Nexperia PUMD30 115 transistor providing 100 milliamp output current in small footprint SMD packages
Product Overview
The PEMD30 and PUMD30 are NPN/PNP double resistor-equipped transistors (RET) designed for surface-mounted device (SMD) applications. These transistors feature built-in bias resistors (R1 = 2.2 k, R2 = open), which reduce component count, simplify circuit design, and lower pick-and-place costs. They are suitable for low-current peripheral driving, control of IC inputs, and switching loads, offering a cost-saving alternative for certain applications. Available in SOT666 and SOT363 packages, these devices provide an output current capability of 100 mA per transistor.
Product Attributes
- Brand: Philips Semiconductors
- Type: NPN/PNP double resistor-equipped transistors (RET)
- Resistor Configuration: R1 = 2.2 k, R2 = open
- Package Type: Surface-Mounted Device (SMD) plastic packages
- Origin: Made in Hong Kong, Malaysia, or China (depending on marking code)
Technical Specifications
| Symbol | Parameter | Conditions | Min | Typ | Max | Unit | Notes |
|---|---|---|---|---|---|---|---|
| Per transistor; for the PNP transistor with negative polarity | |||||||
| VCEO | Collector-emitter voltage | Open base | - | - | 50 | V | |
| IO | Output current | - | - | 100 | mA | ||
| R1 | Bias resistor 1 (input) | 1.54 | 2.2 | 2.86 | k | ||
| VCBO | Collector-base voltage | Open emitter | - | - | 50 | V | In accordance with the Absolute Maximum Rating System (IEC 60134) |
| VCEO | Collector-emitter voltage | Open base | - | - | 50 | V | In accordance with the Absolute Maximum Rating System (IEC 60134) |
| VEBO | Emitter-base voltage | Open collector | - | - | 5 | V | In accordance with the Absolute Maximum Rating System (IEC 60134) |
| IO | Output current | - | - | 100 | mA | In accordance with the Absolute Maximum Rating System (IEC 60134) | |
| ICM | Peak collector current | Single pulse; tp 1 ms | - | - | 100 | mA | In accordance with the Absolute Maximum Rating System (IEC 60134) |
| Total power dissipation | |||||||
| Ptot | Total power dissipation | Tamb 25 C | - | - | 200 | mW | SOT363 [1]; Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. |
| Ptot | Total power dissipation | Tamb 25 C | - | - | 200 | mW | SOT666 [1][2]; Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Reow soldering is the only recommended soldering method. |
| Ptot | Total power dissipation | Tamb 25 C | - | - | 300 | mW | Per device; SOT363 [1]; Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. |
| Ptot | Total power dissipation | Tamb 25 C | - | - | 300 | mW | Per device; SOT666 [1][2]; Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Reow soldering is the only recommended soldering method. |
| Tstg | Storage temperature | -65 | - | +150 | C | In accordance with the Absolute Maximum Rating System (IEC 60134) | |
| Tj | Junction temperature | - | - | 150 | C | In accordance with the Absolute Maximum Rating System (IEC 60134) | |
| Tamb | Ambient temperature | -65 | - | +150 | C | In accordance with the Absolute Maximum Rating System (IEC 60134) | |
| Thermal characteristics | |||||||
| Per transistor | |||||||
| Rth(j-a) | Thermal resistance from junction to ambient | In free air; SOT363 [1] | - | - | 625 | K/W | Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. |
| Rth(j-a) | Thermal resistance from junction to ambient | In free air; SOT666 [1][2] | - | - | 625 | K/W | Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Reow soldering is the only recommended soldering method. |
| Per device | |||||||
| Rth(j-a) | Thermal resistance from junction to ambient | In free air; SOT363 [1] | - | - | 416 | K/W | Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. |
| Rth(j-a) | Thermal resistance from junction to ambient | In free air; SOT666 [1][2] | - | - | 416 | K/W | Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Reow soldering is the only recommended soldering method. |
| Characteristics (Tamb = 25 C unless otherwise specied) | |||||||
| Per transistor; for the PNP transistor with negative polarity | |||||||
| ICBO | Collector-base cut-off current | VCB = 50 V; IE = 0 A | - | - | 100 | nA | |
| ICEO | Collector-emitter cut-off current | VCE = 30 V; IB = 0 A | - | - | 1 A | ||
| ICEO | Collector-emitter cut-off current | VCE = 30 V; IB = 0 A; Tj = 150 C | - | - | 50 | A | |
| IEBO | Emitter-base cut-off current | VEB = 5 V; IC = 0 A | - | - | 100 | nA | |
| hFE | DC current gain | VCE = 5 V; IC = 20 mA | 30 | - | - | ||
| VCEsat | Collector-emitter saturation voltage | IC = 10 mA; IB = 0.5 mA | - | - | 150 | mV | |
| R1 | Bias resistor 1 (input) | 1.54 | 2.2 | 2.86 | k | ||
| Cc | Collector capacitance | VCB = 10 V; IE = ie = 0 A; f = 1 MHz | - | - | 2.5 | pF | TR1 (NPN) |
| Cc | Collector capacitance | VCB = 10 V; IE = ie = 0 A; f = 1 MHz | - | - | 3 | pF | TR2 (PNP) |
| Product Types & Packages | |||||||
| Type number | Package Name | Description | Version | ||||
| PEMD30 | SOT666 | Plastic surface-mounted package; 6 leads | |||||
| PUMD30 | SOT363 | SC-88 plastic surface-mounted package; 6 leads | |||||
| Ordering Information | |||||||
| Type number | Package | Description | Packing quantity | Notes | |||
| PEMD30 | SOT666 | 2 mm pitch, 8 mm tape and reel | 3000 | -315 | |||
| PEMD30 | SOT666 | 4 mm pitch, 8 mm tape and reel | 4000 | -115 | |||
| PUMD30 | SOT363 | 4 mm pitch, 8 mm tape and reel; T1 | 8000 | -115 | |||
| PUMD30 | SOT363 | 4 mm pitch, 8 mm tape and reel; T2 | 10000 | -125 | |||
2410121745_Nexperia-PUMD30-115_C461152.pdf
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