Power MOSFET NH NTH068N068C N-Channel Enhancement Mode for Printed Circuit Board Control Applications

Key Attributes
Model Number: NTH068N068C
Product Custom Attributes
Configuration:
-
Drain To Source Voltage:
68V
Current - Continuous Drain(Id):
91A
RDS(on):
6.8mΩ@10V
Operating Temperature -:
-55℃~+175℃
Gate Threshold Voltage (Vgs(th)):
4V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
207pF
Number:
1 N-channel
Output Capacitance(Coss):
225pF
Input Capacitance(Ciss):
4.723nF
Pd - Power Dissipation:
136W
Gate Charge(Qg):
76nC@34V
Mfr. Part #:
NTH068N068C
Package:
TO-220C
Product Description

Product Overview

The NTH068N068C is an N-Channel Enhancement Mode Power MOSFET from Guangdong Niuhang Specification Electronic Technology Co., Ltd. Designed for high efficiency and speed, it features low RDS(ON), low gate charge, and high EAS for enhanced reliability. This MOSFET is ideal for demanding applications such as DC/DC converters, synchronous rectification, high-frequency circuits, battery management systems (BMS), motor drives, printed circuit board control, automotive electronics, and Uninterruptible Power Supplies (UPS). Its robust design ensures performance in various power management scenarios.

Product Attributes

  • Brand: Niuhang (NH Trademark)
  • Model: NTH068N068C
  • Channel Type: N-Channel
  • Mode: Enhancement Mode
  • Package: TO-220C
  • Certifications: RoHS COMPLIANT, Pb-Frce
  • Origin: Guangdong Niuhang Specification Electronic Technology Co., Ltd.

Technical Specifications

Specification Value Unit
Drain-Source Voltage (VDS) 68 V
Continuous Drain Current (ID) @ Ta=25 91 A
Continuous Drain Current (ID) @ Ta=100 73 A
Drain Current-Pulsed (IDM) 364 A
Maximum Power Dissipation (PD) @ Ta=25 136 W
Power Dissipation Derating Factor (DF) @ Ta=100 68 W
Power Dissipation Derating Factor (DF) Above 25 0.91 W/
Junction Temperature (TJ) -55 to 175
Storage Temperature Range (TSTD) -55 to 175
Avalanche Current, Single Pulse (IAS) (L=0.5 mH) 40 A
Single Pulse Avalanche Energy (EAS) (L=0.5 mH, VDD=34 V) 400 mJ
Thermal Resistance Junction To Ambient (RJA) (Still Air) 62.0 /W
Thermal Resistance Junction-Case (RJC) (1 in 2 FR-4 Board, 2oz) 1.1 /W
Drain-Source Breakdown Voltage (BV DSS) @ ID=250uA, VGS=0V 68 V
Bvdss Temperature Coefficient 0.065 V/
Drain-Source Leakage Current (IDSS) @ VDS=68V, VGS=0V 1 uA
Gate-Body Leakage Current (IGSS) @ VGS=20V, VDS=0V 100 nA
Forward Transconductance (gfs) @ ID=20A, VDS=5V 33 S
Gate Threshold Voltage (VGS(TH)) @ ID=250uA 2.0 - 4.0 V
Drain-Source On Resistance (RDS(ON)) @ ID=20A, VGS=10V 5.20 - 6.80 m
Drain-Source On Resistance (RDS(ON)) @ ID=20A, VGS=4.5V 5.98 - 9.11 m
Gate Resistance (Rg) @ Freq.=1MHz 0.70
Input Capacitance (Ciss) @ VDS=34V 4723.0 pF
Output Capacitance (Coss) @ VGS=0V 225.0 pF
Reverse Transfer Capacitance (Crss) @ F=1MHz 207.0 pF
Turn-On Delay Time (td(on)) @ VDS=34V 15.0 ns
Turn-On Rise Time (tr) @ VGS=10V 33.0 ns
Turn-Off Delay Time (td(off)) @ RL=1.2 59.0 ns
Turn-Off Rise Time (tf) @ RG=10 12.0 ns
Total Gate Charge (Qg) @ VDS=34V 76.0 nC
Gate-Source Charge (Qgs) @ VGS=10V 16.0 nC
Gate-Drain Charge (Qgd) @ ID=20A 20.0 nC
Max. Diode Forward Current (Is) 91 A
Max. Pulsed Forward Current (Ism) 318 A
Diode Forward Voltage (VsD) @ ID=20A, VGS=0V 0.85 - 1.2 V
Reverse Recovery Time (trr) @ ID=20A, di/dt=100 A/us 29 ns
Reverse Recovery Charge (Qrr) @ VGS=10V, VDS=34V 35.0 uC
Weight 2.057 Grams
Weight 0.07255 Ounce

2411011351_NH-NTH068N068C_C41784115.pdf

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