silicon n channel power mosfet Minos IRFP460 suitable for switching mode power supplies applications

Key Attributes
Model Number: IRFP460
Product Custom Attributes
Drain To Source Voltage:
500V
Current - Continuous Drain(Id):
20A
RDS(on):
280mΩ@10V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
4V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
18pF
Number:
1 N-channel
Output Capacitance(Coss):
290pF
Input Capacitance(Ciss):
1.92nF
Pd - Power Dissipation:
230W
Gate Charge(Qg):
56nC@10V
Mfr. Part #:
IRFP460
Package:
TO-247
Product Description

Product Overview

The IRFP460 is a silicon N-Channel Enhanced Power MOSFET, engineered with advanced technology to minimize conduction losses, enhance switching performance, and improve avalanche energy. This transistor is ideal for applications requiring high-frequency switching, such as SMPS (Switching Mode Power Supplies) and general-purpose power electronics.

Product Attributes

  • Brand: mns-kx.com (Shenzhen Minos)
  • Material: Silicon N-Channel
  • Certifications: RoHS product
  • Package: TO-247

Technical Specifications

ParameterRatingUnitsTest ConditionsMin.Typ.Max.
General Features
VDS500V
RDS(ON)<280mVGS=10V, ID=20A230
SwitchingFast
CrsspF18
Avalanche Tested100%
dv/dt capabilityImproved
Absolute Ratings
VDSS500V@ TA=25
ID Continuous Drain Current20A@ TA=25
ID Continuous Drain Current12.6ATC = 100 C
IDM Pulsed Drain Current80A(Note1)
VGS Gate-to-Source Voltage30V
EAS Single Pulse Avalanche Energy1200mJ(Note2)
dv/dt Peak Diode Recovery dv/dt5.0V/ns(Note3)
PD Power Dissipation230WTO-247 @ TA=25
TJ, Tstg Operating Junction and Storage Temperature Range55150
TL Maximum Temperature for Soldering300
Thermal Characteristics
RJC Junction-to-Case/W0.54
RJA Junction-to-Ambient/W62.5
OFF Characteristics
VDSS Drain to Source Breakdown Voltage500VVGS=0V, ID=250A
BVDSS/ TJ Bvdss Temperature CoefficientV/ID=250uA, Reference250.6
IDSS Drain to Source Leakage CurrentAVDS =500V, VGS= 0V, Tj= 2510
IDSS Drain to Source Leakage CurrentAVDS =400V, VGS= 0V, Tj = 125100
IGSS(F) Gate to Source Forward LeakagenAVGS=+30V100
IGSS(R) Gate to Source Reverse LeakagenAVGS=-30V-100
ON Characteristics
RDS(ON) Drain-to-Source On- ResistanceVGS=10V, ID=10A(Note4)0.230.28
VGS(TH) Gate Threshold VoltageVVDS= VGS, ID = 250A(Note4)2.04.0
gfs Forward TransconductanceSVDS=20V, ID=10A(Note4)12
Dynamic Characteristics
Rg Gate resistancef = 1.0MHz1.5
Ciss Input CapacitancepFVGS= 0V, VDS = 25V, f = 1.0MHz1920
Coss Output CapacitancepF290
Crss Reverse Transfer CapacitancepF18
Switching Characteristics
td(ON) Turn-on Delay TimensID=20A, VDD = 250V, VGS = 10V, RG =2033
tr Rise Timens75
td(OFF) Turn-Off Delay Timens91
tf Fall Timens83
Qg Total Gate ChargenCID =20A, VDD=400V, VGS= 10V56
Qgs Gate to Source ChargenC13
Qgd Gate to Drain (Miller)ChargenC20
Source-Drain Diode Characteristics
IS Continuous Source Current (Body Diode)ATC=25 C20
ISM Maximum Pulsed Current (Body Diode)A80
VSD Diode Forward VoltageVIS=20A, VGS=0V(Note4)1.2
trr Reverse Recovery TimensIS=20A, Tj = 25C, dIF/dt=100A/us, VGS=0V536
Qrr Reverse Recovery ChargenC5668
Irrm Reverse Recovery CurrentA21.1

2410122012_Minos-IRFP460_C22389973.pdf

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