Power management N channel MOSFET Megain MGD28N06L with excellent CdVdt effect decline and performance
Product Overview
The MGD28N06L is an N-channel MOSFET designed for various power management applications. It features super low gate charge, 100% EAS guaranteed, and excellent CdV/dt effect decline due to its advanced high cell density Trench technology. This device is suitable for load switching, PWM applications, and general power management.
Product Attributes
- Brand: Megain
- Origin: Not specified
- Material: Not specified
- Color: Not specified
- Certifications: Green Device Available
Technical Specifications
| Parameter | Value | Units | Conditions | |
|---|---|---|---|---|
| Absolute Maximum Ratings | ||||
| Drain-Source Voltage (VDS) | 60 | V | ||
| Gate-Source Voltage (VGS) | ±20 | V | ||
| Continuous Drain Current (ID) @ TC=25, VGS=10V | 23 | A | ||
| Continuous Drain Current (ID) @ TC=100, VGS=10V | 15 | A | ||
| Continuous Drain Current (ID) @ TA=25, VGS=10V | 5.6 | A | ||
| Continuous Drain Current (ID) @ TA=70, VGS=10V | 4.5 | A | ||
| Pulsed Drain Current (IDM) | 46 | A | ||
| Single Pulse Avalanche Energy (EAS) | 25.5 | mJ | ||
| Avalanche Current (IAS) | 22.6 | A | ||
| Total Power Dissipation (PD) @ TC=25°C | 34.7 | W | ||
| Total Power Dissipation (PD) @ TA=25°C | 2 | W | ||
| Storage Temperature Range (TSTG) | -55 to 150 | °C | ||
| Operating Junction Temperature Range (TJ) | -55 to 150 | °C | ||
| Thermal Characteristics | ||||
| Thermal Resistance Junction-Ambient (RθJA) | - | 62 | °C/W | |
| Thermal Resistance Junction-Case (RθJC) | - | 3.6 | °C/W | |
| Electrical Characteristics | ||||
| Drain-Source Breakdown Voltage (BVDSS) | 60 | V | VGS=0V, ID=250µA | |
| BVDSS Temperature Coefficient | - | 0.063 | V/°C | Reference to 25°C, ID=1mA |
| Drain-Source On-state Resistance (RDS(ON)) | 28 | mΩ | VGS=10V, ID=15A (Typ) | |
| Drain-Source On-state Resistance (RDS(ON)) | 35 | mΩ | VGS=10V, ID=15A (Max) | |
| Drain-Source On-state Resistance (RDS(ON)) | 33 | mΩ | VGS=4.5V, ID=10A (Typ) | |
| Drain-Source On-state Resistance (RDS(ON)) | 41 | mΩ | VGS=4.5V, ID=10A (Max) | |
| Gate Threshold Voltage (VGS(th)) | 1.2 | V | VGS=VDS, ID=250µA (Min) | |
| Gate Threshold Voltage (VGS(th)) | 2.5 | V | VGS=VDS, ID=250µA (Max) | |
| VGS(th) Temperature Coefficient | - | -5.24 | mV/°C | |
| Drain-Source Leakage Current (IDSS) | - | 1 | µA | VDS=48V, VGS=0V, TJ=25°C (Max) |
| Drain-Source Leakage Current (IDSS) | - | 5 | µA | VDS=48V, VGS=0V, TJ=55°C (Max) |
| Gate-Source Leakage Current (IGSS) | - | ±100 | nA | VGS=±20V, VDS=0V |
| Forward Transconductance (gfs) | - | 17 | S | VDS=5V, ID=15A (Typ) |
| Gate Resistance (Rg) | - | 3.2 | Ω | VDS=0V, VGS=0V, f=1MHz (Typ) |
| Total Gate Charge (Qg) | - | 12.6 | nC | VDS=48V, VGS=4.5V, ID=12A (Typ) |
| Gate-Source Charge (Qgs) | - | 3.2 | nC | |
| Gate-Drain Charge (Qgd) | - | 6.3 | nC | |
| Turn-on Delay Time (Td(ON)) | - | 8 | nS | VDD=30V, VGS=10V, RG=3.3Ω, ID=10A (Typ) |
| Turn-on Rise Time (Tr) | - | 14.2 | nS | |
| Turn-off Delay Time (Td(OFF)) | - | 24.4 | nS | |
| Turn-off Fall Time (Tf) | - | 4.6 | nS | |
| Input Capacitance (Ciss) | - | 1378 | pF | VDS=15V, VGS=0V, F=1MHz (Typ) |
| Output Capacitance (Coss) | - | 86 | pF | |
| Reverse Transfer Capacitance (Crss) | - | 64 | pF | |
| Diode Characteristics | ||||
| Continuous Source Current (IS) | - | 23 | A | VG=VD=0V, Force Current |
| Pulsed Source Current (ISM) | - | 46 | A | |
| Diode Forward Voltage (VSD) | - | 1.2 | V | VGS=0V, IS=1A, TJ=25°C (Max) |
Note:
1. The data tested by surface mounted on a 1 inch² FR-4 board with 2OZ copper.
2. The data tested by pulsed, pulse width ≤ 300µs, duty cycle ≤ 2%.
3. The EAS data shows Max. rating. The test condition is VDD=25V, VGS=10V, L=0.1mH, IAS=22.6A.
4. The power dissipation is limited by 150°C junction temperature.
5. The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.
2506251635_Megain-MGD28N06L_C49242749.pdf
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