Power MOSFET Minos K2837-MNS Silicon N-Channel for High Frequency Switching and General Applications

Key Attributes
Model Number: K2837-MNS
Product Custom Attributes
Drain To Source Voltage:
500V
Current - Continuous Drain(Id):
20A
RDS(on):
230mΩ@10V,10A
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
4V
Reverse Transfer Capacitance (Crss@Vds):
18pF@25V
Number:
1 N-channel
Input Capacitance(Ciss):
1.92nF@25V
Pd - Power Dissipation:
230W
Gate Charge(Qg):
56nC@10V
Mfr. Part #:
K2837-MNS
Package:
TO-3P
Product Description

Product Overview

The K2837-MNS is a silicon N-Channel Enhanced Power MOSFET designed using advanced technology to reduce conduction loss, improve switching performance, and enhance avalanche energy. It is suitable for high-frequency switching mode power supplies (SMPS) and general-purpose applications requiring high-speed switching.

Product Attributes

  • Brand: MNS (Shenzhen Minos)
  • Material: Silicon N-Channel
  • Certifications: RoHS product
  • Package: TO-3P

Technical Specifications

ParameterRatingUnitsConditionsMin.Typ.Max.
General Features
VDS500V
RDS(ON)<280mVGS=10V, ID=20A230
Absolute Ratings
VDSS500V@ TA=25
ID Continuous Drain Current20A@ TA=25
ID Continuous Drain Current12.6A@ TC = 100 C
IDM Pulsed Drain Current80A(Note1)
VGS Gate-to-Source Voltage30V
EAS Single Pulse Avalanche Energy1200mJ(Note2)
dv/dt Peak Diode Recovery dv/dt5.0V/ns(Note3)
PD Power Dissipation (TO-220, TO-3PN)230W@ TA=25
PD Power Dissipation (TO-220F, TO-3PF)48W@ TA=25
TJTstg Operating Junction and Storage Temperature Range15055 to 150
TL Maximum Temperature for Soldering300
Thermal Characteristics (No FullPAK)
RJC Junction-to-Case0.54/W
RJA Junction-to-Ambient62.5/W
Thermal Characteristics (FullPAK)
RJC Junction-to-Case2.6/W
RJA Junction-to-Ambient62.5/W
OFF Characteristics
VDSS Drain to Source Breakdown Voltage500VVGS=0V, ID=250A
BVDSS/ TJ Bvdss Temperature CoefficientV/ID=250uA, Reference250.6
IDSS Drain to Source Leakage Current10AVDS =500V, VGS= 0V, Tj= 25
IDSS Drain to Source Leakage Current100AVDS =400V, VGS= 0V, Tj= 125
IGSS(F) Gate to Source Forward Leakage100nAVGS=+30V
IGSS(R) Gate to Source Reverse Leakage-100nAVGS=-30V
ON Characteristics
RDS(ON) Drain-to-Source On- Resistance0.28VGS=10V, ID=10A(Note4)0.23
VGS(TH) Gate Threshold Voltage4.0VVDS = VGS, ID= 250A(Note4)2.0
gfs Forward Transconductance12SVDS=20V, ID =10A(Note4)
Dynamic Characteristics
Rg Gate resistance1.5f = 1.0MHz
Ciss Input Capacitance1920pFVGS = 0V VDS = 25V f = 1.0MHz
Coss Output Capacitance290pF
Crss Reverse Transfer Capacitance18pF
Switching Characteristics
td(ON) Turn-on Delay Time33nsID =20A VDD = 250V VGS = 10V RG =20
tr Rise Time75ns
td(OFF) Turn-Off Delay Time91ns
tf Fall Time83ns
Qg Total Gate Charge56nCID=20A VDD=400V VGS = 10V
Qgs Gate to Source Charge13nC
Qgd Gate to Drain (Miller)Charge20nC
Source-Drain Diode Characteristics
IS Continuous Source Current (Body Diode)20ATC=25 C
ISM Maximum Pulsed Current (Body Diode)80A
VSD Diode Forward Voltage1.2VIS=20A, VGS=0V(Note4)
trr Reverse Recovery Time536nsIS=20A, Tj = 25C dIF/dt=100A/us, VGS=0V
Qrr Reverse Recovery Charge5668nC
Irrm Reverse Recovery Current21.1A

2412110943_Minos-K2837-MNS_C42411365.pdf

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