Silicon Carbide Schottky Diode MICROCHIP MSC010SDA120K 1200 Volt 10 Amp TO220 Package for Power Applications

Key Attributes
Model Number: MSC010SDA120K
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
75A
Reverse Leakage Current (Ir):
200uA@1200V
Voltage - DC Reverse (Vr) (Max):
1.2kV
Voltage - Forward(Vf@If):
1.5V@10A
Current - Rectified:
10A
Mfr. Part #:
MSC010SDA120K
Package:
TO-220-2
Product Description

Microsemi MSC010SDA120K Zero Recovery Silicon Carbide Schottky Diode

The MSC010SDA120K is a 1200 V, 10 A Silicon Carbide (SiC) Schottky Barrier Diode (SBD) in a two-lead TO-220 package. It offers increased performance and lower total cost of ownership over silicon diode solutions for high-voltage applications. Key features include low forward voltage, low leakage current, no reverse recovery current/no forward recovery, and avalanche energy rating. Benefits include higher reliability systems, minimized heat sink requirements, and higher efficiency. Applications include H/EV powertrain, EV chargers, power supplies, PV inverters, industrial motor drives, smart grid transmission and distribution, and aviation.

Product Attributes

  • Brand: Microsemi
  • Material: Silicon Carbide (SiC)
  • Certifications: RoHS compliant

Technical Specifications

ParameterSymbolRatingsUnitTest Conditions
Maximum DC reverse voltageVR1200V
Maximum peak repetitive reverse voltageVRRMV
Maximum working peak reverse voltageVRWMV
Maximum DC forward currentIF27ATC = 25 C
Maximum DC forward currentIF13ATC = 135 C
Maximum DC forward currentIF11ATC = 145 C
Repetitive peak forward surge currentIFRM38ATC = 25 C, tp = 8.3 ms, half sine wave
Non-repetitive forward surge currentIFSM75ATC = 25 C, tp = 8.3 ms, half sine wave
Power dissipationPtot136WTC = 25 C
Power dissipationPtot59WTC = 110 C
Operating junction and storage temperature rangeTJ, TSTG55 to 175C
Lead temperature for 10 SecondsTL300C
Single pulse avalanche energyEAS100mJStarting TJ = 25 C, L = 2.0 mH, peak IL = 10 A
Junction-to-case thermal resistanceRJC0.67C/W
Junction-to-case thermal resistanceRJC1.1C/W
Package weightWT1.9g
Maximum mounting torqueTorque0.7N-m
Forward voltageVF1.5VIF = 10 A, TJ = 25 C
Forward voltageVF1.8VIF = 10 A, TJ = 25 C
Forward voltageVF2.1VIF = 10 A, TJ = 175 C
Reverse leakage currentIRM3AVR = 1200 V, TJ = 25 C
Reverse leakage currentIRM200AVR = 1200 V, TJ = 25 C
Reverse leakage currentIRM50AVR = 1200 V, TJ = 175 C
Total capacitive chargeQC48nCVR = 600 V, TJ = 25 C
Junction capacitanceCJ55pFVR = 400 V, TJ = 25 C, = 1 MHz
Junction capacitanceCJ43pFVR = 800 V, TJ = 25 C, = 1 MHz

2411272108_MICROCHIP-MSC010SDA120K_C5785548.pdf

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