1200V Silicon Carbide MOSFET SG2M027120LJ Low On Resistance Temperature Independent Switching Losses

Key Attributes
Model Number: SG2M027120LJ
Product Custom Attributes
Mfr. Part #:
SG2M027120LJ
Package:
TO-247-4L
Product Description

Product Overview

The SG2M027120LJ is a 1200V Silicon Carbide (SiC) Power MOSFET designed for high-speed switching applications. It offers very low switching losses, fully controllable dv/dt, and high blocking voltage with low on-resistance. The device features a fast intrinsic diode with low reverse recovery charge (Qrr) and temperature-independent turn-off switching losses. Its benefits include reduced cooling effort and requirements, improved efficiency, increased power density, and the ability to operate at higher system switching frequencies. This RoHS compliant and halogen-free component is suitable for applications such as on-board chargers/PFC, EV battery chargers, booster/DC-DC converters, and switch-mode power supplies.

Product Attributes

  • Brand: TriQSiCTM
  • Material: Silicon Carbide (SiC)
  • Channel Type: N Channel Enhancement
  • Package Type: TO-247-4L
  • Certifications: Halogen free, RoHS compliant
  • Manufacturer:

Technical Specifications

Type VDS IDS (TC = 25, Rth (j-c),max) RDS(on), typ (VGS = 18V, ID = 40A, TJ = 25) TJ,max Marking Package
SG2M027120LJ 1200V 85A 26m 175 SG2M027120LJ TO-247-4L
Symbol Parameter Value Unit Test Conditions Note
VDS,max Drain source voltage 1200 V VGS = 0V, ID = 100A
VGS,max Gate source voltage -10 /+22 V Absolute maximum values Note1
VGSpulse Gate-source voltage,max. transient voltage -10 /+25 V tp0.5s, D0.01
VGSop Gate source voltage -4 /+18 V Recommended operational values
ID Continuous drain current 85 A VGS = 18V, TC = 25C Fig.19
ID Continuous drain current 60 A VGS = 18V, TC = 100C
ID(pulse) Pulsed drain current 170 A Pulse width tP limited by TJ,max Fig.22
PD Power dissipation 341 W TC= 25C,TJ = 175C Fig.20
TJ ,Tstg Operating Junction and storage temperature -55 to +175 C
TL Soldering temperature 260 C 1.6mm (0.063) from case for 10s
TM Mounting torque 1.8 Nm lbf-in M3 or 6-32 screw
V(BR)DSS Drain-source breakdown voltage 1200 V VGS = 0V, ID = 100A
VGS(th) Gate threshold voltage 2.3 - 3.6 V VDS = VGS, ID = 11mA Fig.11
VGS(th) Gate threshold voltage 2.1 V VDS = VGS, ID = 11mA TJ = 175C
IDSS Zero gate voltage drain current 1 - 10 A VDS = 1200V, VGS = 0V
IGSS Gate source leakage current 100 nA VGS = 18V, VDS = 0V
RDS(on) Current drain-source on-state resistance 30 - 45 m VGS = 15V, ID = 40A Fig.4,5, 6
RDS(on) Current drain-source on-state resistance 49 m VGS = 15V, ID = 40A, TJ = 175C
RDS(on) Current drain-source on-state resistance 26 - 36 m VGS = 18V, ID = 40A
RDS(on) Current drain-source on-state resistance 47 m VGS = 18V, ID = 40A, TJ = 175C
gfs Transconductance 30 S VDS = 20V, ID = 40A Fig.7
gfs Transconductance 27 S VDS = 20V, ID = 40A, TJ = 175C
Rg,int Internal gate resistance 3 VAC = 25mV, f = 1MHz, open drain
Ciss Input capacitance 2280 pF VDS = 1000V, VGS = 0V TJ = 25C, VAC = 25mV f = 100kHz Fig.17, 18
Coss Output capacitance 129 pF
Crss Reverse capacitance 6.6 pF
Eoss Coss stored energy 71 J Fig.16
Qgs Gate source charge 24 nC VDS = 800V, VGS = -4/+18V ID = 40A Fig.12
Qgd Gate drain charge 22 nC
Qg Gate charge 73 nC
Eon Turn on switching energy 378 J VDS = 800V, VGS = -4/+18V ID = 40A, Rg = 2.5 L = 16.7H Fig.26
Eoff Turn off switching energy 108 J
tdon Turn on delay time 15 ns Fig.27
tr Rise time 16 ns
tdoff Turn off delay time 31 ns
tf Fall time 9 ns
VSD Diode forward voltage 3.8 V VGS = -4V, ISD = 20A Fig.8,9, 10
VSD Diode forward voltage 3.3 V VGS = -4V, ISD = 20A TJ = 175C
IS Continuous diode forward current 82 A VGS = -4V, Tc = 25C Note2
trr Reverse recovery time 35 ns VR = 800V, VGS = -4V ISD = 40A di/dt = 2827A/s TJ = 175C
Qrr Reverse recovery charge 681 nC
Irrm Peak reverse recovery current 33 A

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