss VDS=-25V,VGS=0V,f=1MHz 1055 pF
Output Capacitance Coss 65 pF
Reverse Transfer Capacitance Crss 41 pF
Total Gate Charge Qg VDD=-50V,ID=-10A 25 nC
Gate-Source Charge Qgs VGS=-10V,RGEN=9.1Ω 5 nC
Gate-Drain Charge Qgd 7 nC
Turn-On Delay Time td(on) VDS=-50V,VGS=-10V,ID=-10A 14 ns
Turn-On Rise Time tr 18 ns
Turn-Off Delay Time td(off) 50 ns
Turn-Off Fall Time tf 18 ns
Drain-Source Body Diode Characteristics
Continuous Body Diode Current IS TC=25°C -13 A
Body Diode Voltage VSD IF=-10A, VGS=0V -1.2 V
Reverse Recovery Time trr IF=-10A,di/dt=100A/μs 35 ns
Reverse Recovery Charge Qrr 46 nC
Package Dimensions (DPAK/TO-252)
DIM INCHES MM MIN MAX MIN MAX
A 0.087 2.20 0.094 2.40
B 0.000 0.00 0.005 0.13
C 0.026 0.66 0.034 0.86
D 0.018 0.46 0.023 0.58
E 0.256 6.50 0.264 6.70
F 0.201 5.10 0.215 5.46
G 0.236 6.00 0.244 6.20
H 0.086 2.18 0.094 2.39
I 0.386 9.80 0.409 10.40
J 0.055 1.40 0.067 1.70
K 0.211 5.35
L 0.114 2.90 0.190 4.83
M 0.063 1.60
O 0.043 1.10 0.051 1.30
Q 0.000 0.00 0.012 0.30
V 0.114 2.90 0.190 4.83
Pinout 1. Gate 2,4. Drain 3. Source

Notes:

  • 1. Surface Mounted on FR4 Board, t ≤ 10 sec.
  • 2. EAS Condition: TJ=25°C, VDD=-50V, VG=-10V, L=0.5mH, Rg=25Ω.
  • 3. Pulse Test: Pulse Width ≤ 300µs, Duty Cycle ≤ 2%.
  • 4. Guaranteed by Design, Not Subject to Production Testing.

Ordering Information:

Device Packing Part Number
MCU12P10 Tape&Reel: 2.5Kpcs/Reel Part Number-TP

Note: Adding "-HF" Suffix for Halogen Free, e.g., Part Number-TP-HF


2008121536_MCC-MCU12P10-TP_C721380.pdf

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