650V GaN FET transistor MIRACLE POWER MGZ18N65 suitable for power adapters lighting and SMPS applications

Key Attributes
Model Number: MGZ18N65
Product Custom Attributes
Drain To Source Voltage:
650V
Current - Continuous Drain(Id):
13A
RDS(on):
150mΩ
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
4V
Reverse Transfer Capacitance (Crss@Vds):
1pF
Input Capacitance(Ciss):
598pF
Pd - Power Dissipation:
52W
Output Capacitance(Coss):
30pF
Gate Charge(Qg):
8nC
Mfr. Part #:
MGZ18N65
Package:
DFN8x8-3L
Product Description

Product Overview

The MGZ18N65 is a 650V Gallium Nitride (GaN) Field-Effect Transistor (FET) with enhancement mode operation. It features very low QRR and reduced crossover loss, making it easy to drive with commonly-used gate drivers. This FET enables AC-DC bridgeless totem-pole PFC designs, leading to increased power density, reduced system size and weight, and lower overall system cost. It achieves increased efficiency in both hard- and soft-switched circuits. Applications include power adapters, low power SMPS, and lighting.

Product Attributes

  • Brand: Miracle Technology Co., Ltd.
  • Technology: GaN FET
  • Mode: Enhancement Mode
  • Package: DFN8X8-3L

Technical Specifications

Parameter Condition Min. Typ. Max. Unit
Absolute Maximum Ratings
Drain-Source Voltage (VDS) (Tc = 25C unless otherwise noted) - - 650 V
Transient Drain to Source Voltage (V(TR)DSS) a - - 800 V
Gate-Source Voltage (VGSS) - - 20 V
Maximum Power Dissipation (PD) @TC = 25C - - 52 W
Drain Current-Continuous (ID) TC = 25C b - - 13 A
Drain Current-Continuous (ID) TC = 100C b - - 8.4 A
Drain Current-Pulsed (IDM) Pulse Width = 10s - - 60 A
Operating Temperature (TC) Case -55 - +150 C
Operating Temperature (TJ) Junction -55 - +150 C
Storage Temperature (TS) -55 - +150 C
Soldering Peak Temperature (TSOLD) c - - 260 C
Thermal Characteristics
Thermal Resistance Junction-Case (RJC) - 2.4 - C/W
Thermal Resistance Junction-Ambient (RJA) d - 50 - C/W
Electrical Characteristics (TJ = 25C unless otherwise noted)
Off Characteristics
Reverse Breakdown Voltage (V(BL)DSS) VGS = 0V 650 - - V
Reverse Leakage Current (IDSS) VGS = 0V, VDS = 650V, TJ = 25C - 2.5 25 A
Reverse Leakage Current (IDSS) VGS = 0V, VDS = 650V, TJ = 150C - 10 - A
Gate-to-source Leakage Current (IGSS) VDS = 0V, VGS = 20V - - 100 nA
On Characteristics
Gate Threshold Voltage (VGS(th)) VDS = VGS, ID =500A 3.3 4.0 4.8 V
On Resistance (RDS(on)eff) VGS = 10V, ID =8.5A, TJ = 25C - 150 180 m
On Resistance (RDS(on)eff) VGS = 10V, ID =8.5A, TJ = 150C - 307 - m
Dynamic Characteristics
Input Capacitance (CISS) VGS = 0 V, VDS = 400 V, f=1MHz - 598 - pF
Output Capacitance (COSS) - 30 - pF
Transfer Capacitance (CRSS) - 1 - pF
Output Capacitance, energy related (Co(er)) VGS = 0 V, VDS = 0~400 V - 43 - pF
Output Capacitance, time related (Co(tr)) - 85 - pF
On Characteristics
Turn-On Delay Time (td(on)) VGS = 0~12 V, VDS = 400 V , ID = 10 A , Rg = 70 - 13 - ns
Turn-On Rise Time (tr) - 25 - ns
Turn-Off Delay Time (td(off)) - 47 - ns
Turn-Off Fall Time (tf) - 34 - ns
Total Gate Charge (QG) VGS = 0~10 V, VDS = 400 V , ID = 8.5 A - 8.0 - nC
Gate-Source Charge (QGS) - 3.3 - nC
Gate-Drain Charge (QGD) - 2.0 - nC
Output Charge (QOSS) VGS=0V,VDS=0~400 V - 34 - nC
Drain-Source Diode Characteristics
Reverse Current (IS) VGS = 0 V - - 13 A
Reverse Voltage (VSD) VGS = 0V, IS = 10 A - 2.4 - V
Reverse Voltage (VSD) VGS = 0V, IS = 5 A - 1.6 - V
Reverse Recovery Time (tRR) IS = 10 A ,VDS= 400V, di/dt = 1000 A/s - 31 - ns
Reverse Recovery Charge (QRR) - 40 - nC

Notes:
a. In off-state, spike duty cycle D<0.01, spike duration <1s .
b. For increased stability at high current operation.
c. Reflow MSL3 .
d. Device on one layer epoxy PCB for drain connection (vertical and without air stream cooling, with 6cm copper area and 70m thickness).

Package Information: DFN8X8-3L

Revision History:
Version 0.1, Date 2021-12-10: Preliminary Version


2410122131_MIRACLE-POWER-MGZ18N65_C17702019.pdf

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