High Voltage Power Transistor Minos MD24N50 with Enhanced Avalanche Energy and Low Conduction Losses

Key Attributes
Model Number: MD24N50
Product Custom Attributes
Drain To Source Voltage:
500V
Current - Continuous Drain(Id):
24A
Operating Temperature -:
-55℃~+150℃@(Tj)
RDS(on):
180mΩ@10V,10A
Gate Threshold Voltage (Vgs(th)):
2V
Reverse Transfer Capacitance (Crss@Vds):
25pF@25V
Number:
1 N-channel
Input Capacitance(Ciss):
3.5nF@25V
Pd - Power Dissipation:
320W
Gate Charge(Qg):
72nC@10V
Mfr. Part #:
MD24N50
Package:
TO-3PN
Product Description

Product Overview

The MD24N50 is a silicon N-Channel Enhanced Power MOSFET designed for high-performance applications. Leveraging advanced MOSFET technology, it offers reduced conduction losses, improved switching performance, and enhanced avalanche energy. This transistor is an ideal choice for Switch Mode Power Supplies (SMPS), high-speed switching, and general-purpose applications.

Product Attributes

  • Brand: MNS (www.mns-kx.com)
  • Material: Silicon N-Channel
  • Certifications: RoHS product

Technical Specifications

ParameterRatingUnitsNotes
VDS (Drain-to-Source Voltage)500V
RDS(ON) (Drain-to-Source On-Resistance)<230m@VGS=10V, ID=24A (Typ:180m)
ID (Continuous Drain Current)24A@ Ta=25
ID (Continuous Drain Current)15.8A@ TC = 100 C
IDM (Pulsed Drain Current)100ANote1
VGS (Gate-to-Source Voltage)30V
EAS (Single Pulse Avalanche Energy)1500mJNote2
dv/dt (Peak Diode Recovery dv/dt)5.0V/nsNote3
PD (Power Dissipation - TO-3PN)320W@ Ta=25
PD (Power Dissipation - TO-3PF)62.5W@ Ta=25
TJ, Tstg (Operating Junction and Storage Temperature Range)-55 to 150
TL (Maximum Temperature for Soldering)300
RJC (Junction-to-Case - TO-3PN)0.39/W
RJA (Junction-to-Ambient - TO-3PN)62.5/W
RJC (Junction-to-Case - TO-3PF)2.0/W
RJA (Junction-to-Ambient - TO-3PF)62.5/W
BVDSS (Drain to Source Breakdown Voltage)500VVGS=0V, ID=250A
IDSS (Drain to Source Leakage Current)<10AVDS=500V, VGS= 0V, Tj = 25
IDSS (Drain to Source Leakage Current)<100AVDS=400V, VGS= 0V, Tj = 125
IGSS(F) (Gate to Source Forward Leakage)<100nAVGS=+30V
IGSS(R) (Gate to Source Reverse Leakage)>-100nAVGS=-30V
RDS(ON) (Drain-to-Source On-Resistance)0.18 - 0.28VGS=10V, ID=10A (Note4)
VGS(TH) (Gate Threshold Voltage)2.0 - 4.0VVDS = VGS, ID = 250A (Note4)
gfs (Forward Transconductance)12SVDS=20V, ID =10A (Note4)
Rg (Gate Resistance)1.3f = 1.0MHz
Ciss (Input Capacitance)3500PFVGS = 0V, VDS= 25V, f = 1.0MHz
Coss (Output Capacitance)350PF
Crss (Reverse Transfer Capacitance)25PF
td(ON) (Turn-on Delay Time)38nsID =24A, VDD= 250V, VGS= 10V, RG =20
tr (Rise Time)75ns
td(OFF) (Turn-Off Delay Time)99ns
tf (Fall Time)83ns
Qg (Total Gate Charge)72nCID =24A, VDD=400V, VGS = 10V
Qgs (Gate to Source Charge)17nC
Qgd (Gate to Drain Miller)Charge25nC
IS (Continuous Source Current - Body Diode)24ATC=25 C
ISM (Maximum Pulsed Current - Body Diode)100A
VSD (Diode Forward Voltage)1.0VIS=24A, VGS=0V(Note4)
Trr (Reverse Recovery Time)551nsIS=24A, Tj = 25C, dIF/dt=100A/us, VGS=0V
Qrr (Reverse Recovery Charge)7025nC
Irrm (Reverse Recovery Current)25.5A

2410122024_Minos-MD24N50_C6719387.pdf

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