Power MOSFET Minos MD23N50 with 5V per Nanosecond Peak Diode Recovery dv dt and 1200mJ Avalanche Energy

Key Attributes
Model Number: MD23N50
Product Custom Attributes
Drain To Source Voltage:
500V
Current - Continuous Drain(Id):
23A
RDS(on):
260mΩ@10V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
4V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
18pF
Number:
1 N-channel
Input Capacitance(Ciss):
1.92nF@25V
Pd - Power Dissipation:
230W
Gate Charge(Qg):
56nC@10V
Mfr. Part #:
MD23N50
Package:
TO-3P
Product Description

Product Description

The MD23N50 is a silicon N-Channel Enhanced Power MOSFET designed using advanced MOSFET technology. This technology reduces conduction losses, improves switching performance, and enhances avalanche energy. It is suitable for applications such as Switch Mode Power Supplies (SMPS), high-speed switching, and general-purpose use.

Product Attributes

  • Brand: MNS (www.mns-kx.com)
  • Material: Silicon N-Channel
  • Certifications: RoHS product

Technical Specifications

SymbolParameterTest ConditionsRatingUnits
General Features
VDSDrain-to-Source Voltage500V
RDS(ON)On-ResistanceVGS=10V, ID=23A<260m
IDContinuous Drain CurrentTC = 100 C12.6A
IDMPulsed Drain Current(Note1)80A
VGSGate-to-Source Voltage30V
EASSingle Pulse Avalanche Energy(Note2)1200mJ
dv/dtPeak Diode Recovery dv/dt(Note3)5.0V/ns
PDPower Dissipation (TO-220, TO-3PN)@ Ta=25230W
PDPower Dissipation (TO-220F, TO-3PF)@ Ta=2548W
TJ, TstgOperating Junction and Storage Temperature Range55 to 150
TLMaximum Temperature for SolderingTO-3P300
Thermal Characteristics (No FullPAK)
RJCJunction-to-Case0.54/W
RJAJunction-to-Ambient62.5/W
Thermal Characteristics (FullPAK)
RJCJunction-to-Case2.6/W
RJAJunction-to-Ambient62.5/W
OFF Characteristics
VDSSDrain to Source Breakdown VoltageVGS=0V, ID=250A500V
BVDSS/ TJBvdss Temperature CoefficientID=250uA, Reference250.6V/
IDSSDrain to Source Leakage CurrentVDS=500V, VGS= 0V, Tj = 2510A
IDSSDrain to Source Leakage CurrentVDS=400V, VGS= 0V, Tj = 125100A
IGSS(F)Gate to Source Forward LeakageVGS=+30V100nA
IGSS(R)Gate to Source Reverse LeakageVGS=-30V-100nA
ON Characteristics
RDS(ON)Drain-to-Source On-ResistanceVGS=10V, ID=10A(Note4)0.26
VGS(TH)Gate Threshold VoltageVDS = VGS, ID = 250A(Note4)2.0 - 4.0V
gfsForward TransconductanceVDS=20V, ID=10A(Note4)12S
Dynamic Characteristics
RgGate resistancef = 1.0MHz1.5
CissInput CapacitanceVGS= 0V, VDS= 25V, f = 1.0MHz1920PF
CossOutput Capacitance290PF
CrssReverse Transfer Capacitance18pF
Switching Characteristics
td(ON)Turn-on Delay TimeID =23A, VDD= 250V, VGS= 10V, RG =2033ns
trRise Time75ns
td(OFF)Turn-Off Delay Time91ns
tfFall Time83ns
QgTotal Gate ChargeID=23A, VDD=400V, VGS = 10V56nC
QgsGate to Source Charge13nC
QgdGate to Drain (Miller)Charge20nC
Source-Drain Diode Characteristics
ISContinuous Source Current (Body Diode)TC=25 C23A
ISMMaximum Pulsed Current (Body Diode)80A
VSDDiode Forward VoltageIS=23A, VGS=0V(Note4)1.2V
TrrReverse Recovery TimeIS=23A, Tj = 25C, dIF/dt=100A/us, VGS=0V536ns
QrrReverse Recovery Charge5668nC
IrrmReverse Recovery Current21.1A

2410122012_Minos-MD23N50_C2980278.pdf

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