High Breakdown Voltage N Channel Vertical DMOS FET MICROCHIP TN2106N3 G for Amplifying and Switching

Key Attributes
Model Number: TN2106N3-G
Product Custom Attributes
Drain To Source Voltage:
60V
Current - Continuous Drain(Id):
-
Operating Temperature -:
-55℃~+150℃
RDS(on):
2.5Ω@10V,500mA
Gate Threshold Voltage (Vgs(th)):
600mV
Reverse Transfer Capacitance (Crss@Vds):
8pF
Number:
1 N-channel
Input Capacitance(Ciss):
50pF
Pd - Power Dissipation:
740mW
Mfr. Part #:
TN2106N3-G
Package:
TO-92
Product Description

Product Overview

The TN2106 is a low-threshold, N-Channel Enhancement-Mode Vertical DMOS FET featuring a vertical DMOS structure and a silicon-gate manufacturing process. This device offers the power handling capabilities of bipolar transistors with the high input impedance and positive temperature coefficient of MOS devices. It is free from thermal runaway and thermally induced secondary breakdown, making it ideal for switching and amplifying applications requiring very low threshold voltage, high breakdown voltage, high input impedance, low input capacitance, and fast switching speeds.

Product Attributes

  • Brand: Microchip Technology Inc.
  • Origin: Not specified
  • Material: Not specified
  • Color: Not specified
  • Certifications: Not specified

Technical Specifications

ParameterSymbolMinTypMaxUnitConditions
Absolute Maximum Ratings
Drain-to-Source VoltageBVDSSV
Drain-to-Gate VoltageBVDGSV
Gate-to-Source VoltageVGS-20+20V
Operating Ambient TemperatureTA-55+150C
Storage TemperatureTS-55+150C
DC Electrical Characteristics
Drain-to-Source Breakdown VoltageBVDSS60VVGS = 0V, ID = 1 mA
Gate Threshold VoltageVGS(th)0.62VVGS = VDS, ID = 1 mA
Change in VGS(th) with TemperatureVGS(th)-3.8-5.5mV/CVGS = VDS, ID = 1 mA (Note 1)
Gate Body Leakage CurrentIGSS0.1100nAVGS = 20V, VDS = 0V
Zero-Gate Voltage Drain CurrentIDSS1AVGS = 0V, VDS = Maximum rating
Zero-Gate Voltage Drain CurrentIDSS100AVDS = 0.8 Maximum rating, VGS = 0V, TA = 125C (Note 1)
On-State Drain CurrentID(ON)0.6AVGS = 10V, VDS = 25V
Static Drain-to-Source On-State ResistanceRDS(ON)5VGS = 4.5V, ID = 200 mA
Static Drain-to-Source On-State ResistanceRDS(ON)2.5VGS = 10V, ID = 500 mA
Change in RDS(ON) with TemperatureRDS(ON)0.7%/CVGS = 10V, ID = 500 mA (Note 1)
AC Electrical Characteristics
Forward TransconductanceGFS150400mmhoVDS = 25V, ID = 500 mA
Input CapacitanceCISS3550pFVGS = 0V, VDS = 25V, f = 1 MHz
Common-Source Output CapacitanceCOSS1725pFVGS = 0V, VDS = 25V, f = 1 MHz
Reverse Transfer CapacitanceCRSS78pFVGS = 0V, VDS = 25V, f = 1 MHz
Turn-On Delay Timetd(ON)35nsVDD = 25V, ID = 0.5A, RGEN = 25
Rise Timetr58nsVDD = 25V, ID = 0.5A, RGEN = 25
Turn-Off Delay Timetd(OFF)69nsVDD = 25V, ID = 0.5A, RGEN = 25
Fall Timetf58nsVDD = 25V, ID = 0.5A, RGEN = 25
Diode Parameters
Diode Forward Voltage DropVSD1.21.8VVGS = 0V, ISD = 500 mA (Note 1)
Reverse Recovery Timetrr400nsVGS = 0V, ISD = 500 mA (Note 1)
Temperature Specifications
Operating Ambient TemperatureTA-55+150C
Storage TemperatureTS-55+150C
Package Thermal Resistance
3-lead SOT-23JA203C/W
3-lead TO-92JA132C/W
Thermal Characteristics
PackageID (continuous) (mA)ID (Pulsed) (A)Power Dissipation at TA = 25C (W)IDR (mA) (Note 1)IDRM (A)
3-lead SOT-232800.80.362800.8
3-lead TO-9230010.743001
Product Summary
BVDSS/BVDGS (V)RDS(ON) (Maximum) ()VGS(th) (Maximum) (V)
602.52TN2106

2410121918_MICROCHIP-TN2106N3-G_C632581.pdf

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