Silicon N Channel Power MOSFET Minos MD20N50 with Low Conduction Resistance and Fast Switching Speed

Key Attributes
Model Number: MD20N50
Product Custom Attributes
Drain To Source Voltage:
500V
Current - Continuous Drain(Id):
20A
RDS(on):
280mΩ@10V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
4V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
18pF
Number:
1 N-channel
Output Capacitance(Coss):
290pF
Input Capacitance(Ciss):
1.92nF
Pd - Power Dissipation:
230W
Gate Charge(Qg):
83nC@10V
Mfr. Part #:
MD20N50
Package:
TO-247
Product Description

Product Description

The MD20N50 is a silicon N-Channel Enhanced Power MOSFET designed using advanced technology to reduce conduction loss, improve switching performance, and enhance avalanche energy. It is suitable for applications such as Switch Mode Power Supplies (SMPS), high-speed switching, and general-purpose use. Key advantages include low conduction resistance, fast switching speeds, low Crss, 100% avalanche tested, and improved dv/dt capability.

Product Attributes

  • Brand: MNS-KX
  • Material: Silicon N-Channel
  • Certifications: RoHS product

Technical Specifications

ParameterRatingUnitsConditionsMin.Typ.Max.
General Features
VDS500V
RDS(ON)280mVGS=10V, ID=20A230
SwitchingFast
Crrs18pFTypical
Avalanche Tested100%
dv/dt capabilityImproved
Applications
High frequency switching mode power supplyYes
Absolute Ratings
VDSS500V@ Ta=25
ID Continuous Drain Current20A@ Ta=25
ID Continuous Drain Current12.6ATC = 100 C
IDM Pulsed Drain Current80A(Note1)
VGS Gate-to-Source Voltage30V
EAS Single Pulse Avalanche Energy1200mJ(Note2)
dv/dt Peak Diode Recovery dv/dt5.0V/ns(Note3)
PD Power Dissipation (TO-220, TO-3PN)230W
PD Power Dissipation (TO-220F, TO-3PF)48W
TJ, Tstg Operating Junction and Storage Temperature Range-55 to 150
TL Maximum Temperature for Soldering300
Thermal Characteristics (No FullPAK)
RJC Junction-to-Case0.54/W
RJA Junction-to-Ambient62.5/W
Thermal Characteristics (FullPAK)
RJC Junction-to-Case2.6/W
RJA Junction-to-Ambient62.5/W
OFF Characteristics
VDSS Drain to Source Breakdown Voltage500VVGS=0V, ID=250A
BVDSS/ TJ Bvdss Temperature CoefficientV/ID=250uA, Reference250.6
IDSS Drain to Source Leakage Current10AVDS=500V, VGS= 0V, Tj = 25
IDSS Drain to Source Leakage Current100AVDS=400V, VGS= 0V, Tj = 125
IGSS(F) Gate to Source Forward Leakage100nAVGS=+30V
IGSS(R) Gate to Source Reverse Leakage-100nAVGS=-30V
ON Characteristics
RDS(ON) Drain-to-Source On- Resistance0.28VGS=10V, ID=10A(Note4)0.23
VGS(TH) Gate Threshold Voltage4.0VVDS = VGS, ID = 250A(Note4)2.0
gfs Forward Transconductance12SVDS=20V, ID =10A(Note4)
Dynamic Characteristics
Rg Gate resistance1.5f = 1.0MHz
Ciss Input Capacitance1920pFVGS = 0V VDS = 25V f = 1.0MHz
Coss Output Capacitance290pF
Crrs Reverse Transfer Capacitance18pF
Switching Characteristics
td(ON) Turn-on Delay Time33nsID=20A VDD= 250V VGS = 10V RG =20
tr Rise Time75ns
td(OFF) Turn-Off Delay Time91ns
tf Fall Time83ns
Qg Total Gate Charge56nCID =20A VDD=400V VGS = 10V
Qgs Gate to Source Charge13nC
Qgd Gate to Drain (Miller)Charge20nC
Source-Drain Diode Characteristics
IS Continuous Source Current (Body Diode)20ATC=25 C
ISM Maximum Pulsed Current (Body Diode)80A
VSD Diode Forward Voltage1.2VIS=20A, VGS=0V(Note4)
trr Reverse Recovery Time536nsIS=20A, Tj = 25C dIF/dt=100A/us, VGS=0V
Qrr Reverse Recovery Charge5668nC
Irrm Reverse Recovery Current21.1A

2410122012_Minos-MD20N50_C2980279.pdf

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