Trench MOSFET Device LRC LN237N3T5G 30V Single N Channel with Low RDS ON and Fast Switching Features

Key Attributes
Model Number: LN237N3T5G
Product Custom Attributes
Drain To Source Voltage:
30V
Current - Continuous Drain(Id):
1.5A
RDS(on):
680mΩ@2.5V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
1.5V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
4.2pF
Number:
1 N-channel
Input Capacitance(Ciss):
55.8pF
Pd - Power Dissipation:
-
Gate Charge(Qg):
750pC@4.5V
Mfr. Part #:
LN237N3T5G
Package:
SOT-883-3
Product Description

Product Overview

The LN237N3T5G is a 30V, single N-channel Trench MOSFET designed for various electronic applications. It features fast switching, low RDS(ON), and is manufactured using Trench MOSFET technology. This device is Pb-Free, RoHS compliant, and Halogen Free. The 'S-' prefix variant is AEC-Q101 qualified and PPAP capable, suitable for automotive and other applications with unique site and control change requirements. Key applications include low-side load switching, level shift circuits, DC-DC converters, and portable devices such as DSCs, PDAs, and cell phones.

Product Attributes

  • Brand: Leshan Radio Company, LTD.
  • Technology: Trench MOSFET
  • Compliance: Pb Free Device, RoHS, Halogen Free
  • Qualification (S- prefix): AEC-Q101 qualified, PPAP capable
  • Material: Compliant with RoHS requirements and Halogen Free

Technical Specifications

Parameter Symbol Min. Typ. Max. Unit Notes
Drain-to-Source Voltage VDSS 30 V
Gate-to-Source Voltage VGS 12 V
Drain Current (Steady State, TA = 25C) ID 3.7 A Note 1
Drain Current (Steady State, TA = 100C) ID 1.5 A Note 1
Power Dissipation (Steady State, Note 1) PD 305 mW
Junction-to-Ambient Thermal Resistance (Steady State, Note 1) RJA 715 /W
Operating Junction and Storage Temperature Range TJ , TSTG -55 150
Lead Temperature for Soldering Purposes TL 260 (1/8 from case for 10 s)
Pulsed Drain Current (tp = 10 s) IDM 30 A
Drain-Source Breakdown Voltage (VGS =0V, ID =250A) V(BR)DSS 30 V
Gate Threshold Voltage (VDS =VGS , ID =250A) VGS(th) 0.45 1 V
Gate-Body Leakage Current (VDS =0V, VGS =12V) IGSS 10 A
Zero Gate Voltage Drain Current (VDS =30V, VGS =0V) IDSS 0.1 1 A
Drain-Source On-Resistance (VGS =4.5V, ID = 500mA) RDS(ON) 0.13 0.29
Drain-Source On-Resistance (VGS =2.5V, ID = 500mA) RDS(ON) 0.29 0.5
Diode Forward Voltage (IS =300mA, VGS =0V) VSD 0.68 V
Total Gate Charge Qg 55.8 nC (VDS =15V, VGS =4.5V, ID =1.0A)
Gate-Source Charge Qgs 1.2 nC (VDS =15V, VGS =4.5V, ID =1.0A)
Gate-Drain Charge Qgd 0.46 nC (VDS =15V, VGS =4.5V, ID =1.0A)
Input Capacitance Ciss 750 pF (VDS =15V, VGS =0V, f=1MHz)
Output Capacitance Coss 150 pF (VDS =15V, VGS =0V, f=1MHz)
Reverse Transfer Capacitance Crss 40 pF (VDS =15V, VGS =0V, f=1MHz)
Turn-On Delay Time td(on) 10.10 ns (VDS =30V, ID=0.5A, VGS=4.5V, RG =2, RL =30 , tp=1us) Note 2
Rise Time tr ns (VDS =30V, ID=0.5A, VGS=4.5V, RG =2, RL =30 , tp=1us) Note 2
Turn-Off Delay Time td(off) ns (VDS =30V, ID=0.5A, VGS=4.5V, RG =2, RL =30 , tp=1us) Note 2
Fall Time tf ns (VDS =30V, ID=0.5A, VGS=4.5V, RG =2, RL =30 , tp=1us) Note 2
Gate Resistance Rg 9.7 (VDS = 0 V, VGS = 0 V, f = 1 MHz)

Note 1: Surface-mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq [1 oz] including traces)

Note 2: Pulse test; pulse width300s, duty cycle 2%


2112160930_LRC-LN237N3T5G_C383245.pdf

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