650V Field Stop Trench IGBT MagnaChip Semicon MBQ50T65FESCTH designed for loss and high speed switching

Key Attributes
Model Number: MBQ50T65FESCTH
Product Custom Attributes
Mfr. Part #:
MBQ50T65FESCTH
Package:
TO-247
Product Description

Product Overview

The Magnachip MBQ50T65FESC is a 650V Field Stop Trench IGBT, engineered with advanced technology for high-speed switching and low power loss. It offers excellent quality and high input impedance, making it suitable for demanding applications such as Power Factor Correction (PFC), Uninterruptible Power Supplies (UPS), and inverters. This device also finds application in welders and IH cookers, providing reliable performance with a maximum junction temperature of 175C.

Product Attributes

  • Brand: Magnachip Semiconductor Ltd.
  • Technology: Field Stop Trench IGBT
  • Certifications: Halogen Free
  • Package Type: TO-247

Technical Specifications

Parameter Symbol Rating Unit Conditions
Maximum Ratings
Collector-emitter voltage VCE 650 V -
DC collector current, limited by Tvjmax IC 100 A TC=25C
DC collector current, limited by Tvjmax IC 50 A TC=100C
Pulsed collector current, tp limited by Tjvjmax ICpuls 200 A -
Turn off safe operating area - -200 A VCE 650V, Tvj 175C
Diode forward current limited by Tvjmax IF 60 A TC=25C
Diode forward current limited by Tvjmax IF 30 A TC=100C
Diode pulsed current, tp limited by Tvjmax IFpuls 200 A -
Gate-emitter voltage VGE 20 V -
Power dissipation PD 375 W TC=25C
Power dissipation PD 188 W TC=100C
Short circuit withstand time tsc 5 s VCC 400V, VGE = 15V, Tvj = 150C
Operating Junction temperature range Tvj -40~175 C -
Storage temperature range Tstg -55~150 C -
Soldering temperature (Wave soldering 1.6 mm from case for 10s) - 260 C -
Mounting torque, M3 screw M 0.6 Nm Maximum of mounting processes
Thermal Characteristics
Thermal resistance junction-to-ambient RJA 40 C/W -
Thermal resistance junction-to-case for IGBT RJC 0.4 C/W -
Thermal resistance junction-to-case for Diode RJC 1.2 C/W -
Features
High Speed Switching & Low Power Loss - - - -
VCE(sat) - 1.85 V @ IC = 50A
Eoff - 0.55 mJ @ TC = 25C
High Input Impedance - - - -
trr - 80 ns (typ.) @diF/dt = 1000A/ s
Maximum junction temperature - 175 C -
Applications
PFC - - - -
UPS - - - -
PV Inverter - - - -
Welder - - - -
IH Cooker - - - -
Ordering Information
Part Number Marking Temp. Range Package Packing
MBQ50T65FESCTH 50T65FESC -55~175C TO-247 Tube
Electrical Characteristics (Tvj = 25C unless otherwise specified)
Collector-emitter breakdown voltage BVCES 650 V IC = 2mA, VGE = 0V
Collector-emitter saturation voltage VCE(sat) - V IC = 50A, VGE =15V, Tvj = 25C
Collector-emitter saturation voltage VCE(sat) - V IC = 50A, VGE =15V, Tvj = 175C
Diode forward voltage VF - V VGE = 0V, IF = 30A, Tvj = 25C
Diode forward voltage VF - V VGE = 0V, IF = 30A, Tvj = 175C
Gate-emitter threshold voltage VGE(th) 3.8 ~ 6.2 V VCE = VGE, IC = 0.5mA
Zero gate voltage collector current ICES - A VCE = 650V, VGE = 0V, Tvj = 25C
Gate-emitter leakage current IGES - nA VGE = 20V, VCE = 0V
Dynamic Characteristic
Total gate charge Qg - nC VCE = 520V, IC = 50A, VGE = 15V
Gate-emitter charge Qge - - -
Gate-collector charge Qgc - - -
Input capacitance Cies - pF VCE = 25V, VGE = 0V, f = 1MHz
Reverse transfer capacitance Cres - - -
Output capacitance Coes - - -
Internal emitter inductance (measured 5mm from case) LE - nH -
Short circuit collector current IC(SC) - A VGE = 15V, VCC = 400V, tSC 5s, Tvj = 150C (Max. 1000 short circuits, Time between short circuits: 1.0s)
Switching Characteristic (Tvj = 25C)
Turn-on delay time td(on) - ns VGE = 15V, VCC = 400V, IC = 50A, RG = 7.9, Inductive Load
Rise time tr - - -
Turn-off delay time td(off) - - -
Fall time tf - - -
Turn-on switching energy Eon - mJ -
Turn-off switching energy Eoff - - -
Total switching energy Ets - - -
Switching Characteristic (Tvj = 175C)
Turn-on delay time td(on) - ns VGE = 15V, VCC = 400V, IC = 50A, RG = 7.9, Inductive Load
Rise time tr - - -
Turn-off delay time td(off) - - -
Fall time tf - - -
Turn-on switching energy Eon - mJ -
Turn-off switching energy Eoff - - -
Total switching energy Ets - - -
Diode Reverse Recovery Characteristic (Tvj = 25C)
Reverse recovery time trr - ns IF = 30A, diF/dt = 1000A/ s
Reverse recovery current Irr - A -
Reverse recovery charge Qrr - C -
Diode Reverse Recovery Characteristic (Tvj = 175C)
Reverse recovery time trr - ns IF = 30A, diF/dt = 1000A/ s
Reverse recovery current Irr - A -
Reverse recovery charge Qrr - C -
Physical Dimensions (TO-247)
Dimension Min(mm) Max(mm) Unit Note
A 4.70 5.31 mm -
A1 2.20 2.60 mm -
A2 1.50 2.49 mm -
b 0.99 1.40 mm -
b1 2.59 3.43 mm -
b2 1.65 2.39 mm -
c 0.38 0.89 mm -
D 20.30 21.46 mm -
D1 13.08 - mm -
E 15.45 16.26 mm -
E1 13.06 14.02 mm -
E2 4.32 5.49 mm -
e 5.45 - BSC -
L 19.81 20.57 mm -
L1 - 4.50 mm -
P 3.50 3.70 mm -
Q 5.38 6.20 mm -
S 6.15 - BSC -

2509121506_MagnaChip-Semicon-MBQ50T65FESCTH_C41348474.pdf

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