Power management N channel MOSFET Megain MGD28N06L with excellent CdVdt effect decline and performance

Key Attributes
Model Number: MGD28N06L
Product Custom Attributes
Drain To Source Voltage:
60V
Current - Continuous Drain(Id):
23A
RDS(on):
28mΩ@10V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
2.5V@250uA
Reverse Transfer Capacitance (Crss@Vds):
64pF
Output Capacitance(Coss):
86pF
Pd - Power Dissipation:
34.7W
Input Capacitance(Ciss):
1.378nF
Gate Charge(Qg):
12.6nC@4.5V
Mfr. Part #:
MGD28N06L
Package:
TO-252
Product Description

Product Overview

The MGD28N06L is an N-channel MOSFET designed for various power management applications. It features super low gate charge, 100% EAS guaranteed, and excellent CdV/dt effect decline due to its advanced high cell density Trench technology. This device is suitable for load switching, PWM applications, and general power management.

Product Attributes

  • Brand: Megain
  • Origin: Not specified
  • Material: Not specified
  • Color: Not specified
  • Certifications: Green Device Available

Technical Specifications

ParameterValueUnitsConditions
Absolute Maximum Ratings
Drain-Source Voltage (VDS)60V
Gate-Source Voltage (VGS)±20V
Continuous Drain Current (ID) @ TC=25, VGS=10V23A
Continuous Drain Current (ID) @ TC=100, VGS=10V15A
Continuous Drain Current (ID) @ TA=25, VGS=10V5.6A
Continuous Drain Current (ID) @ TA=70, VGS=10V4.5A
Pulsed Drain Current (IDM)46A
Single Pulse Avalanche Energy (EAS)25.5mJ
Avalanche Current (IAS)22.6A
Total Power Dissipation (PD) @ TC=25°C34.7W
Total Power Dissipation (PD) @ TA=25°C2W
Storage Temperature Range (TSTG)-55 to 150°C
Operating Junction Temperature Range (TJ)-55 to 150°C
Thermal Characteristics
Thermal Resistance Junction-Ambient (RθJA)-62°C/W
Thermal Resistance Junction-Case (RθJC)-3.6°C/W
Electrical Characteristics
Drain-Source Breakdown Voltage (BVDSS)60VVGS=0V, ID=250µA
BVDSS Temperature Coefficient-0.063V/°CReference to 25°C, ID=1mA
Drain-Source On-state Resistance (RDS(ON))28VGS=10V, ID=15A (Typ)
Drain-Source On-state Resistance (RDS(ON))35VGS=10V, ID=15A (Max)
Drain-Source On-state Resistance (RDS(ON))33VGS=4.5V, ID=10A (Typ)
Drain-Source On-state Resistance (RDS(ON))41VGS=4.5V, ID=10A (Max)
Gate Threshold Voltage (VGS(th))1.2VVGS=VDS, ID=250µA (Min)
Gate Threshold Voltage (VGS(th))2.5VVGS=VDS, ID=250µA (Max)
VGS(th) Temperature Coefficient--5.24mV/°C
Drain-Source Leakage Current (IDSS)-1µAVDS=48V, VGS=0V, TJ=25°C (Max)
Drain-Source Leakage Current (IDSS)-5µAVDS=48V, VGS=0V, TJ=55°C (Max)
Gate-Source Leakage Current (IGSS)-±100nAVGS=±20V, VDS=0V
Forward Transconductance (gfs)-17SVDS=5V, ID=15A (Typ)
Gate Resistance (Rg)-3.2ΩVDS=0V, VGS=0V, f=1MHz (Typ)
Total Gate Charge (Qg)-12.6nCVDS=48V, VGS=4.5V, ID=12A (Typ)
Gate-Source Charge (Qgs)-3.2nC
Gate-Drain Charge (Qgd)-6.3nC
Turn-on Delay Time (Td(ON))-8nSVDD=30V, VGS=10V, RG=3.3Ω, ID=10A (Typ)
Turn-on Rise Time (Tr)-14.2nS
Turn-off Delay Time (Td(OFF))-24.4nS
Turn-off Fall Time (Tf)-4.6nS
Input Capacitance (Ciss)-1378pFVDS=15V, VGS=0V, F=1MHz (Typ)
Output Capacitance (Coss)-86pF
Reverse Transfer Capacitance (Crss)-64pF
Diode Characteristics
Continuous Source Current (IS)-23AVG=VD=0V, Force Current
Pulsed Source Current (ISM)-46A
Diode Forward Voltage (VSD)-1.2VVGS=0V, IS=1A, TJ=25°C (Max)

Note:
1. The data tested by surface mounted on a 1 inch² FR-4 board with 2OZ copper.
2. The data tested by pulsed, pulse width ≤ 300µs, duty cycle ≤ 2%.
3. The EAS data shows Max. rating. The test condition is VDD=25V, VGS=10V, L=0.1mH, IAS=22.6A.
4. The power dissipation is limited by 150°C junction temperature.
5. The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.


2506251635_Megain-MGD28N06L_C49242749.pdf

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